1. Imigaqo ngokubanzi
1.1 Idijithali, i-analog, kunye neendawo ze-DAA ze-wiring zesignali zahlulwe kwangaphambili kwi-PCB.
1.2 Amacandelo edijithali kunye ne-analog kunye neentambo ezihambelanayo kufuneka zihlulwe kangangoko kwaye zibekwe kwiindawo zabo zocingo.
1.3 Izalathiso zesignali yedijithali enesantya esiphezulu mazibe mfutshane kangangoko.
1.4 Gcina imikhondo ye-analog enovakalelo ibemfutshane kangangoko.
1.5 Ulwabiwo olufanelekileyo lwamandla nomhlaba.
1.6 I-DGND, i-AGND, kunye nentsimi yahlulwe.
1.7 Sebenzisa iingcingo ezibanzi ekuboneleleni kombane kunye nezalathisi zeempawu ezibalulekileyo.
1.8 Isekethe yedijithali ibekwe kufutshane ne-parallel bus/serial DTE interface, kwaye isekethe ye-DAA ibekwe kufutshane ne-interface yefowuni.
2. Ukubekwa kwecandelo
2.1 Kumzobo weskimu yesekethe yesekethe:
a) Ukwahlula iisekethe zedijithali, ze-analog, zeDAA kunye neesekethe ezinxulumene nazo;
b) Yahlula idijithali, i-analog, idijithali exubeneyo/amacandelo e-analog kwisekethe nganye;
c) Nika ingqalelo ekumisweni konikezelo lwamandla kunye nezikhonkwane zomqondiso wetshiphu ye-IC nganye.
2.2 Ukwahlula kwangaphambili indawo yocingo lweesekethe zedijithali, ze-analog, kunye ne-DAA kwi-PCB (umlinganiselo jikelele 2/1/1), kwaye ugcine amacandelo edijithali kunye ne-analog kunye ne-wiring yazo ehambelanayo kude kangangoko kunokwenzeka kwaye unciphise kwiindawo zabo. iindawo zocingo.
Qaphela: Xa isekethe ye-DAA ithatha umlinganiselo omkhulu, kuya kubakho ukulandelwa kweempawu zokulawula / zesimo esidlula kwindawo yayo ye-wiring, enokuthi ihlengahlengiswe ngokwemigaqo yendawo, njengesithuba secandelo, ukunyanzeliswa kombane ophezulu, umda wangoku, njl.
2.3 Emva kokuba kugqitywe icandelo lokuqala, qalisa ukubeka amacandelo asuka kwiConnector and Jack:
a) Indawo yokufaka iplagi igcinwe malunga neSiqhagamshelo kunye neJack;
b) Shiya isithuba sombane kunye neengcingo zomhlaba ezijikeleze amacandelo;
c) Beka ecaleni indawo yeplagi ehambelanayo ejikeleze iSocket.
2.4 Indawo yokuqala yamacandelo axubileyo (afana nezixhobo zeModem, i-A/D, iitshiphusi zokuguqula i-D/A, njl.
a) Ukumisela isalathiso sokubekwa kwamacandelo, kwaye uzame ukwenza umqondiso wedijithali kunye nezikhonkwane zesignali ye-analog zijongane neendawo zazo zocingo;
b) Beka amacandelo ekudibaneni komzila wedijithali kunye neendawo ze-analog.
2.5 Beka zonke izixhobo ze-analog:
a) Beka amacandelo esekethe ye-analog, kubandakanywa neesekethe ze-DAA;
b) Izixhobo ze-analog zibekwe ngokusondeleyo omnye komnye kwaye zibekwe kwicala le-PCB equka i-TXA1, i-TXA2, i-RIN, i-VC, kunye ne-VREF impawu zomqondiso;
c) Kuphephe ukubeka amacandelo engxolo ephezulu ejikeleze i-TXA1, TXA2, RIN, VC, kunye ne-VREF imikhondo yomqondiso;
d) Kuthotho lweemodyuli ze-DTE, i-DTE EIA/TIA-232-E
Ummkeli / umqhubi weempawu ze-interface yechungechunge kufuneka abe kufutshane ngokusemandleni kwi-Connector kwaye kude ne-high-frequency clock signal routing ukunciphisa / ukuphepha ukongezwa kwezixhobo zokunciphisa ingxolo kumgca ngamnye, njengeekhoyili ezixutywayo kunye ne-capacitors.
