ZiyiniPCBizindinganiso zokuhlola ukubukeka?
1. Ukupakisha: isikhwama somoya esingenambala se-vacuum packaging, esine-desiccant ngaphakathi, sipakishwe ngokuqinile
2. Ukuphrinta isikrini sikasilika: Ukuphrinta kwesikrini sikasilika kwezinhlamvu nezimpawu ebusweni be-PCB kufanele kucace futhi kucace, futhi umbala kufanele uhambisane nemithethonqubo, ngaphandle kokuphrinta okuphindaphindiwe, ukuphrinta okungekho, ukuphrinta okuningi, ukuchezuka kwendawo, kanye ukuphrinta kabi.
3. Indawo yebhodi enqenqemeni yebhodi: Hlola ukuthi akhona yini amabala, ama-sundries, imigodi, izinsalela ze-tin slag endaweni ye-PCB;kungakhathaliseki ukuthi ibhodi lebhodi liyanwetshwa futhi livezwe ku-substrate;Kukhona izingqimba, njll.
4. Amakhondatha: Awekho ama-short circuit, i-open circuit, i-copper eveziwe ku-conductor, i-foil yethusi entantayo, izintambo ezingeziwe, njll. . Umunwe wegolide: ukucwebezela, amabhamu/amabhamuza, amabala, ucwecwe lwekhopha oluntantayo, ukumbozwa kwendawo, ama-burrs, ukunamathela kwe-plating, njll.
5. Izimbobo: Hlola ngokumelene neqoqo langaphambilini lama-PCB amahle ukuze uhlole ukuthi azikho yini izimbobo zokubhoboza, izimbobo zokubhoboza eziningi, izimbobo ezivinjiwe, nokuchezuka kwemigodi.Imaski ye-Solder: Ungasebenzisa amanzi okugeza ibhodi ukuze usule ngesikhathi sokuhlolwa ukuze uhlole ukunamathela kwayo, uhlole ukuthi izowa yini, ingabe kukhona ama-bubbles, ukuthi kukhona yini into yokulungisa, njll. Umbala we-mask solder kufanele uhlangabezane nemithethonqubo. .
6. Ukumaka: uhlamvu, indawo eyireferensi, inguqulo yemodeli, isilinganiso somlilo/UL.okujwayelekile, isahluko sokuhlola ugesi, iplate yegama lomkhiqizi, usuku lokukhiqiza, njll.
7. Isilinganiso sikasayizi: linganisa ukuthi ingabe usayizi wangempela we-PCB engenayo unjengoba kucacisiwe ngohlelo.
Ukuhlolwa kwe-Warpage noma i-curvature:
8. Ukuhlolwa kokuthengiselana: Thatha ingxenye ye-PCB ukuze uthole i-soldering yangempela, futhi uhlole ukuthi izingxenye zingathengiswa kalula yini.
Isikhathi sokuthumela: Apr-12-2023