Ukuze kuzuzwe ukusebenza okuhle kakhulu kwamasekethe e-elekthronikhi, ukuhlelwa kwezingxenye kanye nomzila wezintambo kubaluleke kakhulu. Ukuze uklame aPCBngekhwalithi enhle nezindleko eziphansi. Izimiso ezijwayelekile ezilandelayo kufanele zilandelwe:
isakhiwo
Okokuqala, cabangela ubukhulu be-PCB. Uma usayizi we-PCB mkhulu kakhulu, imigqa ephrintiwe izoba yinde, i-impedance izokwanda, ikhono lokulwa nomsindo lizokwehla, futhi izindleko zizokhuphuka; uma kuncane kakhulu, ukuchithwa kokushisa ngeke kube kuhle, futhi imigqa eseduze izophazamiseka kalula. Ngemva kokunquma usayizi we-PCB, thola indawo yezingxenye ezikhethekile. Ekugcineni, ngokusho kweyunithi esebenzayo yesifunda, zonke izingxenye zesifunda zibekwe ngaphandle.
Lapho kunqunywa indawo yezingxenye ezikhethekile, izimiso ezilandelayo kufanele zibhekwe:
① Fushanisa ukuxhumana phakathi kwezingxenye zefrikhwensi ephezulu ngangokunokwenzeka, bese uzama ukunciphisa amapharamitha azo wokusabalalisa kanye nokuphazanyiswa kozibuthe kagesi. Izingxenye ezisengozini yokuphazamiseka azikwazi ukusondelana kakhulu, futhi izingxenye zokufaka nezokukhiphayo kufanele zigcinwe kude ngangokunokwenzeka.
② Kungase kube khona umehluko omkhulu ongaba khona phakathi kwezinye izingxenye noma izintambo, futhi ibanga phakathi kwazo kufanele linyuswe ukuze kugwenywe ukujikeleza okufushane ngengozi okubangelwa ukukhipha. Izingxenye ezine-voltage ephezulu kufanele zihlelwe ezindaweni ezingafinyeleleki kalula ngesandla ngesikhathi sokulungisa iphutha.
③ Izingxenye ezinesisindo esingaphezu kuka-15 g kufanele zilungiswe nabakaki bese zishiselwa. Lezo zingxenye ezinkulu, ezinzima, futhi ezikhiqiza ukushisa okukhulu akufanele zifakwe ebhodini eliphrintiwe, kodwa kufanele zifakwe ku-chassis phansi plate yawo wonke umshini, futhi inkinga yokukhipha ukushisa kufanele icatshangelwe. Izingxenye ezishisayo kufanele zigcinwe kude nezingxenye zokushisa.
④ Mayelana nesakhiwo sezingxenye ezilungisekayo njengama-potentiometer, amakhoyili e-inductable alungisekayo, ama-variable capacitor, namaswishi amancane, izidingo zesakhiwo zawo wonke umshini kufanele zicatshangelwe. Uma ilungiswa ngaphakathi komshini, kufanele ibekwe ebhodini eliphrintiwe lapho ilungele ukulungiswa khona; uma ilungiswa ngaphandle komshini, indawo yayo kufanele ishintshwe ukuze ihambisane nendawo ye-knob yokulungisa kuphaneli ye-chassis.
Ngokusho kweyunithi esebenzayo yesekethe, lapho ubeka zonke izingxenye zesekethe, le migomo elandelayo kufanele ihambisane:
①Hlela indawo yeyunithi ngayinye yesekethe esebenzayo ngokuya ngokugeleza kwesekethe, ukuze isakhiwo silungele ukujikeleza kwesignali, futhi isiqondiso sesiginali sigcinwe silingana ngangokunokwenzeka.
② Thatha izingxenye ezibalulekile zesekethe ngayinye esebenzayo njengendawo emaphakathi futhi wenze isakhiwo esisizungezile. Izingxenye kufanele zidwetshwe ngokulinganayo, ngobunono futhi zihlangane ku-PCB, zinciphise futhi zifinyeze umkhondo nokuxhumana phakathi kwezingxenye.
