..1: Zoba umzobo weskim.
..2: Yenza ilayibrari yecandelo.
..3: Ukuseka ubudlelwane bonxibelelwano lwenethiwekhi phakathi kwedayagram yeskim kunye namacandelo ebhodi eprintiweyo.
..4: Indlela kunye nokubekwa.
..5: Yenza idatha yokusetyenziswa kwemveliso yebhodi eprintiweyo kunye nedatha yokusetyenziswa kwemveliso yokubeka.
.. Emva kokumisela indawo kunye nokumila kwamacandelo kwi-PCB, qwalasela uyilo lwePCB.
1. Ngendawo yecandelo, i-wiring iqhutyelwa ngokwendawo yecandelo.Kungumgaqo wokuba i-wiring kwibhodi eprintiweyo ifutshane kangangoko kunokwenzeka.Iimpawu zifutshane, kwaye umjelo kunye nendawo ehlala kuyo incinci, ngoko ke izinga lokudlula liya kuba phezulu.Iingcingo ze-terminal ye-input kunye ne-terminal ephumayo kwibhodi ye-PCB kufuneka izame ukunqanda ukuba kufuphi enye kwenye ngokuhambelanayo, kwaye kungcono ukubeka ucingo lomhlaba phakathi kweengcingo ezimbini.Ukuphepha ukudibanisa ingxelo yesekethe.Ukuba ibhodi eprintiweyo ibhodi ye-multi-layer, isalathiso somzila womgca wesignali woluhlu ngalunye luhluke kwibhodi yebhodi ekufutshane.Kweminye imigca yemiqondiso ebalulekileyo, kufuneka ufikelele kwisivumelwano kunye nomyili womgca, ngokukodwa imigca yeempawu ezihlukeneyo, kufuneka zihanjiswe ngababini, zama ukubenza zihambelane kwaye zivale, kwaye ubude abuhlukanga kakhulu.Onke amacandelo kwi-PCB kufuneka acuthe kwaye enze mfutshane umkhondo kunye noqhagamshelwano phakathi kwamacandelo.Ububanzi obuncinci beentambo kwi-PCB ubukhulu becala bumiselwa ngamandla okuncamathela phakathi kweengcingo kunye ne-substrate ye-insulating layer kunye nexabiso langoku elihamba ngazo.Xa ubukhulu be-foil yobhedu buyi-0.05mm kunye nobubanzi buyi-1-1.5mm, ubushushu abuyi kuba ngaphezu kwama-degrees ama-3 xa kudlula i-current ye-2A.Xa ububanzi bocingo buyi-1.5mm, inokuhlangabezana neemfuno.Kwiisekethe ezidibeneyo, ngakumbi iisekethe zedijithali, i-0.02-0.03mm idla ngokukhethwa.Kakade ke, ukuba nje kuvunyelwe, sisebenzisa iingcingo ezibanzi kangangoko, ingakumbi iingcingo zamandla kunye neengcingo zomhlaba kwi-PCB.Ubuncinci umgama phakathi kweengcingo ngokuyininzi inqunywe ngokuxhatshazwa kwe-insulation kunye ne-voltage yokuphuka phakathi kweengcingo kwimeko embi kakhulu.
