I-PCBA isifinyezo se-Printed Circuit Board Assembly ngesiNgisi, okusho ukuthi, ibhodi le-PCB elingenalutho lidlula engxenyeni engenhla ye-SMT, noma yonke inqubo ye-DIP plug-in, ebizwa ngokuthi i-PCBA.Lena indlela evame ukusetshenziswa e-China, kuyilapho indlela evamile e-Europe naseMelika i-PCB' A, engeza “'”, ebizwa ngokuthi isisho esisemthethweni.
Ibhodi lesifunda eliphrintiwe, elaziwa nangokuthi ibhodi lesifunda eliphrintiwe, ibhodi lesifunda eliphrintiwe, livame ukusebenzisa isifinyezo sesiNgisi se-PCB (Ibhodi lesifunda eliphrintiwe), liyingxenye ebalulekile ye-elekthronikhi, ukusekelwa kwezingxenye ze-elekthronikhi, kanye nomhlinzeki wokuxhumanisa isifunda sezingxenye ze-elekthronikhi.Ngenxa yokuthi yenziwa ngokusebenzisa amasu okunyathelisa nge-elekthronikhi, ibizwa ngokuthi ibhodi lesifunda "eliphrintiwe".Ngaphambi kokuvela kwamabhodi wesifunda aphrintiwe, ukuxhumana phakathi kwezingxenye ze-elekthronikhi kuncike ekuxhumekeni okuqondile kwezintambo ukuze zenze isifunda esiphelele.Manje, iphaneli yesekethe ikhona kuphela njengethuluzi lokuhlola elisebenzayo, futhi ibhodi lesekethe eliphrintiwe seliphenduke isikhundla esiphezulu embonini yezogesi.Ekuqaleni kwekhulu lama-20, ukuze kube lula ukukhiqizwa kwemishini ye-elekthronikhi, ukunciphisa izintambo phakathi kwezingxenye ze-elekthronikhi, nokunciphisa izindleko zokukhiqiza, abantu baqala ukutadisha indlela yokufaka izintambo ngokuphrinta.Eminyakeni engu-30 edlule, onjiniyela bebelokhu behlongoza ngokuqhubekayo ukufaka amakhondatha ensimbi kuma-substrates afaka izintambo ukuze kufakwe izintambo.Okwaphumelela kakhulu kwaba ngo-1925, uCharles Ducas wase-United States waphrinta amaphethini wesekethe kuma-substrates avikelayo, wabe esesungula ngempumelelo ama-conductor okufaka izintambo nge-electroplating.
Kuze kube ngu-1936, uPaul Eisler wase-Austrian (uPaul Eisler) washicilela ubuchwepheshe befilimu ye-foil e-United Kingdom.Wasebenzisa ibhodi lesifunda elinyathelisiwe emsakazweni;Kufakwe ngempumelelo ilungelo lobunikazi lendlela yokufutha nokufaka izintambo (I-Patent No. 119384).Phakathi kwalokhu okubili, indlela kaPaul Eisler ifana kakhulu namabhodi esifunda anyathelisiwe anamuhla.Le ndlela ibizwa ngokuthi indlela yokukhipha, okuwukukhipha insimbi engadingekile;kuyilapho indlela kaCharles Ducas noMiyamoto Kinosuke iwukwengeza kuphela insimbi edingekayo.Izintambo zibizwa ngokuthi indlela yokwengeza.Noma kunjalo, ngenxa yokuthi izingxenye ze-elekthronikhi ngaleso sikhathi zenza ukushisa okukhulu, ama-substrates amabili kwakunzima ukuwasebenzisa ndawonye, ngakho-ke kwakungekho ukusetshenziswa okusebenzayo okusemthethweni, kodwa futhi kwenza ubuchwepheshe besifunda obuphrintiwe buqhubekele phambili.
Umlando
Ngo-1941, i-United States yapenda unamathisele wethusi ku-talc ukuze kwenziwe izintambo zokwenza ama-proximity fuses.
Ngo-1943, abantu baseMelika basebenzisa lobu buchwepheshe kakhulu emisakazweni yezempi.
Ngo-1947, ama-epoxy resins aqala ukusetshenziswa njengama-substrates okukhiqiza.Ngaso leso sikhathi, i-NBS yaqala ukutadisha ubuchwepheshe bokukhiqiza obufana namakhoyili, ama-capacitor, nama-resistors akhiwe ubuchwepheshe besekethe obuphrintiwe.
Ngo-1948, i-United States yabona ngokusemthethweni ukusungulwa kokusetshenziswa kwezentengiso.
Kusukela ngawo-1950, ama-transistors anesizukulwane sokushisa esiphansi athathe indawo yamashubhu e-vacuum, futhi ubuchwepheshe bebhodi lesifunda eliphrintiwe sebuqale ukusetshenziswa kabanzi.Ngaleso sikhathi, ubuchwepheshe be-etching foil babuyinto evamile.
Ngo-1950, iJapane yasebenzisa upende oyisiliva wokufaka izintambo ezisekelweni zengilazi;kanye ne-copper foil yokufakwa kwezintambo ephepheni le-phenolic substrates (CCL) eyenziwe nge-phenolic resin.
Ngo-1951, ukubonakala kwe-polyimide kwenza ukumelana nokushisa kwe-resin kuqhubekele phambili, futhi ama-substrates e-polyimide nawo akhiqizwa.
Ngo-1953, i-Motorola yasungula indlela ephindwe kabili ehlanganiswe ngembobo.Le ndlela iphinde isetshenziswe kumabhodi wesifunda anezingqimba eziningi kamuva.
Ngawo-1960, ngemva kokuba ibhodi lesifunda eliphrintiwe lisetshenziswe kabanzi iminyaka engu-10, ubuchwepheshe balo bakhula kakhulu.Njengoba ibhodi le-Motorola elinamaceleni amabili liphumile, amabhodi esekethe aphrintiwe amaningi aqala ukuvela, okwandisa isilinganiso sezintambo endaweni ye-substrate.
Ngo-1960, u-V. Dahlgreen wenza ibhodi lesifunda eliphrintiwe eliguquguqukayo ngokunamathisela ifilimu ye-foil yensimbi ephrintiwe ngesekethe epulasitiki ye-thermoplastic.
Ngo-1961, i-Hazeltine Corporation yase-United States yabhekisela endleleni ye-electroplating ngokusebenzisa-hole ukukhiqiza amabhodi anezingqimba eziningi.
Ngo-1967, i-"Plated-up technology", enye yezindlela zokwakha izendlalelo, yanyatheliswa.
Ngo-1969, i-FD-R yakha amabhodi esekethe aphrintiwe avumelana nezimo ane-polyimide.
Ngo-1979, uPactel washicilela "indlela yePactel", enye yezindlela zokwengeza ungqimba.
Ngo-1984, i-NTT yathuthukisa i- "Copper Polyimide Method" yamasekhethi amafilimu amancane.
Ngo-1988, i-Siemens yathuthukisa ibhodi lesifunda eliphrintiwe le-Microwiring Substrate.
Ngo-1990, i-IBM yathuthukisa ibhodi lesifunda eliphrintiwe elithi "Surface Laminar Circuit" (Surface Laminar Circuit, SLC) eliphrintiwe.
Ngo-1995, iMatsushita Electric yakha ibhodi lesifunda eliphrintiwe le-ALIVH.
Ngo-1996, u-Toshiba wenza ibhodi lesifunda eliphrintiwe le-B2it.
Isikhathi sokuthumela: Feb-24-2023