PCBA kunye PCB Board iNdibano yeeMveliso Electronics

Iinkcukacha zeMveliso

I-PCB (iNdibano ye-PCB) yeNkqubo yeZakhono

Inkqubo ethile ye-PCBA

I-1) Ukuhamba kwenkqubo eqhelekileyo yamacala amabini kunye nobuchwepheshe.

① Ukusika izinto eziphathekayo-ukugaya-umngxuma kunye nepleyiti epheleleyo ye-electroplating-pattern transfer (ukwenziwa kwefilimu, ukuvezwa, ukuphuhliswa) -i-etching kunye nokususwa kwefilimu-i-solder mask kunye nabalinganiswa-HAL okanye i-OSP, njl njl.
② Izinto zokusika-ukubhobhoza-ukukhupha i-pattern transfer-electroplating-film stripping and etching-anti-corrosion film ukususwa (Sn, okanye Sn/pb)-plating plug- -Solder imaski kunye nabalinganiswa-HAL okanye i-OSP, njl. -ukuhlola-imveliso egqityiweyo

(2) Inkqubo eqhelekileyo yebhodi yemigangatho emininzi kunye nobuchwepheshe.

Material cutting-inner layer production-oxidation treatment-lamination-drilling-hole plating (inokwahlulwa ibe yibhodi epheleleyo kunye ne-pattern plating)-imveliso yangaphandle yemveliso-ingubo yobuso
(Qaphela i-1): Ukuveliswa kwemveliso yangaphakathi kubhekiselele kwinkqubo yebhodi ye-in-process emva kokuba izinto zisikiwe-ukuhanjiswa kwephethini (ukubunjwa kwefilimu, ukuvezwa, ukuphuhliswa) -i-etching kunye nokususwa kwefilimu-ukuhlolwa, njl.
(Qaphela i-2): Imveliso yangaphandle yomaleko ibhekisela kwinkqubo yokwenza i-plate-making ngokusebenzisa i-electroplating ye-hole-pattern transfer (ukwenziwa kwefilimu, ukuvezwa, ukuphuhliswa) -i-etching kunye nefilimu yokuhluthwa.
(Qaphela i-3): Ukugquma komhlaba (i-plating) kuthetha ukuba emva kokuba i-maleko yangaphandle yenziwe-i-mask ye-solder kunye neempawu-i-coating (i-plating) layer (njenge-HAL, i-OSP, i-chemical Ni / Au, i-chemical Ag, i-chemical Sn, njl. ).

(3) Ukungcwatywa / ukungaboni ngokuhamba kwebhodi ye-multilayer kunye nobuchwepheshe.

Iindlela zokuthambisa ezilandelelanayo zisetyenziswa ngokubanzi.oko ikukuthi:
I-Material cutting-forming core board (elingana nebhodi ye-double-side okanye i-multi-layer board) -i-lamination-le nkqubo ilandelayo ifana nebhodi ye-multi-layer eqhelekileyo.
(Qaphela i-1): Ukuqulunqa ibhodi engundoqo kubhekiselele ekubunjweni kwebhodi ye-multi-layer enemingxuma engcwatywe / engaboniyo ngokweemfuno zesakhiwo emva kokuba ibhodi ephindwe kabini okanye ibhodi eninzi yenziwe ngeendlela eziqhelekileyo.Ukuba umyinge wenkalo yomngxuma webhodi engundoqo inkulu, unyango lokuthintela umngxuma kufuneka lwenziwe ukuze kuqinisekiswe ukuthembeka kwayo.

(4) Ukuhamba kwenkqubo kunye neteknoloji yebhodi ye-laminated multi-layer board.

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Njengomlingane ohamba phambili kwinkonzo yokwenziwa kwe-PCB kunye nendibano ye-PCB (PCBA), i-Evertop izabalazela ukuxhasa ishishini elincinane lamazwe ngamazwe elinamava obunjineli kwiiNkonzo zokuVelisa i-Electronic (EMS) iminyaka.