2.6 Beka amacandelo edijithali kunye ne-decoupling capacitors:
a) Amacandelo edijithali abekwe kunye ukunciphisa ubude bocingo;
b) Beka i-0.1uF decoupling capacitor phakathi konikezelo lwamandla kunye nomhlaba we-IC, kwaye ugcine iingcingo ezidibanisayo zimfutshane kangangoko ukunciphisa i-EMI;
c) Kwiimodyuli zebhasi ezihambelanayo, amacandelo asondelelene
Isidibanisi sibekwe emaphethelweni ukuthobela umgangatho wojongano lwebhasi yesicelo, njengobude bomgca webhasi ye-ISA bukhawulelwe kwi-2.5in;
d) Kwiimodyuli ze-serial DTE, i-interface yesekethe isondele kwi-Connector;
e) Isekethe ye-crystal oscillator kufuneka isondele kangangoko kunokwenzeka kwisixhobo sayo sokuqhuba.
2.7 Iingcingo eziphantsi kwendawo nganye zidla ngokudityaniswa kwindawo enye okanye ngaphezulu kunye ne-0 Ohm resistors okanye ubuhlalu.
3. Umzila womqondiso
3.1 Kwindlela yemodem yokuhambisa umqondiso, imigca yesignali ethanda ukuba ingxolo kunye nemigca yesignali esesichengeni sokuphazamiseka kufuneka igcinwe kude kangangoko kunokwenzeka.Ukuba ayinakuthintelwa, sebenzisa umgca wesignali ongathathi hlangothi ukuze uwahlukanise.
3.2 Iingcingo zesignali yedijithali kufuneka zibekwe kwindawo yocingo lwedijithali kangangoko kunokwenzeka;
I-wiring yesignali ye-analog kufuneka ibekwe kwindawo ye-wiring ye-analog kangangoko kunokwenzeka;
(Imikhondo yokwahlukaniswa inokubekwa kwangaphambili ukuba ithintelwe ukunqanda imikhondo ekuphumeni kwindawo yokuphuma)
Iimpawu zedijithali zedijithali kunye neempawu zeempawu ze-analog zi-perpendicular ukunciphisa ukudibanisa.
3.3 Sebenzisa imikhondo eyodwa (idla ngokuba phantsi) ukuvala ulandelelwano lweempawu ze-analog kwindawo yomzila we-analog.
a) Imizila eyodwa yomhlaba kwindawo ye-analog icwangciswe kumacala omabini ebhodi ye-PCB ejikeleze indawo ye-wiring ye-analog, kunye nobubanzi bomgca we-50-100mil;
b) Imikhondo ekwanti yasemhlabeni kwindawo yedijithali ijikeleziswa kwindawo yocingo lwedijithali kumacala omabini ebhodi yePCB, enobubanzi bomgca obuyi-50-100mil, kunye nobubanzi becala elinye lebhodi yePCB kufuneka ibe yi-200mil.
3.4 Ububanzi bomgca wesignali yebhasi ehambelanayo > 10mil (ngokubanzi 12-15mil), njenge /HCS, /HRD, /HWT, /RESET.
3.5 Ububanzi bomgca weempawu zempawu ze-analog yi> 10mil (ngokubanzi i-12-15mil), njenge-MICM, MICV, SPKV, VC, VREF, TXA1, TXA2, RXA, TELIN, TELOUT.
3.6 Zonke ezinye iimpawu zomqondiso kufuneka zibe banzi kangangoko kunokwenzeka, ububanzi bomgca kufuneka bube>5mil (10mil ngokubanzi), kwaye ulandelelwano phakathi kwamacandelo kufuneka lube lufutshane kangangoko (uqwalaselo lwangaphambili kufuneka luqwalaselwe xa ubeka izixhobo).
3.7 Ububanzi bomgca we-bypass capacitor ukuya kwi-IC ehambelanayo kufuneka ibe>> 25mil, kwaye ukusetyenziswa kwe-vias kufuneka kugwenywe kangangoko kunokwenzeka.3.8 Imigca yesignali edlula kwiindawo ezahlukeneyo (ezifana neempawu eziqhelekileyo zokulawula isantya / isimo) kufuneka dlula kwiingcingo zomhlaba ezizimeleyo kwindawo enye (ekhethwayo) okanye amanqaku amabini.Ukuba umkhondo ukwicala elinye kuphela, umkhondo womhlaba owahlukileyo ungaya kwelinye icala le-PCB ukutsiba umkhondo wophawu kwaye uyigcine iqhubekayo.
3.9 Gwema ukusebenzisa iikona ze-90-degree kwi-high-frequency signal routing, kwaye usebenzise ii-arcs ezigudileyo okanye iikona ze-45-degree.
3.10 Umzila wesignali ye-frequency ephezulu kufuneka unciphise ukusetyenziswa koqhagamshelo.
3.11 Gcina zonke iimpawu zesignali kude nekristali oscillator circuit.
3.12 Kumzila wesignali ye-frequency ephezulu, indlela enye eqhubekayo kufuneka isetyenziswe ukunqanda imeko apho amacandelo amaninzi omzila asuka kwindawo enye.
