Ulwahlulo ukusuka ezantsi ukuya phezulu luhamba ngolu hlobo lulandelayo:
94HB/94VO/22F/CEM-1/CEM-3/FR-4
Iinkcukacha zezi zilandelayo:
I-94HB: Ikhadibhodi eqhelekileyo, ayifuni umlilo (eyona nto iphantsi kakhulu, i-die punching, ayinakusetyenziswa njengebhodi yamandla)
I-94V0: ikhadibhodi ebuyisela idangatye (ukufa ngenqindi)
I-22F: Ibhodi yefayibha yeglasi enecala elinye (i-die punching)
I-CEM-1: Ibhodi ye-fiberglass enecala elinye (kufuneka igrunjwe ngekhompyuter, ingabethwa)
I-CEM-3: Ibhodi ye-semi-fiberglass enecala eliphindwe kabini (ngaphandle kwekhadibhodi emacala amabini, eyona nto iphantsi kakhulu kwiipaneli ezimacala amabini. imitha zitshiphu kuneFR-4)
I-FR-4: Ibhodi ye-fiberglass enamacala amabini
Eyona mpendulo
1.c Ukuhlelwa kweempawu zokubuyiswa komlilo kunokwahlulwa ngokweendidi ezine: 94V—0/V-1/V-2 kunye ne-94-HB
2. Prepreg: 1080=0.0712mm, 2116=0.1143mm, 7628=0.1778mm
3. I-FR4 CEM-3 yibhodi, i-fr4 yibhodi yefiber yeglasi, i-cem3 yi-substrate edibeneyo
4. I-Halogen-free ibhekisela kwizinto ezisisiseko ezingenalo i-halogen (i-fluorine, i-bromine, i-iodine kunye nezinye izinto), kuba i-bromine iya kuvelisa i-gas enetyhefu xa itshiswa, efunekayo ngokukhuselwa kwendalo.
Ntlanu.I-Tg yiqondo lokushisa lokutshintsha kweglasi, oko kukuthi, indawo yokunyibilika.
Ibhodi yesekethe kufuneka ikwazi ukumelana nomlilo, ayikwazi ukutshisa kwiqondo lokushisa elithile, inokuthambisa kuphela.Iqondo lobushushu ngeli xesha libizwa ngokuba yi-glass transition yeqondo lobushushu (i-Tg point), kwaye eli xabiso linxulumene nozinzo lwe-dimensional yebhodi ye-PCB.
Yintoni ibhodi yesekethe yeTg PCB ephezulu kunye neenzuzo zokusebenzisa i-Tg PCB ephezulu
Xa ubushushu beebhodi eziprintiweyo eziphezulu ze-Tg ziphakama kwindawo ethile, i-substrate iya kutshintsha ukusuka "kwi-glass state" ukuya kwi "rubber state", kwaye iqondo lokushisa ngeli xesha libizwa ngokuba yi-glass transition temperature (Tg) yebhodi.Oko kukuthi, i-Tg lelona qondo lobushushu liphezulu (° C.) apho i-substrate ihlala iqinile.Oko kukuthi, izinto eziqhelekileyo ze-substrate ze-PCB azigcini nje ukuthambisa, ukukhubazeka, ukunyibilika, njl. kumaqondo obushushu aphezulu, kodwa kwakhona kubonisa ukuhla kabukhali kwiipropati oomatshini kunye nombane (ndicinga ukuba awufuni ukubona le meko kwiimveliso zakho. ngokujonga kuhlelo lweebhodi zePCB. ).Nceda ungakhupheli umxholo wale ndawo
Ngokubanzi, i-Tg yepleyiti ingaphezulu kwe-130 degrees, i-Tg ephakamileyo idla ngokuba nkulu kune-170 degrees, kwaye i-Tg ephakathi inkulu kune-150 degrees.
Ngokuqhelekileyo, iibhodi eziprintiweyo ze-PCB ezine-Tg ≥ 170 ° C zibizwa ngokuba ziibhodi eziprintiweyo eziphezulu zeTg.
I-Tg ye-substrate iyanda, kwaye ukuchasana nokushisa, ukunyanzeliswa komswakama, ukuchasana kweekhemikhali, kunye nokuzinza kwebhodi eprintiweyo kuya kuphuculwa kwaye kuphuculwe.Ukuphakama kwexabiso le-TG, bhetele ukumelana nokushisa kwebhodi, ngokukodwa kwinkqubo yokukhokela, kukho izicelo eziphezulu ze-Tg.
