Ukuze kuzuzwe ukusebenza okuhle kakhulu kwamasekethe e-elekthronikhi, ukuhlelwa kwezingxenye kanye nomzila wezintambo kubaluleke kakhulu.Ukuze uklame aPCBngekhwalithi enhle nezindleko eziphansi.Izimiso ezijwayelekile ezilandelayo kufanele zilandelwe:
isakhiwo
Okokuqala, cabangela ubukhulu be-PCB.Uma usayizi we-PCB mkhulu kakhulu, imigqa ephrintiwe izoba yinde, i-impedance izokwanda, ikhono lokulwa nomsindo lizokwehla, futhi izindleko zizokhuphuka;uma kuncane kakhulu, ukuchithwa kokushisa ngeke kube kuhle, futhi imigqa eseduze izophazamiseka kalula.Ngemva kokunquma usayizi we-PCB, thola indawo yezingxenye ezikhethekile.Ekugcineni, ngokusho kweyunithi esebenzayo yesifunda, zonke izingxenye zesifunda zibekwe.
Lapho kunqunywa indawo yezingxenye ezikhethekile, izimiso ezilandelayo kufanele zibhekwe:
① Fushanisa ukuxhumana phakathi kwezingxenye zefrikhwensi ephezulu ngangokunokwenzeka, bese uzama ukunciphisa amapharamitha azo wokusabalalisa kanye nokuphazanyiswa kozibuthe kagesi.Izingxenye ezisengozini yokuphazamiseka azikwazi ukusondelana kakhulu, futhi izingxenye zokufaka nezokukhiphayo kufanele zigcinwe kude ngangokunokwenzeka.
② Kungase kube khona umehluko omkhulu ongaba khona phakathi kwezinye izingxenye noma izintambo, futhi ibanga phakathi kwazo kufanele linyuswe ukuze kugwenywe ukujikeleza okufushane ngengozi okubangelwa ukukhipha.Izingxenye ezine-voltage ephezulu kufanele zihlelwe ezindaweni ezingafinyeleleki kalula ngesandla ngesikhathi sokulungisa iphutha.
③ Izingxenye ezinesisindo esingaphezu kuka-15 g kufanele zilungiswe nabakaki bese zishiselwa.Lezo zingxenye ezinkulu, ezinzima, futhi ezikhiqiza ukushisa okukhulu akufanele zifakwe ebhodini eliphrintiwe, kodwa kufanele zifakwe ku-chassis phansi plate yawo wonke umshini, futhi inkinga yokukhipha ukushisa kufanele icatshangelwe.Izingxenye ezishisayo kufanele zigcinwe kude nezingxenye zokushisa.
④ Mayelana nesakhiwo sezingxenye ezilungisekayo njengama-potentiometer, amakhoyili e-inductable alungisekayo, ama-variable capacitor, namaswishi amancane, izidingo zesakhiwo zawo wonke umshini kufanele zicatshangelwe.Uma ilungiswa ngaphakathi komshini, kufanele ibekwe ebhodini eliphrintiwe lapho ilungele ukulungiswa khona;uma ilungiswa ngaphandle komshini, indawo yayo kufanele ishintshwe ukuze ihambisane nendawo ye-knob yokulungisa kuphaneli ye-chassis.
Ngokusho kweyunithi esebenzayo yesekethe, lapho ubeka zonke izingxenye zesekethe, le migomo elandelayo kufanele ihambisane:
①Hlela indawo yeyunithi ngayinye yesekethe esebenzayo ngokuya ngokugeleza kwesekethe, ukuze isakhiwo silungele ukujikeleza kwesignali, futhi isiqondiso sesiginali sigcinwe silingana ngangokunokwenzeka.
② Thatha izingxenye ezibalulekile zesekethe ngayinye esebenzayo njengesikhungo bese wenza isakhiwo esisizungezile.Izingxenye kufanele zidwetshwe ngokulinganayo, ngobunono futhi zihlangane ku-PCB, zinciphise futhi zifinyeze umkhondo nokuxhumana phakathi kwezingxenye.
