Yintoni naPCBimigangatho yokuhlola imbonakalo?
1. Ukupakishwa: ukupakishwa kwebhegi yomoya engenambala, ene-desiccant ngaphakathi, ipakishwe ngokuqinileyo
2. Ukuprintwa kwesikrini sesilika: Ukuprintwa kwesikrini sesilika samagama kunye neempawu kumphezulu wePCB kufuneka kucace kwaye kucace, kwaye umbala kufuneka uhambelane nemimiselo, ngaphandle kokushicilela okuphindaphindiweyo, ukuprintwa okulahlekileyo, ukuprintwa okuninzi, ukutenxa kwindawo, kunye ukungaprintwa kakuhle.
3. Umphezulu webhodi yomphetho webhodi: Jonga ukuba kukho amabala, i-sundries, imingxuma, iintsalela ze-tin slag kumphezulu wePCB;ingaba umgangatho webhodi ukrwele kwaye ubonakaliswe kwi-substrate;Kukho iileya, njl.
4. Ii-conductor: Akukho sekethi imfutshane, i-open circuit, i-copper eveziweyo kwi-conductor, ifoyile yobhedu edadayo, iingcingo ezongeziweyo, njl. njl. Umnwe wegolide: ukukhazimla, amaqhuma / amaqamza, amabala, ifoyile yobhedu edadayo, ukugquma komphezulu, iibhulu, ukuncamathela kweplating, njl.
5. Imingxunya: Jonga ngokuchasene nebhetshi yangaphambili yeePCB ezilungileyo ukujonga ukuba akukho mingxunya yokubhola elahlekileyo, imingxuma yokugrumba emininzi, imingxuma evaliweyo, kunye nokutenxa kumngxuma.Imaski ye-Solder: Ungasebenzisa amanzi okuhlamba ibhodi ukuyisula ngexesha lokuhlola ukujonga ukunamathela kwayo, khangela ukuba iya kuwa, ingaba kukho amaqamza, ingaba kukho nayiphi na into yokulungisa, njl. Umbala we-mask solder kufuneka uhlangabezane nemimiselo. .
6. Ukumakisha: umlinganiswa, indawo yesalathiso, inguqulo yemodeli, ukukala komlilo / UL.umgangatho, isahluko sovavanyo lombane, i-nameplate yomenzi, umhla wemveliso, njl.
7. Umlinganiselo wobungakanani: jonga ukuba ubungakanani bePCB engenayo buchazwe kulandelelwano.
Ukuhlolwa kwe-Warpage okanye igophe:
8. Uvavanyo lwe-Solderability: Thatha inxalenye ye-PCB ye-solder yokwenyani, kwaye ukhangele ukuba iinxalenye zinokuthengiswa ngokulula.
Ixesha lokuposa: Apr-12-2023