I-Double Side Rigid SMT PCB Circuit Board

Ibhodi Lesifunda Lesifunda Se-Double Side Rigid SMT PCB Isithombe Esifakiwe

Incazelo emfushane:

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Imininingwane Yomkhiqizo

Imfuneko ye-Quote&Production	Ifayela le-Gerber noma Ifayela le-PCB le-Bare PCB Board Fabrication
	I-Bom(Bill of Material) yoMhlangano, i-PNP(ifayela lokukhetha nendawo) kanye nesikhundla se-Components nayo iyadingeka ekuhlanganiseni
	Ukuze unciphise isikhathi sokucaphuna, sicela usinikeze inombolo egcwele yengxenye yengxenye ngayinye,Ubuningi bebhodi ngalinye kanye nenani lama-oda.
	Umhlahlandlela Wokuhlola&Indlela Yokuhlola Umsebenzi ukuze kuqinisekiswe ikhwalithi ifinyelela cishe isilinganiso esingu-0% se-scrap
Izinsizakalo ze-OEM/ODM/EMS	PCBA, PCB umhlangano: SMT & PTH & BGA
	PCBA kanye nomklamo ebiyelwe
	Ukuthola nokuthenga izakhi
	I-prototyping esheshayo
	Ukubumba umjovo wepulasitiki
	Metal sheet stamping
	Umhlangano wokugcina
	Ukuhlolwa: I-AOI, Ukuhlolwa Kwesekethe (ICT), Ukuhlolwa Okusebenzayo (FCT)
	Ukugunyazwa ngokwezifiso kokungeniswa kwempahla kanye nokuthunyelwa kwemikhiqizo

Inqubo Yethu

1. Inqubo yokucwiliswa kwegolide: Inhloso yenqubo yokucwiliswa kwegolide ukufaka i-nickel-golden coating enombala ozinzile, ukukhanya okuhle, ukunamathela okubushelelezi kanye nokucwengeka okuhle ebusweni be-PCB, engahlukaniswa ngokuyisisekelo ngezigaba ezine: ukwelashwa ngaphambi kwesikhathi. (Ukukhipha amafutha, ukucwiliswa okuncane, ukwenza kusebenze, ukucwiliswa kwangemuva), i-nickel yokucwiliswa, igolide lokucwiliswa, ukwelapha ngemva kokwelashwa, (imfucuza yokugeza igolide, ukuwashwa kwe-DI, ukomisa).

2. Ithini elifafazwe ngomthofu: Izinga lokushisa le-eutectic elinomthofu liphansi kunalelo lengxubevange engenamthofu.Inani elithile lincike ekwakhiweni kwengxubevange engenamthofu.Isibonelo, i-eutectic ye-SNAGCU ingama-degree angama-217.Izinga lokushisa le-solder liyi-eutectic lokushisa kanye nama-degree angu-30-50, kuye ngokuthi ukwakheka.Ukulungiswa kwangempela, i-lead eutectic ingama-degrees angu-183.Amandla emishini, ukukhanya, njll. ukuhola kungcono kunokungenawo umthofu.

3. Ukufutha ithini elingenamthofu: Umthofu uzothuthukisa ukusebenza kocingo lwethayela enqubweni yokushisela.Intambo kathayela womthofu kulula ukuyisebenzisa kunothayela olungenamthofu, kodwa umthofu unobuthi, futhi awuwulungele umzimba womuntu uma usetshenziswa isikhathi eside.Futhi ithini elingenawo umthofu liyoba nendawo yokuncibilika ephakeme kune-lead-tin, ukuze amalunga e-solder abe namandla kakhulu.