I-Tg ephezulu ithetha ukumelana nobushushu obuphezulu.Ngophuhliso olukhawulezayo lweshishini lombane, ngakumbi iimveliso zombane ezimelwe ziikhompyuter, ziphuhlisa ukusebenza okuphezulu kunye nemigangatho emininzi ephezulu, efuna ukumelana nobushushu obuphezulu bezinto ezincinci zePCB njengesiqinisekiso esibalulekileyo.Ukuvela kunye nophuhliso lobuchwephesha obuphezulu obuphezulu obumelwe yi-SMT kunye ne-CMT buye benza i-PCB ngakumbi kwaye ingahlukani nenkxaso yokumelana nokushisa okuphezulu kwe-substrate ngokubhekiselele kwi-aperture encinci, umgca ococekileyo, kunye nokunciphisa.
Ngoko ke, umahluko phakathi kwe-FR-4 jikelele kunye ne-Tg FR-4 ephezulu kukuba amandla omatshini, ukuzinza kwe-dimensional, ukunamathela, ukuxutywa kwamanzi, kunye nokuchithwa kwe-thermal ye-thermal kwimo eshushu, ngakumbi xa ishushu emva kokufunxa umswakama.Kukho umahluko kwiimeko ezahlukeneyo ezifana nokwandiswa kwe-thermal, kunye neemveliso ze-Tg eziphezulu ngokucacileyo zingcono kunezixhobo eziqhelekileyo ze-PCB substrate.
Kwiminyaka yakutshanje, inani labathengi abafuna iibhodi eziprintiweyo eziphezulu zeTg liye landa unyaka nonyaka.
Ulwazi lwebhodi yePCB kunye nemigangatho (2007/05/06 17:15)
Okwangoku, kukho iindidi ezininzi zeebhodi zobhedu ezisetyenziswa ngokubanzi kwilizwe lam, kwaye iimpawu zabo ziboniswe kwitheyibhile engezantsi: iintlobo zeebhodi ezifakwe ubhedu, ulwazi lweebhodi ezifakwe ubhedu.
Kukho iindlela ezininzi zokwahlula iilaminates ezenziwe ngobhedu.Ngokubanzi, ngokwezinto ezahlukeneyo zokuqinisa ibhodi, inokwahlulwa ibe: isiseko sephepha, isiseko selaphu sebhodi yeglasi yefiber pcb,
Isiseko esihlanganisiweyo (i-CEM series), i-laminated multi-layer base board kunye nesiseko sezinto ezikhethekileyo (i-ceramic, isiseko sentsimbi yentsimbi, njl.) Iindidi ezintlanu.Ukuba isetyenziswe yibhodi _)(^$RFSW#$%T
I-adhesives ye-resin ehlukeneyo ihlelwa, i-CCI esekelwe kwiphepha eliqhelekileyo.Ewe: i-phenolic resin (XPC, XxxPC, FR-1, FR
-2, njl.), i-epoxy resin (FE-3), i-polyester resin kunye nezinye iintlobo.Isiseko selaphu leglasi eqhelekileyo ye-CCL ine-epoxy resin (FR-4, FR-5), okwangoku lolona hlobo lusetyenziswa kakhulu lwesiseko selaphu leglasi yeglasi.Ukongezelela, kukho ezinye ii-resin ezikhethekileyo (i-glass fiber cloth, i-polyamide fiber, i-faber non-woven, njl. njengezinto ezongezelelweyo): i-bismaleimide eguqulelwe i-triazine resin (BT), i-polyimide resin (PI) , i-Diphenylene ether resin (PPO), i-maleic i-anhydride imine-styrene resin (MS), i-polycyanate resin, i-polyolefin resin, njl. Ngokutsho kwe-CCL ye-flame retardant, inokwahlulwa ibe ziindidi ezimbini zeebhodi: i-flame retardant (UL94-VO, UL94-V1) kunye ne-non- i-flame retardant (UL94-HB).Kwiminyaka emibini edlulileyo, ngokugxininiswa ngakumbi ekukhuselweni kwendalo, uhlobo olutsha lweCCL olungenayo i-bromine luye lwahlukana ne-CCL ye-flame-retardant, enokuthiwa "i-CCL ye-flame-retardant ye-CCL".Ngophuhliso olukhawulezayo lwetekhnoloji yemveliso yombane, kukho iimfuno zokusebenza eziphezulu ze-cCL.Ngoko ke, ukusuka kuhlelo lokusebenza lweCCL, yahlulwe kwi-CCL yokusebenza ngokubanzi, i-CCL ephantsi ye-dielectric engaguqukiyo, i-CCL yokumelana nobushushu obuphezulu (ngokubanzi i-L yebhodi ingaphezulu kwe-150 ° C), kunye ne-CCL ephantsi yokwandisa i-thermal (esetyenziswa ngokubanzi kwi-CCL). ukupakisha substrates) ) kunye nezinye iintlobo.Ngophuhliso kunye nenkqubela phambili eqhubekayo yobuchwepheshe be-elektroniki, iimfuno ezintsha zihlala zibekwe phambili kwizinto eziprintiweyo zebhodi engaphantsi, ngaloo ndlela kukhuthazwa uphuhliso oluqhubekayo lwemigangatho yobhedu ye-laminate.Okwangoku, imigangatho ephambili yezinto ze-substrate zilandelayo.
