Siyakwamukela kuwebhusayithi yethu.

Yiziphi ulwazi oluyisisekelo lokungena kwe-PCB design?

Imithetho yesakhiwo se-PCB:

1. Ngaphansi kwezimo ezijwayelekile, zonke izingxenye kufanele zihlelwe endaweni efanayo yebhodi lesifunda.Kuphela uma izingxenye zesendlalelo esiphezulu ziminyene kakhulu lapho amanye amadivayisi anobude obukhawulelwe kanye nokukhiqiza ukushisa okuphansi, njengezihluthulelo ze-chip, ama-chip capacitor, nama-Chip ICs abekwe esendlalelo esingezansi.

2. Ngaphansi kwesisekelo sokuqinisekisa ukusebenza kukagesi, izingxenye kufanele zibekwe kugridi futhi zihlelwe ngokufana komunye nomunye noma zibheke phezulu ukuze zibe zinhle futhi zihle.Ngokuvamile, izingxenye azivunyelwe ukugqagqana;izingxenye kufanele zihlelwe ngokuhlangene, futhi izingxenye kufanele zihlelwe kuwo wonke ukwakheka.Ukusatshalaliswa okufanayo kanye nokuminyana okungaguquki.

3. Isikhala esincane phakathi kwamaphethini ephedi asondelene ezingxenyeni ezahlukene ebhodini lesekethe kufanele sibe ngaphezu kuka-1MM.

4. Ibanga elisuka emaphethelweni ebhodi lesifunda ngokuvamile alikho ngaphansi kuka-2MM.Umumo ongcono kakhulu webhodi lesifunda uwunxande one-aspect ratio ye-3:2 noma 4:3.Uma usayizi webhodi lesifunda mkhulu kuno-200MM ngo-150MM, ibhodi lesifunda lingathwala amandla oMechanical.

pcb

Ukucatshangelwa kwe-PCB Design

(1) Gwema ukuhlela imigqa yesignali ebalulekile onqenqemeni lwe-PCB, njengewashi namasignali okusetha kabusha.

(2) Ibanga phakathi kocingo oluphansi lwe-chassis kanye nolayini wesignali okungenani ama-4 mm;gcina i-aspect ratio ye-chassis ground wire ngaphansi kuka-5:1 ukuze unciphise umthelela we-inductance.

(3) Sebenzisa umsebenzi we-LOCK ukuze ukhiye izisetshenziswa nezintambo okunqunyiwe ukuthi zimi kuphi, ukuze zingaphathwa kabi esikhathini esizayo.

(4) Ububanzi obuncane bocingo akumele bube ngaphansi kuka-0.2mm (8mil).Kumasekhethi aphrintiwe anokuminyana okuphezulu kanye nokunemba okuphezulu, ububanzi nesikhala sezintambo ngokuvamile singu-12mil.

(5) Izimiso 10-10 kanye 12-12 zingasetshenziswa ezintamboni phakathi kwezikhonkwane ze-IC zephakeji ye-DIP, okungukuthi, lapho izintambo ezimbili zidlula phakathi kwamaphini amabili, ububanzi bephedi bungasethwa ku-50mil, futhi ububanzi bomugqa nezikhala zomugqa zombili ziyi-10mil, lapho ucingo olulodwa kuphela ludlula phakathi kwezikhonkwane ezimbili, ububanzi bephedi bungasethwa bube ku-64mil, kanti ububanzi bomugqa nezikhala zomugqa zombili ziyi-12mil.

(6) Uma ububanzi bephedi bungu-1.5mm, ukuze ukwandise amandla okucwecwa kwephedi, ungasebenzisa iphedi elide eliyindilinga elinobude obungekho ngaphansi kuka-1.5mm nobubanzi obungu-1.5mm.

(7) Idizayini Uma imikhondo exhunywe kumaphedi incane, ukuxhumana phakathi kwamaphedi kanye nemikhondo kufanele kuklanywe ngendlela yokudonsa, ukuze amaphedi angabi lula ukuwacwecwa futhi imikhondo namaphedi akulula ukunqanyulwa.

 

(8) Lapho uklama izingqimba zethusi zendawo enkulu, kufanele kube namafasitela phezu kwezinsimbi zethusi, imigodi yokukhipha ukushisa kufanele yengezwe, futhi amafasitela kufanele aklanywe abe yisimo semeshi.

(9) Nciphisa ukuxhumana phakathi kwezingxenye zefrikhwensi ephezulu ngangokunokwenzeka ukuze unciphise amapharamitha azo wokusabalalisa kanye nokugxambukela kozibuthe kagesi.Izingxenye ezisengozini yokuphazamiseka azikwazi ukusondelana kakhulu, futhi izingxenye zokufaka nezokukhiphayo kufanele zigcinwe kude ngangokunokwenzeka.


Isikhathi sokuthumela: Apr-14-2023