③ Kumasekhethi asebenza kumafrikhwensi aphezulu, imingcele yokusabalalisa phakathi kwezingxenye kufanele inakwe.Ngokuvamile, isifunda kufanele sihlele izingxenye ngokuhambisana ngangokunokwenzeka.Ngale ndlela, akuyona nje inhle, kodwa futhi kulula ukuyihlanganisa nokushisela, futhi kulula ukuyikhiqiza ngobuningi.
④Izingxenye ezisonqenqemeni lwebhodi lesifunda ngokuvamile azikho ngaphansi kuka-2 mm kude nonqenqema lwebhodi lesifunda.Isimo esihle kakhulu sebhodi lesifunda siwunxande.Ukubukeka kwesilinganiso kungu-3:2 noma 4:3.Lapho ubukhulu bebhodi lesifunda bukhulu kuno-200 mm✖150 mm, amandla omshini webhodi lesifunda kufanele acatshangelwe.
izintambo
Izimiso zimi kanje:
① Izintambo ezisetshenziswa kumatheminali okokufaka nokokukhiphayo kufanele zigweme ukuqhelana futhi zihambisane nezinye ngangokunokwenzeka.Kungcono ukwengeza ucingo oluphansi phakathi kwemigqa ukuze ugweme ukuhlangana kwempendulo.
② Ububanzi obuncane bocingo lwebhodi lesifunda oluphrintiwe bunqunywa ngokuyinhloko amandla okunamathela phakathi kwentambo ne-substrate evikelayo kanye nenani lamanje eligeleza kuzo.
Uma ubukhulu becwecwe lethusi bungu-0.05 mm nobubanzi bungu-1 kuye ku-15 mm, izinga lokushisa ngeke libe ngaphezu kuka-3 °C ngokusebenzisa i-current engu-2 A, ngakho ububanzi bocingo buyi-1.5 mm ukuhlangabezana nezidingo.Kumasekhethi ahlanganisiwe, ikakhulukazi ama-circuits edijithali, ububanzi bocingo obungu-0.02-0.3 mm buvame ukukhethwa.Yiqiniso, ngokusemandleni akho, sebenzisa izintambo ezibanzi, ikakhulukazi izintambo zamandla neziphansi.
Ukuhlukaniswa okuncane kwama-conductor kunqunywa ngokuyinhloko ukumelana nokwehlukanisa okubi kakhulu phakathi kwemigqa kanye ne-voltage yokuphuka.Kumasekethe ahlanganisiwe, ikakhulukazi amasekethe edijithali, inqobo nje uma inqubo ivumela, i-pitch ingaba mncane njengo-5-8 um.
③ Amakhona ezintambo eziphrintiwe ngokuvamile anomumo we-arc, kuyilapho ama-engeli angakwesokudla noma ama-engeli afakiwe azophazamisa ukusebenza kukagesi kumasekhethi anemvamisa ephezulu.Ngaphezu kwalokho, zama ukugwema ukusebenzisa indawo enkulu ye-foil yethusi, ngaphandle kwalokho, uma ushiswa isikhathi eside, kulula ukubangela ukuba i-foil yethusi ikhule futhi iwe.Uma kufanele kusetshenziswe indawo enkulu ye-foil yethusi, kungcono ukusebenzisa umumo wegridi, okuzuzisa ukuqeda igesi eguquguqukayo ekhiqizwa ukunamathela phakathi kwe-foil yethusi kanye ne-substrate lapho kushisa.
Iphedi
Imbobo emaphakathi yephedi inkulu kancane kunobubanzi bomthofu wedivayisi.Uma iphedi inkulu kakhulu, kulula ukwenza i-virtual solder joint.Ububanzi obungaphandle bephedi ngokuvamile abukho ngaphansi kuka-d+1.2 mm, lapho u-d engububanzi bembobo yomthofu.Kumasekhethi edijithali anomthamo omkhulu, ubukhulu obuncane bephedi bungaba ngu-d+1.0 mm.
PCB board board ukuhlela software
Isikhathi sokuthumela: Mar-13-2023