Kuyini ukubukeka nokwakheka kwebhodi lesifunda eliphrintiwe?

Ukwakheka

Iibhodi lesifunda samanjeikakhulukazi yakhiwe ngokulandelayo
Ulayini nephethini (Iphethini): Umugqa usetshenziswa njengethuluzi lokuqhuba phakathi koqobo. Ekwakhiweni, indawo enkulu yethusi izoklanywa njengesisekelo kanye nesendlalelo sokuhlinzeka ngamandla. Imigqa nemidwebo yenziwa ngesikhathi esisodwa.
Isendlalelo se-Dielectric: sisetshenziselwa ukugcina ukufakwa phakathi kwemigqa nezingqimba, ngokuvamile ezaziwa ngokuthi i-substrate.
Ngezimbobo / izimbobo: Ngezimbobo zingenza izingqimba ezingaphezu kwezimbili zesekethe zihambisane, ezinkulu ngokusebenzisa izimbobo zisetshenziswa njengengxenye yama-plug-ins, futhi izimbobo ezingadluli (nPTH) zivame ukusetshenziswa njengezikhwebu ezingaphezulu ezisetshenziselwa ukulungisa izikulufu ngesikhathi sokuhlanganisa.I-Solder resistant/Solder Mask: Akuzona zonke izindawo zethusi ezidinga ukudla izingxenye zikathayela, ngakho-ke izindawo ezingezona ithini zizophrintwa ngongqimba lwezinto (imvamisa. epoxy resin) ehlukanisa indawo yethusi ekudleni ithini. Ukujikeleza okufushane phakathi kwemigqa engadli ithini. Ngokwezinqubo ezahlukene, ihlukaniswe ngamafutha aluhlaza, amafutha abomvu namafutha aluhlaza okwesibhakabhaka.
Isikrini sikasilika (Isikrini se-Legend/Marking/Silk): Lena ingxenye engabalulekile. Umsebenzi oyinhloko ukumaka igama kanye nohlaka lwesikhundla sengxenye ngayinye ebhodini lesifunda, elilungele ukulungiswa nokuhlonza ngemva komhlangano.
I-Surface Finish: Njengoba indawo yethusi i-oxidized kalula endaweni evamile, ayikwazi ukufakwa ithini (i-solderability empofu), ngakho izovikelwa endaweni yethusi edinga ukudla ithini. Izindlela zokuvikela zihlanganisa i-spray tin (HASL), igolide lekhemikhali (ENIG), isiliva (Immersion Silver), ithini (Immersion Tin), i-organic solder protection agent (OSP), indlela ngayinye inezinzuzo kanye nokubi, ngokuhlangene okubizwa ngokuthi ukwelashwa kwendawo.

Ingaphandle

Ibhodi elingenalutho (elingenazo izingxenye kulo) libuye libizwe ngokuthi “Ibhodi Lezintambo Eziphrintiwe (PWB)”. I-base plate yebhodi ngokwayo yenziwe nge-insulating material engagobeki kalula. Izinto eziyisiyingi ezincanyana ezingabonakala phezulu ziyi-copper foil. Ekuqaleni, ucwecwe lwethusi lwalumboza lonke ibhodi, kodwa ingxenye yalo yaqoshwa phakathi nenqubo yokukhiqiza, futhi ingxenye esele yaba umjikelezo omncane onjenge-mesh. . Le migqa ibizwa ngokuthi amaphethini omqhubi noma izintambo, futhi isetshenziselwa ukuhlinzeka ngoxhumano lukagesi ezingxenyeni eziku-PCB.
Ngokuvamile umbala we-PCB uluhlaza noma unsundu, okuwumbala we-solder mask. Kuwungqimba oluvikelayo oluvikelayo, olungavikela ucingo lwethusi, luvimbele ukujikeleza okufushane okubangelwa i-wave soldering, futhi longe inani le-solder. Isikrini sikasilika siphinde siphrintwe kumaski e-solder. Ngokuvamile, umbhalo nezimpawu (iningi elimhlophe) ziphrintwa kulokhu ukuze kuboniswe indawo yengxenye ngayinye ebhodini. Uhlangothi lokuphrinta kwesikrini lubizwa nangokuthi uhlangothi lwenganekwane.
Emkhiqizweni wokugcina, ama-circuits ahlanganisiwe, ama-transistors, ama-diode, izingxenye ze-passive (njengama-resistors, ama-capacitor, izixhumi, njll.) nezinye izingxenye ze-elekthronikhi ezihlukahlukene zifakwe kuwo. Ngokuxhunywa kwezintambo, ukuxhumana kwesignali ye-elekthronikhi nemisebenzi efanele ingakhiwa.