Ibhodi Lesifunda Eliphrintiwe Lekhwalithi Ephezulu PCB
I-PCB (PCB Assembly) Amandla wenqubo
| Imfuneko Yezobuchwepheshe | I-Professional Surface-mounting and Through-hole soldering Technology |
| Osayizi abahlukahlukene njenge-1206,0805,0603 izingxenye zobuchwepheshe be-SMT | |
| I-ICT(In Circuit Test),i-FCT(Functional Circuit Test) ubuchwepheshe | |
| PCB Assembly With UL,CE,FCC,Rohs Ukuvunyelwa | |
| Ubuchwepheshe bokuthengisa kabusha kwegesi ye-nitrogen ye-SMT | |
| I-High Standard SMT&Solder Assembly Line | |
| Amandla obuchwepheshe bokubekwa kwebhodi axhumene okuphezulu | |
| Imfuneko ye-Quote&Production | Ifayela le-Gerber noma Ifayela le-PCB le-Bare PCB Board Fabrication |
| I-Bom(Bill of Material) yoMhlangano, i-PNP(ifayela lokukhetha nendawo) kanye nesikhundla se-Components nayo iyadingeka ekuhlanganiseni | |
| Ukuze unciphise isikhathi sokucaphuna, sicela usinikeze inombolo egcwele yengxenye yengxenye ngayinye,Ubuningi bebhodi ngalinye kanye nenani lama-oda. | |
| Umhlahlandlela Wokuhlola&Indlela Yokuhlola Umsebenzi ukuze kuqinisekiswe ikhwalithi ifinyelela cishe isilinganiso esingu-0% se-scrap |
Mayelana
I-PCB ithuthuke isuka kungqimba olulodwa iye emaceleni amabili, amabhodi anezingqimba eziningi futhi aguquguqukayo, futhi athuthuka njalo ekuqondeni kokunemba okuphezulu, ukuminyana okuphezulu nokuthembeka okuphezulu.Ukunciphisa usayizi ngokuqhubekayo, ukunciphisa izindleko, nokuthuthukisa ukusebenza kuzokwenza ibhodi lesifunda eliphrintiwe lisalondoloze ubungqabavu obuqinile ekuthuthukisweni kwemikhiqizo ye-elekthronikhi esikhathini esizayo.Ngokuzayo, umkhuba wokuthuthukiswa kobuchwepheshe bokukhiqiza ibhodi lesifunda eliphrintiwe ukuthuthuka ekuqondeni okuphezulu, ukunemba okuphezulu, indawo encane, ucingo oluncane, iphimbo elincane, ukuthembeka okuphezulu, ungqimba oluningi, ukudluliselwa kwesivinini esikhulu, isisindo esincane kanye umumo omncane.
Izinyathelo ezinemininingwane nezixwayiso zokukhiqizwa kwe-PCB
1. Ukuklama
Ngaphambi kokuthi inqubo yokukhiqiza iqale, i-PCB idinga ukuklanywa/isakhiwo ngu-opharetha we-CAD ngokusekelwe kuhlelo lwesekethe olusebenzayo.Uma inqubo yokuklama isiqediwe, isethi yamadokhumenti inikezwa umkhiqizi we-PCB.Amafayela e-Gerber afakiwe emibhalweni, ehlanganisa ukucushwa kwesendlalelo ngesendlalelo, amafayela okucubungula, ukukhetha nokubeka idatha, nezichasiselo zombhalo.Icubungula amaphrinti, ihlinzeka ngemiyalo yokucubungula ebalulekile ekukhiqizeni, yonke imininingwane ye-PCB, ubukhulu kanye nokubekezelelwa.
2. Ukulungiselela ngaphambi kokukhiqiza
Uma indlu ye-PCB ithola iphakheji yefayela lomklami, bangaqala ukudala uhlelo lwenqubo yokukhiqiza kanye nephakheji yezithombe.Ukucaciswa kokukhiqiza kuzonquma icebo ngokufaka kuhlu izinto ezifana nohlobo lwento ephathekayo, ukuqedwa kwendawo, ukuphahlazeka, uxhaxha lwamaphaneli omsebenzi, umzila wenqubo, nokuningi.Ukwengeza, iqoqo lemisebenzi yobuciko ebonakalayo ingadalwa ngohlaka lwefilimu.Umsebenzi wobuciko uzobandakanya zonke izendlalelo ze-PCB kanye nomsebenzi wobuciko we-soldermask nokumaka ithemu.
3. Ukulungiselela izinto ezibonakalayo
Ukucaciswa kwe-PCB okudingwa umklami kunquma uhlobo lwempahla, ukujiya kwengqikithi nesisindo sethusi esisetshenziswa ukuqalisa ukulungiswa kwezinto.Ama-PCB anohlangothi olulodwa futhi anezinhlangothi ezimbili eziqinile awadingi ukucutshungulwa kwesendlalelo sangaphakathi futhi aya ngqo kunqubo yokumba.Uma i-PCB inezendlalelo eziningi, ukulungiswa kwezinto ezifanayo kuzokwenziwa, kodwa ngendlela yezingqimba zangaphakathi, ezivame ukuba zizacile kakhulu futhi zingakhiwa zibe ukujiya kokugcina okunqunywe kusengaphambili (i-stackup).