③ Kumasekhethi asebenza kumafrikhwensi aphezulu, imingcele yokusabalalisa phakathi kwezingxenye kufanele inakwe. Ngokuvamile, isifunda kufanele sihlele izingxenye ngokuhambisana ngangokunokwenzeka. Ngale ndlela, akuyona nje inhle, kodwa futhi kulula ukuyihlanganisa nokushisela, futhi kulula ukuyikhiqiza ngobuningi.
④Izingxenye ezisonqenqemeni lwebhodi lesifunda ngokuvamile azikho ngaphansi kuka-2 mm kude nonqenqema lwebhodi lesifunda. Isimo esihle kakhulu sebhodi lesifunda siwunxande. Ukubukeka kwesilinganiso kungu-3:2 noma 4:3. Lapho ubukhulu bebhodi lesifunda bukhulu kuno-200 mm✖150 mm, amandla omshini webhodi lesifunda kufanele acatshangelwe.
izintambo
Izimiso zimi kanje:
① Izintambo ezisetshenziswa kumatheminali okokufaka nokokukhiphayo kufanele zigweme ukuqhelana futhi zihambisane nezinye ngangokunokwenzeka. Kungcono ukwengeza ucingo oluphansi phakathi kwemigqa ukuze ugweme ukuhlangana kwempendulo.
② Ububanzi obuncane bocingo lwebhodi lesifunda oluphrintiwe bunqunywa ngokuyinhloko amandla okunamathela phakathi kwentambo ne-substrate evikelayo kanye nenani lamanje eligeleza kuzo.
Uma ubukhulu becwecwe lethusi bungu-0.05 mm nobubanzi bungu-1 kuye ku-15 mm, izinga lokushisa ngeke libe ngaphezu kuka-3 °C ngokusebenzisa i-current engu-2 A, ngakho ububanzi bocingo buyi-1.5 mm ukuhlangabezana nezidingo. Kumasekhethi ahlanganisiwe, ikakhulukazi ama-circuits edijithali, ububanzi bocingo obungu-0.02-0.3 mm buvame ukukhethwa. Yiqiniso, ngokusemandleni akho, sebenzisa izintambo ezibanzi, ikakhulukazi izintambo zamandla neziphansi.
Ukuhlukaniswa okuncane kwama-conductor kunqunywa ngokuyinhloko ukumelana nokwehlukanisa okubi kakhulu phakathi kwemigqa kanye ne-voltage yokuphuka. Kumasekethe ahlanganisiwe, ikakhulukazi amasekethe edijithali, inqobo nje uma inqubo ivumela, i-pitch ingaba mncane njengo-5-8 um.
③ Amakhona ezintambo eziphrintiwe ngokuvamile anomumo we-arc, kuyilapho ama-engeli angakwesokudla noma ama-engeli afakiwe azophazamisa ukusebenza kukagesi kumasekhethi anemvamisa ephezulu. Ngaphezu kwalokho, zama ukugwema ukusebenzisa indawo enkulu ye-foil yethusi, ngaphandle kwalokho, uma ushiswa isikhathi eside, kulula ukubangela ukuba i-foil yethusi ikhule futhi iwe. Uma kufanele kusetshenziswe indawo enkulu ye-foil yethusi, kungcono ukusebenzisa umumo wegridi, okuzuzisa ukuqeda igesi eguquguqukayo ekhiqizwa ukunamathela phakathi kwe-foil yethusi kanye ne-substrate lapho kushisa.
Iphedi
Imbobo emaphakathi yephedi inkulu kancane kunobubanzi bomthofu wedivayisi. Uma iphedi inkulu kakhulu, kulula ukwenza i-virtual solder joint. Ububanzi obungaphandle D bephedi ngokuvamile abukho ngaphansi kuka-d+1.2 mm, lapho u-d engububanzi bembobo yomthofu. Kumasekhethi edijithali anomthamo omkhulu, ububanzi obuncane bephedi bungaba ngu-d+1.0 mm.
PCB board board ukuhlela software
Isikhathi sokuthumela: Mar-13-2023