Inqubo ethize yenqubo yokukhiqiza ibhodi lesifunda elinezinhlangothi ezimbili ze-PCB
1. Ukubhola kwe-CNC
Ukuze kwandiswe ukuminyana komhlangano, izimbobo ebhodini lesifunda elinezinhlangothi ezimbili ze-PCB ziya ziba zincane ngokuba zincane.Ngokuvamile, amabhodi e-pcb anezinhlangothi ezimbili ambozwa ngemishini yokumba ye-CNC ukuze kuqinisekiswe ukunemba.
2. Electroplating hole inqubo
Inqubo yezimbobo ezinamapulangwe, eyaziwa nangokuthi i-metallized hole, iyinqubo lapho lonke udonga lwembobo lunamekwe ngensimbi ukuze amaphethini okuqhuba phakathi kwezingqimba zangaphakathi nangaphandle zebhodi lesekethe eliphrintiwe kabili emaceleni akwazi ukuxhunywa ngogesi.
3. Ukuphrinta isikrini
Izinto zokuphrinta ezikhethekile zisetshenziselwa amaphethini wesekethe yokuphrinta isikrini, amaphethini wemaski ye-solder, amaphethini wezimpawu zezinhlamvu, njll.
4. Electroplating tin-lead ingxubevange
I-Electroplating tin-lead alloys inemisebenzi emibili: okokuqala, njengesendlalelo sokuzivikela esilwa nokugqwala ngesikhathi se-electroplating ne-etching;okwesibili, njengengubo ethengiswayo yebhodi eliqediwe.I-Electroplating tin-lead alloys kumele ilawule ngokuqinile izimo zokugeza kanye nenqubo.Ugqinsi lwe-tin-lead alloy plating layer kufanele lube ngaphezu kwama-microns angu-8, futhi udonga lwembobo akufanele lube ngaphansi kwama-microns angu-2.5.
ibhodi lesifunda eliphrintiwe
5. Ukuqopha
Uma usebenzisa ingxubevange ye-tin-lead njengesendlalelo sokumelana ukuze kwenziwe iphaneli ezinhlangothi zombili ngendlela yokuhlanganisa i-electroplating enephethini, isixazululo se-acid copper chloride etching solution ne-ferric chloride etching solution ngeke zisetshenziswe ngoba ziphinde zigqwalise ingxubevange ye-tin-lead.Enqubweni yokunamathisela, "i-side etching" kanye nokunwetshwa kwe-coating yizici ezithinta ukushumeka: ikhwalithi
(1) Ukugqwala okuseceleni.Ukugqwala okuseceleni kuyisimo sokucwila noma ukucwila kwamaphethelo kakhondatha okubangelwa ukucwiliswa.Izinga lokugqwala okuseceleni lihlobene nesixazululo se-etching, amathuluzi kanye nezimo zenqubo.Ukugqwala okuncane kwe-flank kuba ngcono.
(2) Ukumbozwa kunwetshiwe.Ukunwetshwa kokugqoka kungenxa yokuqina kokugqoka, okwenza ububanzi bohlangothi olulodwa locingo budlule ububanzi bepuleti eliphansi eliqediwe.
6. Ukucwecwa kwegolide
I-Gold Plating ine-conductivity kagesi enhle kakhulu, ukumelana nokuxhumana okuncane nokuzinzile kanye nokumelana nokugqokwa okuhle kakhulu, futhi kuyindlela engcono kakhulu yokufaka amapulaki ebhodi lesifunda.Ngasikhathi sinye, inokuqina okuhle kakhulu kwamakhemikhali kanye ne-solderability, futhi ingasetshenziswa njenge-corrosion-resistant, solderable and protective coating on surface mount PCBs.
7. Ukuncibilika okushisayo nokulinganisa komoya oshisayo
(1) Ukuncibilika okushisayo.I-pcb ehlanganiswe ne-Sn-Pb alloy ishisiswe ibe ngaphezu kwendawo encibilikayo ye-Sn-Pb alloy, ukuze i-Sn-Pb ne-Cu zakha inhlanganisela yensimbi, ukuze okokunamathela kwe-Sn-Pb kuminyene, kukhanye futhi kungabi namaphinifa, futhi ukumelana nokugqwala kanye ne-solderability ye-coating kuyathuthukiswa.ucansi.I-hot-melt evame ukusetshenziswa i-glycerol hot-melt kanye ne-infrared hot-melt.
(2) Ukulinganisa komoya oshisayo.Eyaziwa nangokuthi i-tin spraying, ibhodi lesifunda eliphrintiwe nge-mask-coated eliphrintiwe lilinganiswe ngokuguquguquka ngomoya oshisayo, bese lihlasela ichibi le-solder elincibilikisiwe, bese lidlula phakathi kwemimese yomoya emibili ukuze likhiphe i-solder eyeqile ukuze lithole ukukhanya okukhanyayo, okufanayo, okubushelelezi. i-solder enamathela.Ngokuvamile, izinga lokushisa lokugeza le-solder lilawulwa ku-230 ~ 235, izinga lokushisa lommese womoya lilawulwa ngaphezu kwe-176, isikhathi se-welding ye-dip singu-5 ~ 8s, futhi ukushuba kokumboza kulawulwa kuma-microns angu-6 ~ 10.
Ibhodi Lesekethe Eliphrintiwe Ngamahlangothi Akabili
Uma ibhodi lesekhethi ye-PCB enezinhlangothi ezimbili ilahliwe, ayikwazi ukugaywa kabusha, futhi ikhwalithi yayo yokukhiqiza izothinta ngqo ikhwalithi nezindleko zomkhiqizo wokugcina.