Kwezinye iisekethe ezidibeneyo (IC), i-pitch ingenziwa encinci kune-5-8mm ukusuka kumbono weteknoloji.I-bend yocingo oluprintiweyo ngokuqhelekileyo i-arc encinci, kwaye ukusetyenziswa kwee-bends ezingaphantsi kwe-90-degree kufuneka kugwenywe.I-angle echanekileyo kunye ne-angle edibeneyo iya kuchaphazela ukusebenza kombane kwi-high-frequency circuit.Ngamafutshane, i-wiring yebhodi eprintiweyo kufuneka ifane, ixinene kwaye ihambelane.Zama ukuphepha ukusetyenziswa kwefoyile yobhedu yendawo enkulu kwisiphaluka, ngaphandle koko, xa ukushisa kuveliswa ixesha elide ngexesha lokusetyenziswa, i-foil yobhedu iya kwanda kwaye iwele ngokulula.Ukuba ifoyile yobhedu yendawo enkulu kufuneka isetyenziswe, iingcingo ezimilise okwegridi zingasetyenziswa.Itheminali yocingo yipadi.Umngxuma osembindini wepadi mkhulu kunobubanzi besixhobo sokukhokela.Ukuba i-pad inkulu kakhulu, kulula ukwenza i-weld ebonakalayo ngexesha le-welding.Idayamitha engaphandle ye-D yepedi ngokuqhelekileyo ayikho ngaphantsi kwe-(d+1.2) mm, apho u-d iyindawo yokuvula.Kwamanye amacandelo anoxinano oluphezulu, ubuncinci bobubanzi bepadi bunqweneleka (d+1.0) mm, emva kokuba uyilo lwepadi lugqityiwe, isakhelo somgca wesixhobo kufuneka sizotywe malunga nephedi yebhodi eprintiweyo, kwaye okubhaliweyo kunye neempawu kufuneka ziphawulwe ngaxeshanye.Ngokuqhelekileyo, ubude bombhalo okanye isakhelo kufuneka bube malunga ne-0.9mm, kwaye ububanzi bomgca kufuneka bube malunga ne-0.2mm.Kwaye imigca enje ngeteksti ephawulweyo kunye neempawu akufuneki zicinezelwe kwiphedi.Ukuba yibhodi enamaleko amabini, unobumba ongezantsi kufuneka abonise ileyibhile.
Okwesibini, ukwenzela ukuba imveliso eyiliweyo isebenze ngcono kwaye isebenze ngakumbi, i-PCB kufuneka ithathele ingqalelo isakhono sayo sokuchasana nokuphazamiseka kuyilo, kwaye inobudlelwane obusondeleyo kunye nesekethe ethile.
Uyilo lomgca wamandla kunye nomgca womhlaba kwibhodi yesiphaluka kubaluleke kakhulu.Ngokuhambelana nobukhulu bangoku ojikelezayo kwiibhodi zeesekethe ezahlukeneyo, ububanzi bomgca wamandla kufuneka bunyuswe ngokusemandleni ukunciphisa ukuxhatshazwa kwe-loop.Ngexesha elifanayo, ulwalathiso lomgca wamandla kunye nomgca womhlaba kunye neenkcukacha Ulwalathiso lokudluliselwa luhlala lufana.Yiba negalelo ekuphuculeni ukukwazi ukulwa nengxolo yesekethe.Kukho zombini iisekethe ze-logic kunye neesekethe zomgca kwi-PCB, ukwenzela ukuba zahlulwe kangangoko kunokwenzeka.Isekethe ye-low-frequency circuit inokudibaniswa ngokuhambelana nenqaku elilodwa.I-wiring yangempela inokudibaniswa kwichungechunge kwaye emva koko idibaniswe ngokufanayo.Ucingo lomhlaba kufuneka lube lufutshane kwaye lube lukhuni.I-foil yomhlaba yendawo enkulu ingasetyenziselwa ukujikeleza amacandelo aphezulu-frequency.Ucingo lomhlaba kufuneka lube ngqindilili kangangoko.Ukuba ucingo lomhlaba luncinci kakhulu, amandla omhlaba aya kutshintsha ngoku, okuya kunciphisa ukusebenza kwe-anti-ingxolo.Ngoko