Kuyini ukubukeka nokwakheka kwebhodi lesifunda eliphrintiwe?

Ukwakheka

Iibhodi lesifunda samanjeikakhulukazi yakhiwe ngokulandelayo
Ulayini nephethini (Iphethini): Umugqa usetshenziswa njengethuluzi lokuqhuba phakathi koqobo.Ekwakhiweni, indawo enkulu yethusi izoklanywa njengesisekelo kanye nesendlalelo sokuhlinzeka ngamandla.Imigqa nemidwebo yenziwa ngesikhathi esisodwa.
Isendlalelo se-Dielectric: sisetshenziselwa ukugcina ukufakwa phakathi kwemigqa nezingqimba, ezivame ukwaziwa ngokuthi i-substrate.
Ngezimbobo / izimbobo: Ngezimbobo zingenza izingqimba ezingaphezu kwezimbili zesekethe zihambisane, ezinkulu ngokusebenzisa izimbobo zisetshenziswa njengengxenye yama-plug-ins, futhi izimbobo ezingadluli (nPTH) zivame ukusetshenziswa njengezikhwebu ezingaphezulu ezisetshenziselwa ukulungisa izikulufu ngesikhathi sokuhlanganisa.I-Solder resistant/Solder Mask: Akuzona zonke izindawo zethusi ezidinga ukudla izingxenye zikathayela, ngakho-ke izindawo ezingewona amathini zizophrintwa ngongqimba lwezinto (imvamisa i-epoxy resin) ehlukanisa indawo yethusi ekudleni ithini. .Ukujikeleza okufushane phakathi kwemigqa engadli ithini.Ngokwezinqubo ezahlukene, ihlukaniswe ngamafutha aluhlaza, amafutha abomvu namafutha aluhlaza okwesibhakabhaka.
Isikrini sikasilika (Isikrini se-Legend/Marking/Silk): Lena ingxenye engabalulekile.Umsebenzi oyinhloko ukumaka igama kanye nohlaka lwesikhundla sengxenye ngayinye ebhodini lesifunda, elilungele ukulungiswa nokuhlonza ngemva komhlangano.
I-Surface Finish: Njengoba indawo yethusi i-oxidized kalula endaweni evamile, ayikwazi ukufakwa ithini (i-solderability empofu), ngakho izovikelwa endaweni yethusi edinga ukudla ithini.Izindlela zokuvikela zihlanganisa i-spray tin (HASL), igolide lekhemikhali (ENIG), isiliva (Immersion Silver), ithini (Immersion Tin), i-organic solder protection agent (OSP), indlela ngayinye inezinzuzo kanye nokubi, ngokuhlangene okubizwa ngokuthi ukwelashwa kwendawo.

Ingaphandle

Ibhodi elingenalutho (elingenazo izingxenye kulo) libuye libizwe ngokuthi “Ibhodi Lezintambo Eziphrintiwe (PWB)”.I-base plate yebhodi ngokwayo yenziwe nge-insulating material engagobeki kalula.Izinto eziyisiyingi ezincanyana ezingabonakala phezulu ziyi-copper foil.Ekuqaleni, ucwecwe lwethusi lwalumboza lonke ibhodi, kodwa ingxenye yalo yaqoshwa ngesikhathi senqubo yokukhiqiza, futhi ingxenye esele yaba umjikelezo omncane onjenge-mesh..Le migqa ibizwa ngokuthi amaphethini omqhubi noma izintambo, futhi isetshenziselwa ukuhlinzeka ngoxhumano lukagesi ezingxenyeni eziku-PCB.
Ngokuvamile umbala we-PCB uluhlaza noma unsundu, okuwumbala we-solder mask.Kuwungqimba oluvikelayo oluvikelayo, olungavikela ucingo lwethusi, luvimbele ukujikeleza okufushane okubangelwa i-wave soldering, futhi longe inani le-solder.Isikrini sikasilika siphinde siphrintwe kumaski e-solder.Ngokuvamile, umbhalo nezimpawu (iningi elimhlophe) ziphrintwa kulokhu ukuze kuboniswe indawo yengxenye ngayinye ebhodini.Uhlangothi lokuphrinta kwesikrini lubizwa nangokuthi uhlangothi lwenganekwane.
Emkhiqizweni wokugcina, ama-circuits ahlanganisiwe, ama-transistors, ama-diode, izingxenye ze-passive (njengama-resistors, ama-capacitor, izixhumi, njll.) nezinye izingxenye ze-elekthronikhi ezihlukahlukene zifakwe kuwo.Ngokuxhunywa kwezintambo, ukuxhumana kwesignali ye-elekthronikhi nemisebenzi efanele ingakhiwa.