3.13 Kwisekethe ye-DAA, shiya isithuba esimalunga ne-60mil ubuncinane malunga nokugqobhoza (zonke iileya).
4. Unikezelo lwamandla
4.1 Qinisekisa ubudlelwane boqhagamshelwano lwamandla.
4.2 Kwindawo yombane wedijithali, sebenzisa i-10uF i-electrolytic capacitor okanye i-tantalum capacitor ngokuhambelana ne-0.1uF i-ceramic capacitor uze uyidibanise phakathi kokunikezelwa kwamandla kunye nomhlaba.Beka enye kwisiphelo sokungenisa amandla kunye nesiphelo esikude sebhodi yePCB ukuthintela izikhonkwane zamandla ezibangelwa kukuphazamiseka kwengxolo.
4.3 Kwiibhodi ezinamacala amabini, kwinqanaba elifanayo njengesekethe yokusebenzisa amandla, jikeleza isekethe kunye neetrayisi zamandla kunye nobubanzi bomgca we-200mil kumacala omabini.(Elinye icala kufuneka liqhutywe ngendlela efanayo nomhlaba wedijithali)
4.4 Ngokubanzi, iitrayiti zamandla zibekwe kuqala, kuze emva koko kubekwe imikhondo yemiqondiso.
5. umhlaba
5.1 Kwibhodi ephindwe kabini, iindawo ezingasetyenziswanga ezijikelezayo kunye nangaphantsi kwezixhobo zedijithali kunye ne-analog (ngaphandle kwe-DAA) zizaliswe kwiindawo zedijithali okanye ze-analog, kwaye iindawo ezifanayo zoluhlu ngalunye zixhunyiwe kunye, kwaye iindawo ezifanayo zamacandelo ahlukeneyo adibeneyo. idibaniswe nge-multiple vias : I-pin ye-Modem ye-DGND ixhunyiwe kwindawo yomhlaba wedijithali, kwaye i-AGND pin ixhunyiwe kwindawo yomhlaba we-analog;indawo yomhlaba wedijithali kunye nommandla womhlaba we-analog uhlukaniswe ngumsantsa othe tye.
5.2 Kwibhodi enemigangatho emine, sebenzisa iindawo ezisezantsi zedijithali kunye ne-analog ukugubungela amacandelo edijithali kunye ne-analog (ngaphandle kwe-DAA);i-pin ye-Modem ye-DGND ixhunywe kwindawo yomhlaba wedijithali, kwaye i-AGND pin ixhunyiwe kwindawo yomhlaba we-analog;indawo yomhlaba wedijithali kunye nommandla womhlaba we-analog zisetyenziselwa ukuhlukaniswa ngumsantsa othe tye.
5.3 Ukuba isihluzi se-EMI siyafuneka kuyilo, indawo ethile kufuneka igcinwe kwi-socket ye-interface.Uninzi lwezixhobo ze-EMI (amaso / i-capacitors) zinokufakwa kule ndawo;idityaniswe kuyo.
5.4 Umbane wemodyuli esebenzayo nganye mawuhlulwe.Iimodyuli ezisebenzayo zingahlula zibe: i-interface yebhasi ehambelanayo, umboniso, isiphaluka sedijithali (i-SRAM, i-EPROM, i-Modem) kunye ne-DAA, njl.
5.5 Kwiimodyuli ze-serial DTE, sebenzisa i-decoupling capacitors ukunciphisa ukudibanisa amandla, kwaye wenze okufanayo kwiintambo zefowuni.
5.6 Ucingo olusezantsi luqhagamshelwe ngenqaku elinye, ukuba kunokwenzeka, sebenzisa iBead;ukuba kuyimfuneko ukucinezela i-EMI, vumela ucingo lomhlaba ukuba ludibaniswe kwezinye iindawo.
5.7 Zonke iingcingo zomhlaba kufuneka zibe banzi kangangoko, 25-50mil.
5.8 Umkhondo we-capacitor phakathi kwawo wonke umbane/umhlaba we-IC kufuneka ube mfutshane kangangoko, kwaye kungabikho mingxunya edlulayo ekufuneka isetyenziswe.
6. I-Crystal oscillator circuit
6.1 Zonke iimpawu ezixhunywe kwii-terminal ze-input / output ze-crystal oscillator (ezifana ne-XTLI, i-XTLO) kufuneka zibe zifutshane kangangoko kunokwenzeka ukunciphisa impembelelo yokuphazamiseka kwengxolo kunye nokusabalalisa i-capacitance kwi-Crystal.Umkhondo we-XTLO kufuneka ube mfutshane ngokusemandleni, kwaye i-angle yokugoba akufanele ibe ngaphantsi kwama-45 degrees.(Ngenxa yokuba i-XTLO iqhagamshelwe kumqhubi onokunyuka ngokukhawuleza kwexesha kunye nokuphezulu kwangoku)
6.2 Akukho mgangatho womhlaba kwibhodi ephindwe kabini, kwaye ucingo lomhlaba we-crystal oscillator capacitor kufuneka ludibaniswe kwisixhobo kunye nocingo olufutshane olubanzi kangangoko kunokwenzeka.
