I-Immersion Gold Multilayer PCB Printed Circuit Board ene-SMT ne-DIP

Imininingwane Yomkhiqizo

Ulwazi Oluhlobene Olwengeziwe

1.I-SMT ingenye yezingxenye eziyisisekelo zezingxenye ze-elekthronikhi.Ibizwa ngokuthi i-surface Mount technology (noma ubuchwepheshe be-surface mount).Ihlukaniswe yaba awekho umkhondo noma imikhondo emifushane.Iwumhlangano wesifunda ohlanganiswa ngokufakwa kabusha kwe-soldering noma nge-dip soldering.Ubuchwepheshe futhi buwubuchwepheshe obuthandwa kakhulu kanye nenqubo embonini yokuhlanganisa i-electronic.
Izici: Ama-substrates ethu angasetshenziselwa ukunikezwa kwamandla, ukudluliswa kwesignali, ukuchithwa kokushisa, nokuhlinzekwa kwesakhiwo.
Izici: Ingakwazi ukumelana nezinga lokushisa kanye nesikhathi sokuphulukisa kanye ne-soldering.
I-flatness ihlangabezana nezidingo zenqubo yokukhiqiza.
Ifanele umsebenzi wokusebenza kabusha.
Ifanele inqubo yokukhiqiza ye-substrate.
Inani eliphansi le-dielectric kanye nokumelana okuphezulu.
Izinto ezisetshenziswa kakhulu zama-substrates omkhiqizo wethu zinempilo futhi azivumelani nemvelo ama-epoxy resins nama-phenolic resins, anezici ezinhle zokunqanda ilangabi, izici zokushisa, izici zemishini kanye ne-dielectric, kanye nezindleko eziphansi.
Okushiwo ngenhla ukuthi i-substrate eqinile iyisimo esiqinile.
Imikhiqizo yethu inama-substrates aguquguqukayo, angasetshenziswa ukonga isikhala, ukugoqa noma ukujika, ukunyakaza, futhi enziwe ngamashidi amancane kakhulu afaka i-insulating asebenza kahle imvamisa ephezulu.
Okubi ukuthi inqubo yokuhlanganisa inzima, futhi ayifanele izicelo ze-micro-pitch.
Ngicabanga ukuthi izici ze-substrate ziwumkhondo omncane kanye nezikhala, ukujiya okukhulu nendawo, ukuguquguquka okungcono kwe-thermal, izakhiwo eziqinile zemishini, nokuzinza okungcono.Ngicabanga ukuthi ubuchwepheshe bokubeka ku-substrate ukusebenza kukagesi, kukhona ukwethembeka, izingxenye ezijwayelekile.
Asigcini nje ngokuba nokusebenza okuzenzakalelayo nokudidiyelwe ngokugcwele, kodwa futhi sinesiqinisekiso esiphindwe kabili sokucwaningwa kwamabhuku okwenziwa ngesandla kanye nokuhlolwa komshini, futhi izinga lokuphasa lemikhiqizo liphezulu njengo-99.98%.
2.I-PCB iyingxenye ye-elekthronikhi ebaluleke kakhulu, futhi ayikho.Imvamisa, iphethini yokuqhuba eyenziwe ngamasekethe aphrintiwe, izakhi eziphrintiwe noma inhlanganisela yalokhu okubili ku-insulating material ngokusho komklamo onqunywe kusengaphambili ubizwa ngokuthi isekethe ephrintiwe.Iphethini ye-conductive ehlinzeka ngoxhumano lukagesi phakathi kwezingxenye ze-insulating substrate ibizwa ngokuthi ibhodi lesifunda eliphrintiwe (noma ibhodi lesifunda eliphrintiwe), okuwukusekelwa okubalulekile kwezingxenye ze-elekthronikhi kanye nesithwali esingathwala izingxenye.
Ngicabanga ukuthi sivamise ukuvula ikhibhodi yekhompuyutha ukuze sibone ifilimu ethambile (i-flexible insulating substrate) ephrintiwe nge-silver-white (i-silver paste) ihluzo ze-conductive kanye nemifanekiso yokuma.Ngenxa yokuthi lolu hlobo lwephethini lutholwa indlela yokuphrinta yesikrini esijwayelekile, leli bhodi lesifunda eliphrintiwe eliguquguqukayo lokunamathisela isiliva eliphrintiwe ibhodi lesifunda.Amabhodi wesekethe aphrintiwe kuma-motherboards ahlukahlukene ekhompiyutha, amakhadi ehluzo, amakhadi enethiwekhi, amamodemu, amakhadi omsindo nezinto zasendlini esizibona edolobheni lekhompyutha zihlukile.
