Iyintoni imbonakalo kunye nokwakhiwa kwebhodi yesekethe eprintiweyo?

Ukuqamba

Iibhodi yesekethe yangokuikakhulu yenziwe ngoku kulandelayo
Umgca kunye nepateni (iPattern): Umgca usetyenziswa njengesixhobo sokuqhuba phakathi kwezinto zokuqala.Kuyilo, indawo enkulu yobhedu iya kuqulunqwa njengesiseko kunye nomgangatho wokubonelela ngamandla.Imigca kunye nemizobo yenziwa ngaxeshanye.
I-Dielectric layer: isetyenziselwa ukugcina ukugquma phakathi kwemigca kunye nemigangatho, eyaziwa ngokuba yi-substrate.
Ngemingxuma / vias: Ngokusebenzisa imingxunya unokwenza ngaphezulu kweengqimba ezimbini zeesekethe eziqhuba kunye enye kwenye, ezinkulu ngokusebenzisa imingxuma zisetyenziswa njengenxalenye yeeplagi-ins, kwaye imingxuma engaphumeleli (nPTH) idla ngokusetyenziswa njengezinto zokuxhoma phezulu ezisetyenziselwa ukulungisa izikrufu ngexesha lokuhlanganisa.I-Solder resistant / Solder Mask: Ayizizo zonke iindawo zobhedu ezifuna ukutya iinxalenye zetoti, ngoko ke iindawo ezingezizo itoti ziya kuprintwa ngomaleko wezinto (ngokuqhelekileyo i-epoxy resin) eyahlula umphezulu wobhedu ekutyeni inkonkxa. .Isiphaluka esifutshane phakathi kwemigca engayityi itoti.Ngokweenkqubo ezahlukeneyo, ihlulwe ibe yioli eluhlaza, ioli ebomvu kunye neoli eluhlaza okwesibhakabhaka.
Isikrini sesilika (Ibali/iMakiko/isikrini seSilika): Eli licandelo elingabalulekanga.Umsebenzi oyintloko kukuphawula igama kunye nesakhelo sesikhundla secandelo ngalinye kwibhodi yesiphaluka, ekulungele ukugcinwa kunye nokuchongwa emva kwendibano.
I-Surface Finish: Ekubeni indawo yobhedu i-oxidized ngokulula kwindawo eqhelekileyo, ayikwazi ukutshizwa (i-solderability embi), ngoko iya kukhuselwa kwindawo yobhedu efuna ukutya i-tin.Iindlela zokukhusela zibandakanya i-spray tin (HASL), igolide yekhemikhali (ENIG), isilivere (iSiliva yokuImmersion), i-tin (i-Immersion Tin), i-agent ye-solder ye-organic solder (i-OSP), indlela nganye inenzuzo kunye nokungonakali, ngokudibeneyo ekubhekiselwa kuyo njengonyango lomhlaba.

Umphandle

Ibhodi engenanto (engenazo iinxalenye kuyo) ikwabizwa ngokuba yi “Printed Wiring Board (PWB)”.Isiseko sebhodi yebhodi ngokwayo yenziwe ngezinto ezikhuselayo ezingenakugoba lula.Izinto eziphathekayo zesekethe ezinqabileyo ezinokubonwa phezu komhlaba ziyi-foil yobhedu.Ekuqaleni, i-foil yobhedu yayigubungela yonke ibhodi, kodwa inxalenye yayo yabhalwa ngexesha lenkqubo yokuvelisa, kwaye inxalenye eseleyo yaba yi-mesh-like thin circuit..Ezi migca zibizwa ngokuba ziipateni zomqhubi okanye iingcingo, kwaye zisetyenziselwa ukunika uqhagamshelo lombane kumacandelo akwi-PCB.
Ngokuqhelekileyo umbala we-PCB uluhlaza okanye umdaka, umbala we-mask ye-solder.Ingumaleko okhuselayo okhuselayo, onokukhusela ucingo lobhedu, uthintele isiphaluka esifutshane esibangelwa yi-soldering wave, kwaye ugcine isixa se-solder.Isikrini sesilika sikwaprintwa kwimaski ye-solder.Ngokuqhelekileyo, okubhaliweyo kunye neesimboli (ubukhulu becala ezimhlophe) ziprintwa kule nto ukubonisa indawo yecandelo ngalinye ebhodini.Icala loshicilelo lwesikrini likwabizwa ngokuba licala lelegend.
Kwimveliso yokugqibela, iisekethe ezidibeneyo, i-transistors, i-diodes, i-passive components (ezifana ne-resistors, i-capacitors, i-connectors, njl.) kunye nezinye iindawo ezahlukeneyo ze-elektroniki zifakwe kuyo.Ngokudityaniswa kweengcingo, ukudityaniswa kweempawu ze-elektroniki kunye nemisebenzi efunekayo inokusekwa.