Iibhodi zesekethe eziprintiweyo (PCBs) ziyinxalenye yezixhobo zombane zanamhlanje, ezisebenza njengomqolo wamacandelo kunye noqhagamshelo oluvumela izixhobo zombane ukuba zisebenze ngokufanelekileyo. Ukwenziwa kwePCB, ekwabizwa ngokuba yi-PCB eyenziweyo, yinkqubo entsonkothileyo ebandakanya amanqanaba amaninzi ukusuka kuyilo lokuqala ukuya kwindibano yokugqibela. Kule post yebhlog, siza kuntywila nzulu kwinkqubo yokwenziwa kwePCB, sijonga inyathelo ngalinye kunye nokubaluleka kwalo.
1. Uyilo kunye noyilo
Inyathelo lokuqala kukwenziwa kwePCB kukuyila uyilo lwebhodi. Iinjineli zisebenzisa isoftware yoyilo oluncediswa yikhompyuter (CAD) ukwenza imizobo ecwangcisiweyo ebonisa uqhagamshelo kunye neendawo zamacandelo. Uyilo lubandakanya ukubeka kakuhle indawo yokulandela umkhondo, iipads, kunye ne-vias ukuqinisekisa ukuphazamiseka okuncinci kunye nokuhamba komqondiso okusebenzayo.
2. Ukukhetha izinto eziphathekayo
Ukukhetha izinto zePCB kubalulekile ekusebenzeni kwayo kunye nokuqina. Izinto eziqhelekileyo ziquka i-fiberglass eyomeleziweyo ye-epoxy laminate, ebizwa ngokuba yi-FR-4. Umaleko wobhedu kwibhodi yesekethe ubalulekile ekuqhubeni umbane. Ubunzima kunye nomgangatho wobhedu osetyenziswayo kuxhomekeke kwiimfuno ezithile zesekethe.
3. Lungisa i-substrate
Emva kokuba ukucwangciswa koyilo kunqunywe kunye nezinto ezikhethiweyo, inkqubo yokuvelisa iqala ngokusika i-substrate kwimilinganiselo efunekayo. Emva koko i-substrate ihlanjululwe kwaye ifakwe ngomqolo wobhedu, yenza isiseko seendlela zokuqhuba.
4. Ukurhabula
Emva kokulungiselela i-substrate, isinyathelo esilandelayo kukususa ubhedu obuninzi ebhodini. Le nkqubo, ebizwa ngokuba yi<em>etching, yenziwa ngokusebenzisa into ekwaziyo ukumelana neasidi ebizwa ngokuba sisigqubuthelo sobuso ukuze kukhuseleke imikhondo yobhedu efunwayo. Indawo engabonakaliyo ibonakaliswe kwisisombululo se-etching, esichitha ubhedu olungafunekiyo, sishiya kuphela umzila wesiphaluka ofunekayo.
5. Ukugrumba
Ukugrumba kubandakanya ukudala imingxuma okanye i-vias kwi-substrate ukuvumela ukubekwa kwecandelo kunye nokudityaniswa kombane phakathi kwamaleko ahlukeneyo ebhodi yesekethe. Oomatshini bokugrumba abakwisantya esiphezulu abaxhotyiswe ngamasuntswana okomba achanekileyo anomatshini wale mingxuma mincinci. Emva kokuba inkqubo yokugaya igqityiwe, imingxuma ifakwe kwizinto eziphathekayo zokuqinisekisa ukudibanisa okufanelekileyo.
6. Ukucwenga kunye nesicelo semaski solder
Iibhodi ezidityanisiweyo zifakwe ngesitya esincinci sobhedu ukuqinisa ukudibanisa kunye nokubonelela ngokufikelela okukhuselekileyo kumacandelo. Emva kokufakwa, imaski ye-solder isetyenziswa ukukhusela umkhondo wobhedu kwi-oxidation kunye nokuchaza indawo ye-solder. Umbala wemaski ye-solder uhlala uluhlaza, kodwa unokwahluka ngokusekwe kukhetho lomenzi.
7. Ukubekwa kwecandelo
Kweli nyathelo, iPCB eyenziweyo ilayishwe ngamacandelo e-elektroniki. Amacandelo afakwe ngononophelo kwiipads eziqinisekisa ukulungelelaniswa okuchanekileyo kunye nokuqhelaniswa. Inkqubo isoloko izenzekela kusetyenziswa oomatshini bokukhetha kunye nendawo ukuqinisekisa ukuchaneka nokusebenza kakuhle.
8. Ukuwelda
Soldering linyathelo lokugqibela kwinkqubo yokwenziwa PCB. Ibandakanya izinto zokufudumeza kunye neepads ukudala uxhulumaniso olunamandla noluthembekileyo lombane. Oku kunokwenziwa kusetyenziswa umatshini amaza soldering, apho ibhodi igqithe ngamaza solder otyhidiweyo, okanye ngobuchule soldering manual kumacandelo antsonkothileyo.
Inkqubo yokwenziwa kwePCB yinkqubo ecokisekileyo ebandakanya izigaba ezininzi zokuguqula uyilo lube yibhodi yesekethe esebenzayo. Ukusuka kuyilo lokuqala kunye noyilo ukuya ekubekweni kwecandelo kunye ne-soldering, inyathelo ngalinye linegalelo ekusebenzeni ngokubanzi kunye nokuthembeka kwePCB. Ngokuqonda iinkcukacha ezintsonkothileyo zenkqubo yokwenziwa kwemveliso, sinokuyixabisa inkqubela-phambili yobuchwepheshe eyenze izixhobo zombane zanamhlanje zaba zincinci, zikhawuleza, kwaye zasebenza kakuhle.
Ixesha lokuposa: Sep-18-2023