Inqubo ethize yenqubo yebhodi lesifunda le-PCB

Inqubo yokukhiqiza ibhodi le-PCB ingahlukaniswa kancane ibe yizinyathelo eziyishumi nambili ezilandelayo.Inqubo ngayinye idinga ukukhiqizwa kwenqubo ehlukahlukene.Kumele kuqashelwe ukuthi ukugeleza kwenqubo yamabhodi anezakhiwo ezahlukene kuhlukile.Inqubo elandelayo ukukhiqizwa okuphelele kwe-PCB enezingqimba eziningi.ukugeleza kwenqubo;

Okokuqala.Isendlalelo sangaphakathi;ngokuyinhloko ekwenzeni isifunda sesendlalelo sangaphakathi sebhodi lesifunda le-PCB;inqubo yokukhiqiza ithi:
1. Ibhodi lokusika: ukusika i-substrate ye-PCB ibe usayizi wokukhiqiza;
2. Ukwelashwa kwangaphambili: hlanza ingaphezulu le-PCB substrate futhi ususe ukungcola okungaphezulu
3. Laminating film: namathisela ifilimu eyomile ebusweni be-PCB substrate ukuze ulungiselele ukudluliswa kwesithombe okulandelayo;
4. Ukuchayeka: Sebenzisa okokusebenza kokuchayeka ukuze uveze i-substrate enamathiselwe ifilimu enokukhanya kwe-ultraviolet, ukuze udlulisele isithombe se-substrate kwifilimu eyomile;
5. DE: I-substrate ngemva kokuchayeka iyathuthukiswa, iqoshwe, futhi ifilimu isuswe, bese kuqedwa ukukhiqizwa kwebhodi lesendlalelo sangaphakathi.
Okwesibili.Ukuhlolwa kwangaphakathi;ikakhulukazi ukuhlola nokulungisa amasekethe ebhodi;
1. I-AOI: I-AOI ye-optical scanning, engaqhathanisa isithombe sebhodi le-PCB nedatha yebhodi lomkhiqizo omuhle elifakiwe, ukuze kutholwe izikhala, ukudangala kanye nezinye izenzakalo ezimbi emfanekisweni webhodi;
2. I-VRS: Idatha yesithombe esibi etholwe yi-AOI izothunyelwa ku-VRS ukuze ilungiswe yizisebenzi ezifanele.
3. Intambo yokwengeza: Soda intambo yegolide esikhaleni noma esikhaleni ukuze uvimbele ukungasebenzi kukagesi;
Okwesithathu.Ukucindezela;njengoba igama lisho, amabhodi amaningi angaphakathi acindezelwa ebhodini elilodwa;
1. I-Browning: I-Browning ingakhuphula ukunamathela phakathi kwebhodi ne-resin, futhi ikhulise ukumanzisa kwendawo yethusi;
2. I-Riveting: Sika i-PP ibe amashidi amancane nosayizi ojwayelekile ukuze wenze ibhodi elingaphakathi kanye ne-PP ehambisanayo ihlangane
3. Ukugqagqana nokucindezela, ukudubula, ukugoqa, ukugoqa;
Okwesine.Ukubhoboza: ngokwezidingo zamakhasimende, sebenzisa umshini wokubhoboza ukuze ubhoboze izimbobo ezinobubanzi obuhlukene nobukhulu obuhlukene ebhodini, ukuze izimbobo phakathi kwamabhodi zisetshenziselwe ukucubungula okulandelayo kwama-plug-ins, futhi kungasiza ibhodi ukuba lihlakazeke. ukushisa;