Usayizi wephaneli yokukhiqiza ojwayelekile ngu-18″x24″, kodwa noma yimuphi usayizi ungasetshenziswa inqobo nje uma ungaphakathi kwamandla okukhiqiza we-PCB.
4. I-PCB ye-Multilayer kuphela - ukucubungula isendlalelo sangaphakathi
Ngemuva kobukhulu obufanele, uhlobo lwezinto ezibonakalayo, ubukhulu bomgogodla kanye nesisindo sethusi sesendlalelo sangaphakathi silungiswa, sithunyelwa ukubhoboza izimbobo ezenziwe ngomshini bese siphrinta.Zombili izinhlangothi zalezi zingqimba zimbozwe nge-photoresist.Qondanisa izinhlangothi usebenzisa umsebenzi wobuciko wesendlalelo sangaphakathi nezimbobo zamathuluzi, bese uveza uhlangothi ngalunye ekukhanyeni kwe-UV okunegethivu yokubona yokulandela kanye nezici ezicaciswe kuleso sendlalelo.Ukukhanya kwe-UV okuwela kumshini wokuthwebula izithombe kubopha ikhemikhali endaweni yethusi, bese ikhemikhali esele engabonakali ikhishwa kubhavu okhulayo.
Isinyathelo esilandelayo ukukhipha ithusi eliveziwe ngokusebenzisa inqubo yokufaka.Lokhu kushiya imikhondo yethusi ifihlwe ngaphansi kongqimba lwe-photoresist.Ngesikhathi senqubo yokuqopha, kokubili ukugxila kwe-etchant kanye nesikhathi sokuchayeka kuyimingcele ebalulekile.I-resistance ibe isihlutshiwe, ishiya iminonjana nezici kungqimba lwangaphakathi.
Abahlinzeki abaningi be-PCB basebenzisa amasistimu okuhlola okuzenzakalelayo ukuze bahlole izendlalelo kanye nezingqimba ze-post-etch ukuze kuthuthukiswe izimbobo zamathuluzi e-lamination.
5. I-Multilayer PCB kuphela - Laminate
Isitaki esinqunywe kusengaphambili senqubo sisungulwa phakathi nenqubo yokuklama.Inqubo ye-lamination yenziwa endaweni ehlanzekile yegumbi elinesendlalelo esiphelele sangaphakathi, i-prepreg, i-copper foil, amapuleti okucindezela, izikhonkwane, izikhala zensimbi ezingenasici kanye namapuleti asekelayo.Isitaki ngasinye somshini singathatha amabhodi angu-4 kuye kwayi-6 ngokuvula ngakunye, kuye ngogqinsi lwe-PCB eqediwe.Isibonelo se-stackup yebhodi enezingqimba ezi-4 kungaba: i-platen, isihlukanisi sensimbi, i-copper foil (ungqimba lwesine), prepreg, core 3-2 layers, prepreg, i-copper foil, nokuphinda.Ngemuva kokuthi ama-PCB ama-4 kuya kwayi-6 ehlanganisiwe, vikela ipuleti eliphezulu bese ulibeka emshinini wokunyathelisa we-lamination.Ukucindezela kukhuphukela kumakhonsathi futhi kufake ingcindezi kuze kuncibilike i-resin, lapho i-prepreg igeleza, ihlanganisa izendlalelo ndawonye, bese ucindezela uphole.Lapho ekhishwa futhi elungile
6. Ukubhoboza
Inqubo yokubhoboza yenziwa umshini wokumba weziteshi eziningi olawulwa yi-CNC esebenzisa i-spindle ephezulu ye-RPM kanye ne-carbide drill bit yakhelwe ukubhola kwe-PCB.Ama-vias ajwayelekile angaba mancane njengo-0.006″ ukuya ku-0.008″ abhojwe ngesivinini esingaphezu kuka-100K RPM.
Inqubo yokumba idala udonga lwembobo oluhlanzekile, olubushelelezi olungeke lulimaze izendlalelo zangaphakathi, kodwa ukubhola kunikeza indlela yokuxhumana kwezingqimba zangaphakathi ngemva kokucwecwa, futhi imbobo engaphumeleli igcina iyikhaya lezingxenye zembobo.
Izimbobo ezinganandisiwe zivame ukubholwa njengomsebenzi wesibili.
7. I-Copper Plating
I-Electroplating isetshenziswa kakhulu ekukhiqizeni kwe-PCB lapho kudingeka khona ukugqitshwa ngezimbobo.Umgomo uwukufaka ungqimba lwethusi ku-conductive substrate ngochungechunge lwemithi yokwelapha, bese kusetshenziswa izindlela ezilandelayo ze-electroplating ukuze kukhuliswe ukushuba kongqimba lwethusi kugqinsi lwedizayini ethile, ngokuvamile eyi-1 mil noma ngaphezulu.