Isisekelo esisetshenziswayo senziwe ngesisekelo sephepha (esivame ukusetshenziselwa uhlangothi olulodwa) noma isisekelo sendwangu yengilazi (evame ukusetshenziselwa ungqimba oluphindwe kabili kanye nongqimba oluningi), i-phenolic efakwe ngaphambili noma i-epoxy resin, uhlangothi olulodwa noma izinhlangothi zombili zobuso. inamathiselwe nge-copper cladding bese i-laminated futhi yenziwe.Lolu hlobo lwebhodi lesifunda ishidi eligqoke ithusi, silibiza ngokuthi ibhodi eliqinile.Ngemva kokwenza ibhodi lesifunda eliphrintiwe, silibiza ngokuthi ibhodi lesifunda eliqinile eliphrintiwe.
Ibhodi lesifunda eliphrintiwe elinephethini yesekethe ephrintiwe ohlangothini olulodwa libizwa ngokuthi ibhodi lesifunda eliphrintiwe elinohlangothi olulodwa, ibhodi lesifunda eliphrintiwe elinephethini yesifunda ephrintiwe nhlangothi zombili, kanye nebhodi lesifunda eliphrintiwe elakhiwe ngokuxhuma okukabili emaceleni ngokusebenzisa i-metallization. izimbobo, sikubiza ngokuthi ibhodi elinamacala amabili.Uma kusetshenziswa ibhodi lesifunda eliphrintiwe elinesendlalelo sangaphakathi esinezinhlangothi ezimbili, ungqimba lwangaphandle olunohlangothi olulodwa, noma ungqimba lwangaphakathi olunezinhlangothi ezimbili kanye nongqimba lwangaphandle olunohlangothi olulodwa, isistimu yokumisa kanye nezinto zokubopha ezivikelayo ziyashintshana kanye nesekethe ephrintiwe. ibhodi ngephethini conductive oxhumene ngokuvumelana nezidingo design iba ungqimba ezine futhi eziyisithupha ephrintiwe wesifunda ibhodi, eyaziwa nangokuthi multi-ungqimba ephrintiwe wesifunda ibhodi.
3.I-PCBA ingenye yezingxenye eziyisisekelo zezingxenye ze-elekthronikhi.I-PCB ihamba kuyo yonke inqubo ye-surface mount technology (SMT) kanye nokufakwa kwama-plug-in e-DIP, abizwa ngokuthi inqubo ye-PCBA.Eqinisweni, iyi-PCB enesiqephu esinamathiselwe.Elinye ibhodi eliqediwe kanti elinye liyibhodi elingenalutho.
I-PCBA ingaqondwa njengebhodi lesifunda eliqediwe, okungukuthi, ngemva kokuba zonke izinqubo zebhodi lesifunda seziqediwe, i-PCBA ingabalwa.Ngenxa ye-miniaturization eqhubekayo kanye nokucwengwa kwemikhiqizo ye-elekthronikhi, amabhodi amaningi wesekethe amanje ahlanganiswe ne-etching resists (i-lamination noma i-coating).Ngemuva kokuvezwa nokuthuthukiswa, amabhodi wesekethe enziwa ngokuqopha.
Esikhathini esidlule, ukuqonda kokuhlanza kwakunganele ngoba ukuminyana komhlangano we-PCBA kwakungaphakeme, futhi kwakukholelwa ukuthi izinsalela ze-flux zazingeyona i-conductive futhi ziyingozi, futhi ngeke zithinte ukusebenza kukagesi.
Imihlangano ye-elekthronikhi yanamuhla ijwayele ukwenziwa i-miniaturized, ngisho nemishini emincane, noma ama-pitches amancane.Izikhonkwane namaphedi kuya ngokusondelana.Izikhala zanamuhla ziba zincane futhi ziba zincane, futhi ukungcola kungase kubhajwe ezikhaleni, okusho ukuthi izinhlayiya ezincane, uma zihlala phakathi kwalezi zikhala ezimbili, zingase zibe yinto embi ebangelwa ukuhamba kancane.
