Inqubo ye-PCBA: PCBA=Umhlangano Webhodi Lesifunda Ephrintiwe, okusho ukuthi, ibhodi le-PCB elingenalutho lidlula engxenyeni engenhla ye-SMT, bese lidlulela kuyo yonke inqubo ye-plug-in ye-DIP, ebizwa ngokuthi inqubo ye-PCBA.
Inqubo Nobuchwepheshe
Ukujoyina i-Jigsaw:
1. Uxhumano lwe-V-CUT: usebenzisa isihlukanisi ukuhlukanisa, le ndlela yokuhlukanisa ine-cross-section ebushelelezi futhi ayinayo imiphumela emibi ezinqubweni ezilandelayo.
2. Sebenzisa i-pinhole (imbobo yesitembu) uxhumano: Kuyadingeka ukucabangela i-burr ngemva kokuphuka, nokuthi ingabe izophazamisa ukusebenza okuzinzile kwe-fixture emshinini we-Bonding kwinqubo ye-COB.Kufanele futhi kubhekwe ukuthi izothinta ithrekhi ye-plug-in nokuthi izothinta yini umhlangano.
Izinto ze-PCB:
1. Ama-PCB ekhadibhodi afana ne-XXXP, FR2, kanye ne-FR3 athintwa kakhulu izinga lokushisa.Ngenxa yama-coefficients ahlukene okunweba okushisayo, kulula ukubangela amabhamuza, ukuwohloka, ukuphuka, nokuchitheka kwesikhumba sethusi ku-PCB.
2. Ama-PCB ebhodi le-Glass fiber board afana ne-G10, G11, FR4, ne-FR5 awathintwa kancane izinga lokushisa le-SMT kanye nezinga lokushisa le-COB ne-THT.
Uma i-COB engaphezu kwamabili.I-SMT.Izinqubo zokukhiqiza ze-THT ziyadingeka ku-PCB eyodwa, uma kucatshangelwa ikhwalithi nezindleko, i-FR4 ifanele imikhiqizo eminingi.
Umthelela wezintambo zomugqa wokuxhuma iphedi kanye nendawo yembobo ekukhiqizeni i-SMT:
Izintambo zokuxhuma izintambo zephedi kanye nendawo yokuphuma emigodini kunethonya elikhulu ekuvuthweni kwe-soldering ye-SMT, ngoba imigqa yokuxhuma i-pad engafanele futhi ngokusebenzisa izimbobo ingase idlale indima "yokweba" i-solder, idonsa i-solder ewuketshezi ku-oven reflow Go ( i-siphon kanye nesenzo se-capillary ku-fluid).Izimo ezilandelayo zilungele ikhwalithi yokukhiqiza:
1. Yehlisa ububanzi bomugqa wokuxhuma iphedi:
Uma ungekho umkhawulo womthamo wamanje wokuthwala kanye nosayizi wokukhiqiza we-PCB, ububanzi obukhulu bomugqa wokuxhuma iphedi bungu-0.4mm noma 1/2 ububanzi bephedi, obungaba buncane.
2. Kungcono kakhulu ukusebenzisa imigqa yokuxhuma emincane enobude obungekho ngaphansi kuka-0.5mm (ububanzi bungabi ngaphezu kuka-0.4mm noma ububanzi bungabi ngaphezu kuka-1/2 wobubanzi bephedi) phakathi kwamaphedi axhunywe kumapheshana e-conductive endaweni enkulu ( njengezindiza eziphansi, izindiza ezisebenza ngogesi).
3. Gwema ukuxhuma izintambo ezisuka eceleni noma ekhoneni zibe pad.Okungcono kakhulu, intambo yokuxhuma ingena phakathi nendawo ngemuva kwephedi.
4. Ngezimbobo kufanele kugwenywe ngangokunokwenzeka kumaphedi wezingxenye ze-SMT noma eduze ngqo namaphedi.
Isizathu siwukuthi: imbobo edlula ku-pad izoheha i-solder emgodini futhi yenze i-solder ishiye i-solder joint;umgodi oseduze ngqo nephedi, noma ngabe kukhona ukuvikelwa okuhle kwamafutha aluhlaza (ekukhiqizeni kwangempela, ukuphrinta kwamafutha aluhlaza ku-PCB impahla engenayo ayilungile Ezimweni eziningi), kungase kubangele ukushisa ukushisa, okuzoshintsha ijubane lokungena lokungena kwamajoyinti e-solder, libangela isenzakalo se-tombstoneng ezingxenyeni ze-chip, futhi livimbele ukwakheka okujwayelekile kwamalunga e-solder ezimweni ezinzima.
Ukuxhumana phakathi kwembobo ye-via kanye nephedi kungcono kakhulu ulayini wokuxhuma omncane onobude obungekho ngaphansi kuka-0.5mm (ububanzi abukho ngaphezu kuka-0.4mm noma ububanzi obungengaphezu kuka-1/2 wobubanzi bephedi).
Isikhathi sokuthumela: Feb-22-2023