8. Ukwelashwa kwesendlalelo sangaphandle
Ukucutshungulwa kwesendlalelo sangaphandle empeleni kuyafana nenqubo echazwe ngaphambilini yesendlalelo sangaphakathi.Zombili izinhlangothi zezendlalelo ezingaphezulu nezingaphansi zimbozwe nge-photoresist.Qondanisa izinhlangothi usebenzisa umsebenzi wobuciko wangaphandle nezimbobo zamathuluzi, bese uveza uhlangothi ngalunye ekukhanyeni kwe-UV ukuze uthole imininingwane yephethini yokubona okunegethivu yokulandela nezici.Ukukhanya kwe-UV okuwela kumshini wokuthwebula izithombe kubopha ikhemikhali endaweni yethusi, bese ikhemikhali esele engabonakali ikhishwa kubhavu okhulayo.Isinyathelo esilandelayo ukukhipha ithusi eliveziwe ngokusebenzisa inqubo yokufaka.Lokhu kushiya imikhondo yethusi ifihlwe ngaphansi kongqimba lwe-photoresist.I-resistance ibe isihlutshiwe, ishiya iminonjana nezici kungqimba olungaphandle.Ukukhubazeka kwesendlalelo sangaphandle kungatholwa ngaphambi kwemaski ye-solder kusetshenziswa ukuhlolwa okuzenzakalelayo kokubona.
9. Unamathisele we-solder
Isicelo semaski ye-Solder siyefana nezinqubo zesendlalelo sangaphakathi nangaphandle.Umehluko omkhulu ukusetshenziswa kwemaski ethwebula izithombe esikhundleni se-photoresist phezu kwendawo yonke yephaneli yokukhiqiza.Bese usebenzisa umsebenzi wobuciko ukuthatha izithombe phezulu nangaphansi.Ngemuva kokuchayeka, imaskhi ihlutshiwe endaweni esesithombeni.Inhloso ukuveza kuphela indawo lapho izingxenye zizobekwa khona futhi zidayiswe.Imaski iphinda ikhawulele ukuphela kwe-PCB ezindaweni eziveziwe.
10. Ukwelashwa kwendawo
Kunezinketho eziningi zokuqeda ubuso bokugcina.Igolide, isiliva, i-OSP, i-solder engenamthofu, i-solder equkethe umthofu, njll. Konke lokhu kuvumelekile, kodwa kubilisa ngokwezidingo zedizayini.Igolide nesiliva kusetshenziswa i-electroplating, kuyilapho ama-solder angenawo umthofu nanomthofu afakwa ngokuvundlile nge-hot air solder.
11. I-Nomenclature
Ama-PCB amaningi avikelwe emigqeni engaphezulu kwawo.Lezi zimpawu zisetshenziswa kakhulu enqubweni yokuhlanganisa futhi zihlanganisa izibonelo ezifana nokumaka okubhekisela kanye nokumaka kwe-polarity.Okunye ukumaka kungase kube lula njengokuhlonza inombolo yengxenye noma amakhodi edethi yokukhiqiza.
12. Ibhodi elincane
Ama-PCB akhiqizwa ngamaphaneli okukhiqiza aphelele adinga ukukhishwa kumakhonsathi awo okukhiqiza.Ama-PCB amaningi asethwe ngokwamalungu afanayo ukuze athuthukise ukusebenza kahle kokuhlanganisa.Kungaba nenani elingapheli lawa malungu afanayo.Ayikwazi ukuchaza.
Amalungu afanayo amaningi kungenzeka ukuthi iphrofayili igaywe kumshini wokugaya we-CNC kusetshenziswa amathuluzi e-carbide noma athole amaphuzu kusetshenziswa amathuluzi ahlanganiswe ngedayimane.Zombili izindlela zivumelekile, futhi ukukhetha kwendlela ngokuvamile kunqunywa ithimba lomhlangano, elivame ukugunyaza uhlu olwakhiwe kusenesikhathi.
13. Isivivinyo
Abakhiqizi be-PCB ngokuvamile basebenzisa i-probe endizayo noma inqubo yokuhlola izinzipho.Indlela yokuhlola enqunywa ubuningi bomkhiqizo kanye/noma okokusebenza okutholakalayo
One-stop Solution
Umbukiso Wemboni
Inkonzo Yethu
1. Izinsizakalo Zomhlangano we-PCB:SMT,DIP&THT,BGA ukulungisa nokuphinda ibhola
2. I-ICT, I-Constant Temperature Burn-in kanye Nokuhlolwa Komsebenzi
3. Istencil, Amakhebuli kanye nebhilidi elibiyelwe
4. Ukupakisha Okujwayelekile kanye Nokulethwa Ngesikhathi