①Imigangatho yeSizwe Okwangoku, imigangatho yelizwe lam yokuhlelwa kwezinto ze-substrate iibhodi zepcb ziquka i-GB/T4721-47221992 kunye ne-GB4723-4725-1992.Umgangatho we-copper clad laminates eTaiwan, eChina ngumgangatho we-CNS, osekelwe kumgangatho we-JIs waseJapan., yakhululwa ngo-1983. gfgfgfggdgeeeejhjj
② Imigangatho ephambili yeminye imigangatho yesizwe yile: umgangatho we-JIS waseJapan, i-ASTM, i-NEMA, i-MIL, i-IPc, i-ANSI, i-UL standard yase-United States, umgangatho we-Bs wase-United Kingdom, umgangatho we-DIN kunye ne-VDE yaseJamani, i-NFC kunye ne-UTE umgangatho. yaseFransi, iCSA yeMigangatho yaseKhanada, umgangatho we-AS waseAustralia, umgangatho weFOCT wangaphambili weSoviet Union, umgangatho we-IEC wamazwe ngamazwe, njl.
Ababoneleli bezinto zoyilo zePCB zoqobo ziqhele ukusetyenziswa ngumntu wonke: Shengyi\Jiantao\International, njl.
● Amaxwebhu amkelweyo: i-protel autocad powerpcb orcad gerber okanye ibhodi yekopi eqinileyo, njl.
● Uhlobo lwepleyiti: CEM-1, CEM-3 FR4, izinto eziphezulu zeTG;
● Ubungakanani bebhodi enkulu: 600mm * 700mm (24000mil * 27500mil)
● Ubukhulu bebhodi yokulungisa: 0.4mm-4.0mm(15.75mil-157.5mil)
● Amanqanaba aphezulu okusebenza: I-16Layers
● Ubukhulu befoyile yobhedu: 0.5-4.0(oz)
● Ukunyamezela ipleyiti egqityiweyo: +/-0.1mm(4mil)
● Ukunyamezela idimension ye-Molding: I-Computer milling: 0.15mm (6mil) Die stamping: 0.10mm (4mil)
● Ubuncinane bobubanzi bomgca/isithuba: 0.1mm (4mil) Isakhono sokulawula ububanzi bomgca: ＜+-20%
● Ubuncinane bokomba bedayamitha yemveliso egqityiweyo: 0.25mm (10mil)
Ubuncinci bomngxunya obugqityiweyo ubuncinci bedayamitha: 0.9mm (35mil)
Ukunyamezela umngxuma ogqityiweyo: PTH: +-0.075mm (3mil)
NPTH: +-0.05mm (2mil)
● Umngxuma ogqitywe ukutyeba kobhedu: 18-25um (0.71-0.99mil)
● Ubuncinci bepitch ye-SMT: 0.15mm (6mil)
● Ukugquma ubuso: igolide yokuntywiliselwa kweekhemikhali, i-HASL, igolide ye-nickel yebhodi epheleleyo (amanzi / igolide ethambileyo), i-silk screen blue glue, njl.
● Ubukhulu bemaski yeSolder ebhodini: 10-30μm (0.4-1.2mil)
● Amandla e-Peel: 1.5N/mm (59N/mil)
● Ukuqina kwemaski yeSolder: ＞5H
● Umthamo wokuplaga weSolder: 0.3-0.8mm (12mil-30mil)
● I-Dielectric engatshintshiyo: ε = 2.1-10.0
● Ukuxhatshazwa kwe-insulation: 10KΩ-20MΩ
● Ukuphazamiseka kophawu: 60 ohm±10％
● Ukothuka kweThermal: 288℃, 10 sec
● I-Warpage yebhodi egqityiweyo: < 0.7%
● Ukusetyenziswa kwemveliso: izixhobo zonxibelelwano, i-automotive electronics, i-instrumentation, inkqubo yokumisa ihlabathi, ikhompyutha, i-MP4, umbane, izixhobo zasekhaya, njl.
Ixesha lokuposa: Mar-30-2023