Eminyakeni yamuva nje, imboni yokuhlanganisa i-elekthronikhi iye yaqaphela kakhulu futhi ikhuluma ngokuhlanzeka, hhayi kuphela ngezidingo zomkhiqizo, kodwa futhi nezidingo zemvelo kanye nokuvikelwa kwempilo yabantu.Ngakho-ke, kunabahlinzeki abaningi bemishini yokuhlanza nezixazululo, futhi ukuhlanza kuye kwaba okunye okuqukethwe okuyinhloko kokuhwebelana kwezobuchwepheshe nezingxoxo embonini yomhlangano we-elekthronikhi.
4. I-DIP ingenye yezingxenye eziyisisekelo zezingxenye ze-elekthronikhi.Kubizwa ngokuthi ubuchwepheshe bokupakisha okukabili emgqeni, okubhekiselwe kuma-chips esekethe ahlanganisiwe apakishwa ngamaphakeji akabili akulayini.Leli fomu lokupakisha liphinde lisetshenziswe kumasekethe amaningi ahlanganisiwe amancane naphakathi nendawo., inani lamaphini ngokuvamile alidluli i-100.
I-CPU chip yobuchwepheshe bokupakisha be-DIP inemigqa emibili yamaphini, adinga ukufakwa kusokhethi ye-chip enesakhiwo se-DIP.
Yiqiniso, ingabuye ifakwe ngokuqondile ebhodini lesifunda elinenombolo efanayo yezimbobo ze-solder kanye nokuhlelwa kwejometri ye-soldering.
Ubuchwepheshe bokupakisha be-DIP kufanele bunakekele ngokukhethekile lapho ufaka futhi ukhipha i-chip socket ukugwema ukulimala kwezikhonkwane.
Izici: I-DIP ye-ceramic enezingqimba eziningi, i-DIP yongqimba olulodwa ye-ceramic DIP, i-DIP yohlaka oluholayo (kuhlanganise nohlobo lokuvala uphawu lwengilazi ye-ceramic, uhlobo lwesakhiwo sokupakisha sepulasitiki, uhlobo lokupakisha lwengilazi oluncibilikayo lwe-ceramic) njalonjalo.
I-plug-in ye-DIP iyisixhumanisi senqubo yokukhiqiza ye-elekthronikhi, kukhona ama-plug-in okwenziwa ngesandla, kodwa futhi nama-plug-in omshini we-AI.Faka into eshiwo endaweni ethile.Ama-plug-in okwenziwa ngesandla nawo kufanele adlule ekufakweni kwe-wave soldering kuya ku-solder electronic components ebhodini.Ezingxenyeni ezifakiwe, kuyadingeka ukuhlola ukuthi zifakwe ngokungalungile noma ziphuthelwe.
I-DIP plug-in post-soldering iyinqubo ebaluleke kakhulu ekucubunguleni i-pcba patch, futhi izinga layo lokucubungula lithinta ngokuqondile umsebenzi webhodi le-pcba, ukubaluleka kwalo kubaluleke kakhulu.Khona-ke i-post-soldering, ngoba ezinye izingxenye, ngokusho kwemikhawulo yenqubo kanye nezinto zokwakha, azikwazi ukudayiswa ngomshini we-wave soldering, futhi zingenziwa kuphela ngesandla.
Lokhu futhi kukhombisa ukubaluleka kwama-plug-in e-DIP ezingxenyeni ze-elekthronikhi.Kuphela ngokunaka imininingwane kungakwazi ukuhlukaniswa ngokuphelele.
Kulezi zingxenye ezine ezinkulu ze-elekthronikhi, ngayinye inezinzuzo zayo, kodwa ziyahambisana ukuze zenze lolu chungechunge lwezinqubo zokukhiqiza.Kuphela ngokubheka ikhwalithi yemikhiqizo yokukhiqiza lapho abasebenzisi abaningi kanye namakhasimende bangabona izinhloso zethu.

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FAQ

Q1: Uqinisekisa kanjani ikhwalithi yama-PCB?
A1: Ama-PCB ethu wonke awu-100% wokuhlola okuhlanganisa i-Flying Probe Test, i-E-test noma i-AOI.

Q2: Ngingathola intengo engcono kakhulu?
A2: Yebo.Ukusiza amakhasimende ukulawula izindleko yilokho esihlala sizama ukukwenza.Onjiniyela bethu bazohlinzeka ngomklamo ongcono kakhulu wokugcina impahla ye-PCB.

Q3: Ngingathola isampula yamahhala?
A3: Yebo, Siyakwamukela ukuze uthole insiza kanye nekhwalithi yethu. Udinga ukwenza inkokhelo ekuqaleni, futhi sizobuyisela izindleko zesampula uma i-oda lakho lenqwaba elilandelayo.