Okwesihlanu, ithusi eliyinhloko;i-copper plating yezimbobo ezimboziwe zebhodi lesendlalelo sangaphandle, ukuze imigqa yesendlalelo ngasinye sebhodi iqhutshwe;
1. Ulayini wokuqothula: susa ama-burrs onqenqemeni lwembobo yebhodi ukuvimbela ukufakwa kwethusi okubi;
2. Umugqa wokukhipha iglue: susa insalela yeglue emgodini;ukuze kwandiswe ukunamathela ngesikhathi se-micro-etching;
3. Ithusi elilodwa (i-pth): I-Copper plating emgodini yenza isifunda sesendlalelo ngasinye se-conduction yebhodi, futhi ngesikhathi esifanayo kwandisa ukushuba kwethusi;
Okwesithupha, ungqimba lwangaphandle;ungqimba lwangaphandle lucishe lufane nenqubo yongqimba yangaphakathi yesinyathelo sokuqala, futhi inhloso yaso ukwenza kube lula inqubo yokulandelela ukwenza isifunda;
1. Ukwelashwa kwangaphambili: Hlanza ubuso bebhodi ngokukhetha, ukuxubha nokomisa ukuze ukwandise ukunamathela kwefilimu eyomile;
2. Laminating film: namathisela ifilimu eyomile ebusweni be-PCB substrate ukuze ulungiselele ukudluliswa kwesithombe okulandelayo;
3. Ukuchayeka: irradiate ngokukhanya kwe-UV ukuze wenze ifilimu eyomile ebhodini ibe yisimo se-polymerized ne-unpolymerized;
4. Ukuthuthukiswa: chitha ifilimu eyomile engazange yenziwe i-polymerized ngesikhathi senqubo yokuchayeka, ishiye igebe;
Okwesikhombisa, ithusi lesibili kanye ne-etching;i-copper plating yesibili, etching;
1. Ithusi lesibili: Iphethini ye-Electroplating, ithusi lamakhemikhali eliwela indawo engamboziwe ngefilimu eyomile emgodini;ngesikhathi esifanayo, ngokuqhubekayo ukwandisa conductivity kanye ukushuba zethusi, bese udlulela tin Plating ukuvikela ubuqotho wesifunda kanye izimbobo ngesikhathi etching;
2. I-SES: Faka ithusi elingezansi endaweni enamathiselwe yefilimu eyomile yongqimba yangaphandle (ifilimu emanzi) ngokusebenzisa izinqubo ezinjengokususwa kwefilimu, ukuqoshwa, nokukhumula ithini, futhi isekethe yongqimba yangaphandle manje isiqediwe;

Okwesishiyagalombili, ukumelana ne-solder: ingavikela ibhodi futhi ivimbele i-oxidation nezinye izenzakalo;
1. Pretreatment: pickling, ukugeza ultrasonic kanye nezinye izinqubo ukususa oxides ebhodini futhi andise roughness of the surface yethusi;
2. Ukuphrinta: Mboza izingxenye zebhodi le-PCB ezingadingi ukudayiswa ngoyinki wokumelana ne-solder ukuze udlale indima yokuvikela kanye nokwahlukanisa;
3. Ukubhaka kwangaphambili: ukomisa i-solvent ku-ink ye-solder ukumelana, futhi ngesikhathi esifanayo uqinisa uyinki ukuze uthole ukuchayeka;
4. Ukuchayeka: Ukwelapha inki ye-solder yokumelana nokukhanya kwe-UV, kanye nokwenza i-polymer yamangqamuzana aphezulu nge-photopolymerization;
5. Ukuthuthukiswa: susa isixazululo se-sodium carbonate ku-inki engasetshenzisiwe;
6. Ngemuva kokubhaka: ukuqinisa uyinki ngokugcwele;
Okwesishiyagalolunye, umbhalo;umbhalo ophrintiwe;
1. I-Pickling: Hlanza ingaphezulu lebhodi, susa i-oxidation yendawo ukuze uqinise ukunamathela koyinki wokunyathelisa;
2. Umbhalo: umbhalo ophrintiwe, olungele inqubo yokushisela elandelayo;
Okweshumi, i-OSP yokwelashwa komhlaba;uhlangothi lwepuleti yethusi elingenalutho oluzoshiselwa luboshwe ukuze lwenze ifilimu ephilayo ukuvimbela ukugqwala kanye ne-oxidation;
Eyeshumi nanye, ukwakha;isimo sebhodi esidingwa yikhasimende siyakhiqizwa, esilungele ikhasimende ukwenza ukubekwa nokuhlanganisa i-SMT;
Okweshumi nambili, ukuhlolwa kwe-flying probe;hlola isifunda sebhodi ukuze ugweme ukuphuma kwebhodi lesifunda esifushane;
Okweshumi nantathu, i-FQC;ukuhlolwa kokugcina, amasampula kanye nokuhlolwa okuphelele ngemva kokuphothula zonke izinqubo;
Okweshumi nane, ukupakishwa nokuphuma endaweni yokugcina izinto;vacuum-pakisha ibhodi le-PCB eliqediwe, pakisha bese uthumela, bese uqedela ukulethwa;