ke, ucingo lomhlaba kufuneka luqiniswe ukuze lukwazi ukufikelela kumbane ovumelekileyo kwibhodi yesekethe.Ukuba uyilo luvumela ububanzi bocingo lomhlaba ukuba lube ngaphezu kwe-2-3mm, kwiisekethe zedijithali, ucingo lomhlaba lunokulungelelaniswa. iluphu yokuphucula isakhono sokuchasana nengxolo.Kuyilo lwePCB, i-decoupling capacitors ezifanelekileyo ziqwalaselwe ngokubanzi kwiindawo eziphambili zebhodi eprintiweyo.I-10-100uF i-electrolytic capacitor idibaniswe ngaphaya komgca ekupheleni kokufakwa kwamandla.Ngokubanzi, i-0.01PF magnetic chip capacitor kufuneka ilungiswe kufutshane nephini yamandla ye-chip yesekethe edibeneyo enezikhonkwane ezingama-20-30.Kwiichips ezinkulu, ukukhokela kwamandla Kuya kubakho izikhonkwane ezininzi, kwaye kungcono ukongeza i-capacitor decoupling kufuphi nabo.Kwitshiphu enezikhonkwane ezingaphezulu kwama-200, yongeza ubuncinci i-decoupling capacitors kumacala ayo amane.Ukuba i-gap ayinelanga, i-1-10PF tantalum capacitor inokulungiswa kwii-chips ezi-4-8.Kumacandelo anamandla obuthathaka okuthintela ukuphazamiseka kunye nokutshintsha okukhulu kwamandla, i-capacitor decoupling kufuneka idibaniswe ngokuthe ngqo phakathi komgca wamandla kunye nomgca womhlaba wecandelo., Kungakhathaliseki ukuba luhlobo luni lokhokelo oluxhunyiwe kwi-capacitor ngasentla, akulula ukuba lude kakhulu.
3. Emva kokuba icandelo kunye noyilo lwesekethe lwebhodi yesekethe lugqityiwe, uyilo lwenkqubo yalo kufuneka luqwalaselwe ngokulandelayo, ukuze kupheliswe zonke iintlobo zezinto ezimbi ngaphambi kokuqala kwemveliso, kwaye kwangaxeshanye, kuthathelwe ingqalelo ukwenziwa kwemveliso. ibhodi yesekethe ukwenzela ukuvelisa iimveliso ezikumgangatho ophezulu.kunye nemveliso enkulu.
.. Xa uthetha malunga nokumiswa kunye nokufakwa kwee-wiring zamacandelo, ezinye iinkalo zenkqubo yebhodi yesekethe ziye zabandakanyeka.Uyilo lwenkqubo yebhodi yesekethe ikakhulu ukudibanisa ibhodi yesekethe kunye namacandelo esiye sayila ngomgca wemveliso we-SMT, ukuze sifezekise uxhulumaniso olulungileyo lombane kunye nokufezekisa ukubekwa kwendawo yeemveliso zethu eziyilelwe.Uyilo lwePad, iingcingo kunye nokuchasana nokuphazamiseka, njl njl. Kwakhona kufuneka siqwalasele ukuba ngaba ibhodi esiyiyile kulula ukuyivelisa, ingaba inokudityaniswa neteknoloji yendibano yanamhlanje-SMT, kwaye kwangaxeshanye, kuyimfuneko ukuhlangabezana iimeko zokungavumeli iimveliso ezineziphene ukuba ziveliswe ngexesha lemveliso.phezulu.Ngokukodwa, kukho le miba ilandelayo:
I-1: Imigca yokuvelisa i-SMT eyahlukeneyo ineemeko ezahlukeneyo zokuvelisa, kodwa ngokubhekiselele kubukhulu bePCB, ubukhulu bebhodi enye ye-PCB ayikho ngaphantsi kwe-200 * 150mm.Ukuba icala elide lincinci kakhulu, ukunyanzeliswa kunokusetyenziswa, kwaye umlinganiselo wobude ukuya kububanzi ngu-3: 2 okanye 4: 3.Xa ubukhulu bebhodi yesiphaluka bukhulu kune-200 × 150mm, amandla omatshini webhodi yesiphaluka kufuneka athathelwe ingqalelo.
