I-PCBA sisishunqulelo se-Printed Circuit Board Assembly ngesiNgesi, oko kukuthi, ibhodi ye-PCB engenanto idlula kwindawo ephezulu ye-SMT, okanye yonke inkqubo ye-DIP plug-in, ebizwa ngokuba yi-PCBA.Le yindlela esetyenziswa ngokuqhelekileyo e-China, ngelixa indlela esemgangathweni eYurophu naseMelika yi-PCB' A, yongeza "'", ebizwa ngokuba sisithethi esisemthethweni.
Ibhodi yesekethe eprintiweyo, eyaziwa ngokuba ibhodi yesekethe eprintiweyo, ibhodi yesekethe eprintiweyo, idla ngokusebenzisa isishunqulelo IsiNgesi PCB (Ibhodi yesekethe eprintiweyo), licandelo elibalulekileyo elektroniki, ukuxhasa amacandelo elektroniki, kunye nomboneleli uqhagamshelo lwesekethe kumacandelo elektroniki.Ngenxa yokuba yenziwe kusetyenziswa ubuchule bokushicilela be-elektroniki, ibizwa ngokuba yibhodi yesekethe "eprintiweyo".Ngaphambi kokubonakala kweebhodi zeesekethe eziprintiweyo, ukudibanisa phakathi kwamacandelo e-elektroniki kuxhomekeke ekudibaneni ngokuthe ngqo kweengcingo ukwenza isiphaluka esipheleleyo.Ngoku, iphaneli yesekethe ikhona kuphela njengesixhobo esisebenzayo sovavanyo, kwaye ibhodi yesekethe eprintiweyo ibe sisikhundla esigqwesileyo kwishishini le-elektroniki.Ekuqaleni kwenkulungwane yama-20, ukuze kube lula ukuveliswa koomatshini be-elektroniki, ukunciphisa iingcingo phakathi kwamalungu ombane, nokunciphisa iindleko zokuvelisa, abantu baqalisa ukufunda indlela yokutshintsha iingcingo ngokushicilela.Kwiminyaka engama-30 edlulileyo, iinjineli ziye zacebisa ngokuqhubekayo ukongeza ii-conductor zetsimbi kwi-insulating substrates ze-wiring.Eyona mpumelelo yayingowe-1925, uCharles Ducas waseUnited States waprinta iipatheni zesekethe kwi-insulating substrates, emva koko waseka ngempumelelo iiconductors zokufakwa kweengcingo nge-electroplating.
Kuze kube ngo-1936, uPaul Eisler waseAustria (uPaul Eisler) wapapasha iteknoloji yefilimu ye-foil e-United Kingdom.Wasebenzisa ibhodi yesekethe eprintiweyo kwisixhobo sikanomathotholo;Kusetyenziswe ngempumelelo ilungelo elilodwa lomenzi wechiza kwindlela yokuvuthela kunye nokufaka iintambo (iPatent No. 119384).Phakathi kwezi zibini, indlela kaPaul Eisler ifana kakhulu neebhodi zeesekethe eziprintiweyo zanamhlanje.Le ndlela ibizwa ngokuba yindlela yokuthabatha, oko kukuthi ukususa isinyithi esingeyomfuneko;ngelixa indlela kaCharles Ducas kunye noMiyamoto Kinosuke kukongeza kuphela isinyithi esifunekayo.I-wiring ibizwa ngokuba yindlela yokongeza.Nangona kunjalo, ngenxa yokuba amacandelo e-elektroniki ngelo xesha avelisa ubushushu obuninzi, ii-substrates ezimbini kwakunzima ukuzisebenzisa kunye, ngoko kwakungekho kusetyenziswa ngokusemthethweni, kodwa kwakhona kwenza iteknoloji yesekethe eprintiweyo inyathelo eliya phambili.
Imbali
Ngo-1941, iUnited States yapeyinta intlama yobhedu kwi-talc ukwenzela iintambo ukwenza iifusi ezikufutshane.
Ngowe-1943, abantu baseMerika basebenzisa le teknoloji kakhulu kwiirediyo zasemkhosini.
Ngomnyaka we-1947, i-epoxy resins yaqala ukusetyenziswa njenge-substrates yokuvelisa.Kwangelo xesha, i-NBS yaqala ukufunda itekhnoloji yokuvelisa efana neekhoyili, ii-capacitors, kunye nezichasi ezenziwe bubuchwephesha besekethe eprintiweyo.
Ngowe-1948, iUnited States yavuma ngokusemthethweni ukuveliswa korhwebo.
Ukusukela ngeminyaka yee-1950s, ii-transistors ezinemveliso yobushushu obuphantsi ziye zathatha indawo yetyhubhu zevacuum, kwaye itekhnoloji yebhodi yesekethe eprintiweyo sele iqalisile ukusetyenziswa ngokubanzi.Ngelo xesha, itekhnoloji ye-etching foil yayiyeyona nto iphambili.
Ngowe-1950, iJapan yasebenzisa ipeyinti yesilivere yokufakwa kweengcingo kwiinxalenye zeglasi;kunye ne-copper foil kwi-wiring kwiphepha le-phenolic substrates (CCL) eyenziwe nge-phenolic resin.
Ngomnyaka we-1951, ukubonakala kwe-polyimide kwenza ukuxhathisa ukushisa kwe-resin inyathelo eliya phambili, kunye ne-polyimide substrates zenziwa.
Ngo-1953, i-Motorola yavelisa indlela ephindwe kabini ehlanganiswe ngomngxuma.Le ndlela iphinda isetyenziswe kwiibhodi zesekethe ze-multi-layer kamva.
Ngeminyaka yee-1960, emva kokuba ibhodi yesekethe eprintiweyo isetyenziswe ngokubanzi iminyaka eyi-10, iteknoloji yayo iye yakhula ngakumbi.Ekubeni ibhodi ye-Motorola yecala eliphindwe kabini yaphuma, iibhodi zesekethe eziprintiweyo ezininzi zaqala ukubonakala, eziye zandisa umlinganiselo we-wiring kwindawo ye-substrate.
Ngowe-1960, u-V. Dahlgreen wenza ibhodi yesekethe eguquguqukayo eprintiweyo ngokunamathisela ifilimu yentsimbi yentsimbi eprintwe ngesekethe kwiplastiki ye-thermoplastic.
Ngomnyaka we-1961, i-Hazeltine Corporation yase-United States ibhekiselele kwi-electroplating ngokusebenzisa i-hole indlela yokuvelisa iibhodi ezininzi.
Ngowe-1967, "iteknoloji yePlated-up", enye yeendlela zokwakha iileyile, yapapashwa.
Ngo-1969, i-FD-R yenza iibhodi zesekethe eziguquguqukayo eziprintiweyo ezine-polyimide.
Ngowe-1979, iPactel yapapasha "indlela yePactel", enye yeendlela zokongeza.
Ngowe-1984, i-NTT yavelisa "Indlela yeCopper Polyimide" kwiisekethe zefilimu ezincinci.
Ngo-1988, i-Siemens yavelisa ibhodi yesekethe eprintiweyo ye-Microwiring Substrate.
Kwi-1990, i-IBM yavelisa ibhodi yesekethe eprintiweyo "i-Surface Laminar Circuit" (i-Surface Laminar Circuit, SLC) ibhodi yesekethe eprintiweyo.
Ngowe-1995, iMatsushita Electric yavelisa ibhodi yesekethe eprintiweyo ye-ALIVH.
Ngo-1996, uToshiba wavelisa ibhodi yesekethe eprintiweyo yeB2it.
Ixesha lokuposa: Feb-24-2023