Amabhodi esekethe aphrintiwe (ama-PCB) abe yingxenye ebalulekile yobuchwepheshe besimanje, anika amandla zonke izisetshenziswa zikagesi esithembele kuzo nsuku zonke.Nakuba izingxenye nemisebenzi ye-PCB yaziwa kahle, kunesici esisodwa esibalulekile esivame ukunganakwa kodwa esibalulekile ekusebenzeni kwayo: i-substrate.Kulokhu okuthunyelwe kwebhulogi, sizohlola ukuthi i-substrate iyini ku-PCB nokuthi kungani idlala indima ebaluleke kangaka.
Iyini i-substrate ku-PCB?
Ama-substrates, avame ukubizwa ngokuthi ama-PCB substrates noma izinto zebhodi, ayisisekelo sokukhweza izingxenye zikagesi ze-PCB.Iwungqimba olungaqhubeki olunikeza ukusekela kwesakhiwo futhi lusebenza njengongqimba lukagesi lokuhlukanisa phakathi kwezingqimba zethusi ebhodini lesekethe.I-substrate esetshenziswa kakhulu ekwenziweni kwe-PCB i-glass fibre reinforced epoxy laminate, evame ukubizwa nge-FR4.
Incazelo yezinto eziyisisekelo:
1. Usekelo lwemishini:
Umsebenzi oyinhloko we-substrate ukuhlinzeka ngosizo lwemishini yezingxenye ezibucayi ezifakwe ebhodini.Iqinisekisa ukuzinza nokuqina kwe-PCB, ukuyivumela ukuthi imelane nengcindezi yangaphandle, ukudlidliza kanye noshintsho lwezinga lokushisa.Ngaphandle kwe-substrate eqinile, ubuqotho besakhiwo se-PCB bungaba sengozini, kubeke engcupheni ukusebenza nokuphila isikhathi eside kwensiza kagesi.
2. Ukufakwa kukagesi:
I-substrate isebenza njenge-insulator kagesi phakathi kwezingqimba zethusi eziqhutshwayo ku-PCB.Zivimbela izikhindi zikagesi kanye nokuphazamiseka phakathi kwezingxenye ezahlukene nemikhondo, engabangela ukungasebenzi noma ukulimala.Ukwengeza, izakhiwo ze-dielectric ze-substrate zisiza ukugcina ubuqotho kanye nekhwalithi yezimpawu zikagesi ezigeleza ngaphakathi kwebhodi.
3. Ukukhipha ukushisa:
Izingxenye ze-elekthronikhi zikhiqiza ukushisa ngokungenakugwenywa ngesikhathi sokusebenza.Ama-substrates adlala indima ebalulekile ekukhipheni kahle ukushisa kude nezingxenye ukuze azigcine esesimweni esikahle sokusebenza.Izinto ezithile ze-substrate, njengama-PCB angumongo wensimbi noma izitsha zobumba, zithuthukise ukuqhutshwa kokushisa, okuvumela ukudluliswa kokushisa okuphumelelayo kanye nokunciphisa ingozi yokushisa ngokweqile.
4. Ubuqotho besignali:
Izinto ezibonakalayo ze-substrate zithinta kakhulu ubuqotho besignali ye-PCB.Isibonelo, ukulawulwa kwe-impedance kuqinisekisa ukugeleza okungaguquguquki kwamasignali ama-high-frequency ngaphandle kokunciphisa.I-dielectric engaguquki kanye nokulahleka kwe-tangent ye-substrate material ithinta i-impedance yesici nokusebenza kolayini wokudlulisa, ekugcineni kunquma ukusebenza okuphelele nokuthembeka kwe-PCB.
Nakuba i-substrate ingase ingabonakali ngaso sonke isikhathi, idlala indima ebalulekile ekusebenzeni, ukuqina nokuthembeka kwebhodi lesifunda eliphrintiwe.Ukubaluleka kwe-substrate akukwazi ukugcizelelwa ngokweqile, kusukela ekunikezeni ukusekelwa kwemishini kanye nokuhlukaniswa kukagesi ukuze kube lula ukuchithwa kokushisa nokugcina ubuqotho besignali.Ukuqonda ukubaluleka kokukhetha okubalulekile kwe-substrate efanele kanye nezakhiwo zayo kubalulekile kubaklami be-PCB, abakhiqizi nabathanda izinto zikagesi.Ngokuqonda indima yama-substrates, singaqinisekisa ukuthuthukiswa ngempumelelo nokusebenza kwemishini kagesi ethuthuke kakhulu futhi esebenza kahle esikhathini esizayo.
Isikhathi sokuthumela: Jul-26-2023