I-pin ye-DGND ekufutshane ne-crystal oscillator, kwaye unciphise inani le-vias.
6.3 Ukuba kunokwenzeka, yicole ilitye lekristale.
6.4 Qhagamshela i-100 Ohm resistor phakathi kwe-XTLO pin kunye ne-crystal/capacitor node.
6.5 Umhlaba we-crystal oscillator capacitor uqhagamshelwe ngokuthe ngqo kwiphini ye-GND yeModem.Ungasebenzisi indawo ephantsi okanye umkhondo womhlaba ukudibanisa i-capacitor kwi-pin ye-GND yeModem.
7. Uyilo lweModem oluzimeleyo usebenzisa i-EIA/TIA-232 interface
7.1 Sebenzisa ityesi yentsimbi.Ukuba iqokobhe leplastiki liyafuneka, ifoyile yentsimbi kufuneka incamathelwe ngaphakathi okanye imathiriyeli eqhubayo kufuneka itshizwe ukunciphisa i-EMI.
7.2 Beka ii-Chokes zepateni efanayo kwintambo yombane nganye.
7.3 Amacandelo abekwe kunye kwaye asondele kwi-Connector ye-EIA/TIA-232 interface.
7.4 Zonke izixhobo ze-EIA/TIA-232 ziqhagamshelwe ngokwahlukeneyo kumandla/umhlaba osuka kumthombo wamandla.Umthombo wamandla/umhlaba kufuneka ube yitheminali yegalelo lamandla ebhodini okanye i-terminal ephumayo yetshiphu yolawulo lombane.
7.5 EIA/TIA-232 umqondiso wentambo yomgangatho kumhlaba wedijithali.
7.6 Kwiimeko ezilandelayo, i-EIA/TIA-232 cable shield ayifuni kuqhagamshelwa kwiqokobhe leModem;uqhagamshelwano olungenanto;idityaniswe kumhlaba wedijithali ngentsimbi;intambo ye-EIA/TIA-232 iqhagamshelwe ngokuthe ngqo kumhlaba wedijithali xa ikhonkco lamagnetic libekwe kufutshane neqokobhe leModem.
8. I-wiring ye-VC kunye ne-VREF i-circuit capacitors kufuneka ibe yifutshane kangangoko kwaye ibekwe kwindawo engathathi hlangothi.
8.1 Qhagamshela i-terminal evumayo ye-10uF VC electrolytic capacitor kunye ne-0.1uF VC capacitor kwi-VC pin (PIN24) yeModem ngocingo olwahlukileyo.
8.2 Qhagamshela i-terminal enegetive ye-10uF VC electrolytic capacitor kunye ne-0.1uF VC capacitor kwi-AGND pin (PIN34) yeModem ngeBead kwaye usebenzise ucingo oluzimeleyo.
8.3 Qhagamshela i-terminal evumayo ye-10uF VREF i-electrolytic capacitor kunye ne-0.1uF VC capacitor kwi-VREF pin (PIN25) yeModem ngocingo olwahlukileyo.
8.4 Qhagamshela i-terminal enegetive ye-10uF VREF i-electrolytic capacitor kunye ne-0.1uF VC capacitor kwi-VC pin (PIN24) yeModem ngomkhondo ozimeleyo;Qaphela ukuba izimele kumkhondo we-8.1.
VREF ——+———+
┿ 10u ┿ 0.1u
VC ——+———+
┿ 10u ┿ 0.1u
+——–+—–~~~~~—+ AGND
I-Bead esetyenzisiweyo kufuneka ihlangane:
Ukuphazamiseka = 70W kwi-100MHz ;;
ulinganiso lwangoku = 200mA;;
Ubukhulu bokumelana = 0.5W.
9. Ifowuni kunye ne-Handset interface
9.1 Beka i-Choke kujongano phakathi kweTip kunye neRingi.
9.2 Indlela yokuqhawula umnxeba iyafana naleyo yombane, usebenzisa iindlela ezinjengokudibanisa inductance, choke, kunye ne-capacitor.Nangona kunjalo, ukuchithwa komgca wefowuni kunzima kakhulu kwaye kuphawuleka ngakumbi kunokutshatyalaliswa kombane.Umkhuba jikelele kukugcina izikhundla zezi zixhobo ukulungiswa ngexesha lokusebenza / isiqinisekiso sovavanyo lwe-EMI.
Ixesha lokuposa: May-11-2023