I-2: Xa ubukhulu bebhodi yesiphaluka buncinci kakhulu, kunzima kuyo yonke inkqubo yokuvelisa umgca we-SMT, kwaye akulula ukuvelisa kwiibhetshi.Indlela efanelekileyo kukusebenzisa ifom yebhodi, edibanisa i-2, 4, 6 kunye nezinye iibhodi ezingatshatanga ngokobukhulu bebhodi.Idityaniswe kunye ukwenza ibhodi epheleleyo efanelekileyo kwimveliso yobuninzi, ubungakanani bebhodi yonke kufuneka bufanelekele ubungakanani boluhlu olunamathelayo.
I-3: Ukuze ulungelelanise nokubekwa komgca wokuvelisa, i-veneer kufuneka ishiye uluhlu lwe-3-5mm ngaphandle kwamacandelo, kwaye iphaneli kufuneka ishiye umgca wenkqubo ye-3-8mm.Kukho iintlobo ezintathu zoqhagamshelwano phakathi komphetho wenkqubo kunye ne-PCB: A ngaphandle kokugqithelana, Kukho itanki yokwahlula, i-B inecala kunye netanki yokwahlukana, kwaye i-C inecala kwaye ayikho itanki yokwahlukana.Ixhotyiswe ngezixhobo zenkqubo yokubhoboza.Ngokwemilo yebhodi yePCB, kukho iindlela ezahlukeneyo zeebhodi zejigsaw, ezifana ne-Youtu.Icala lenkqubo yePCB lineendlela ezahlukeneyo zokubeka ngokweemodeli ezahlukeneyo, kwaye ezinye zinemingxuma yokubeka kwicala lenkqubo.Ububanzi bomngxuma ngu-4-5 cm.Ukuthetha ngokuthelekisa, ukuchaneka kokumisa kuphezulu kunoko kwecala, ngoko kukho imodeli enendawo yokubeka umngxuma kufuneka ibonelelwe ngemingxunya yokubeka ngexesha lokusetyenzwa kwePCB, kwaye uyilo lomngxuma kufuneka lube semgangathweni ukuphepha ukuphazamiseka kwimveliso.
4: Ukuze ube nesikhundla esingcono kwaye ufezekise ukuchaneka okuphezulu, kuyimfuneko ukuseta indawo yesalathiso kwi-PCB.Ingaba kukho indawo yesalathiso kunye nokuba ukusetwa kulungile okanye akunjalo kuya kuchaphazela ngokuthe ngqo ukuveliswa kobuninzi bomgca wemveliso ye-SMT.Ubume bendawo yesalathiso ingaba isikwere, isetyhula, unxantathu, njl njl. Kwaye ububanzi kufuneka bube phakathi koluhlu lwe-1-2mm, kunye nokujikeleza kwendawo yesalathiso kufuneka ibe phakathi koluhlu lwe-3-5mm, ngaphandle kwamacandelo kwaye ikhokela.Ngexesha elifanayo, indawo yokubhekisela kufuneka ihambe kakuhle kwaye icwecwe ngaphandle kokungcola.Uyilo lwenqaku lokubhekisela akufanele lusondele kakhulu kumda webhodi, kufuneka kube nomgama we-3-5mm.
I-5: Ukusuka kwimbono yenkqubo yokuvelisa ngokubanzi, ukumila kwebhodi kukhethwa ukuba kufakwe i-pitch-shaped, ngokukodwa kwi-soldering wave.Uxande ukuze kube lula ukuhanjiswa.Ukuba kukho i-groove elahlekileyo kwibhodi ye-PCB, i-groove engekhoyo kufuneka izaliswe ngendlela yenkqubo edge, kwaye ibhodi enye ye-SMT ivumelekile ukuba ibe ne-groove engekho.Kodwa igroove elahlekileyo akulula ukuba ibe nkulu kakhulu kwaye kufuneka ibe ngaphantsi kwe 1/3 yobude becala.
Ixesha lokuposa: May-06-2023