Ukufezekisa ukusebenza kakuhle kweesekethe ze-elektroniki, ukucwangciswa kwamacandelo kunye nokuhamba kweengcingo kubaluleke kakhulu.Ukuze kuyilwe aPCBngomgangatho olungileyo kunye neendleko eziphantsi.Le migaqo jikelele ilandelayo kufuneka ilandelwe:
uyilo
Okokuqala, qwalasela ubungakanani bePCB.Ukuba ubungakanani bePCB bukhulu kakhulu, imigca eprintiweyo iya kuba yinde, i-impedance iya kwanda, amandla okulwa nengxolo aya kuncipha, kwaye iindleko ziya kwanda;ukuba incinci kakhulu, ukutshatyalaliswa kobushushu akuyi kuba kuhle, kwaye imigca esondeleyo iya kuphazamiseka ngokulula.Emva kokumisela ubungakanani bePCB, misela indawo yamacandelo akhethekileyo.Ekugqibeleni, ngokweyunithi esebenzayo yesekethe, onke amacandelo esekethe abekwe.
Xa kumiselwa indawo yamacandelo akhethekileyo, le migaqo ilandelayo kufuneka iqwalaselwe:
① Yenza mfutshane umdibaniso phakathi kwezixhobo ezisebenza rhoqo kangangoko, kwaye uzame ukunciphisa iiparamitha zazo zokusasaza kunye nokuphazamiseka kwe-electromagnetic.Izixhobo ezinokuthi ziphazamiseke azikwazi ukusondelana kakhulu, kwaye igalelo kunye nemveliso kufuneka zigcinwe kude kangangoko kunokwenzeka.
② Kusenokubakho umahluko omkhulu phakathi kwezinto ezithile okanye iingcingo, kwaye umgama phakathi kwazo kufuneka unyuswe ukunqanda ngengozi isiphaluka esifutshane esibangelwa kukukhutshwa.Izixhobo ezinombane ophezulu kufuneka zicwangciswe kwiindawo ezingenakufikeleleka ngokulula ngesandla ngexesha lokulungisa.
③ Izinto ezinobunzima obungaphezulu kwe-15 g kufuneka zilungiswe nezibiyeli emva koko zidityaniswe.Ezo zixhobo zinkulu, ezinzima, kwaye zivelisa ubushushu obuninzi akufanele zifakwe kwibhodi eprintiweyo, kodwa kufuneka zifakwe kwi-chassis ephantsi kwepleyiti yomatshini wonke, kwaye ingxaki yokutshatyalaliswa kobushushu kufuneka ithathelwe ingqalelo.Amacandelo e-thermal kufuneka agcinwe kude nezinto zokufudumeza.
④ Kuyilo lwamacandelo ahlengahlengiswayo anje ngee-potentiometers, iikhoyili eziguquguqukayo ze-inductance, ii-capacitors eziguquguqukayo, kunye nokutshintsha okuncinci, iimfuno zesakhiwo somatshini wonke kufuneka ziqwalaselwe.Ukuba ilungiswe ngaphakathi kumatshini, kufuneka ibekwe kwibhodi eprintiweyo apho ilungele ukulungiswa;ukuba ilungiswa ngaphandle komatshini, indawo yayo kufuneka ilungelelaniswe kwindawo yeqhosha lohlengahlengiso kwipaneli ye-chassis.
Ngokweyunithi esebenzayo yesekethe, xa ubeka onke amacandelo esekethe, le migaqo ilandelayo mayithotyelwe:
① Lungiselela indawo yeyunithi nganye yesekethe esebenzayo ngokwendlela yokuhamba kwesekethe, ukwenzela ukuba i-layout ilungele ukujikeleza komqondiso, kwaye isalathiso somqondiso sigcinwa sihambelana ngokusemandleni.
② Thatha amacandelo angundoqo esekethe nganye esebenzayo njengeziko kwaye wenze uyilo oluyijikelezileyo.Amacandelo kufuneka alungelelaniswe, ngokucocekileyo kwaye ahlanganiswe kwi-PCB, ukunciphisa kunye nokunciphisa umkhondo kunye nokudibanisa phakathi kwamacandelo.
③ Kwiisekethe ezisebenza kwiifrikhwensi eziphezulu, iiparamitha zokusabalalisa phakathi kwamacandelo kufuneka ziqwalaselwe.Ngokuqhelekileyo, isiphaluka kufuneka silungiselele amacandelo ngokuhambelana kangangoko kunokwenzeka.Ngale ndlela, ayisiyonto entle kuphela, kodwa ilula ukuyihlanganisa kunye ne-weld, kwaye kulula ukuyivelisa ngobuninzi.
④Amalungu abekwe kumda webhodi yesekethe ngokuqhelekileyo angabikho ngaphantsi kwe-2 mm ukusuka kumda webhodi yesekethe.Eyona milo ilungileyo yebhodi yesiphaluka ixande.Umlinganiselo womba ngu 3:2 okanye 4:3.Xa ubukhulu bomgangatho webhodi yesekethe bukhulu kune-200 mm✖150 mm, amandla omatshini webhodi yesekethe kufuneka aqwalaselwe.
iingcingo
Imigaqo yile ilandelayo:
① Iingcingo ezisetyenziswa kwiitheminali zegalelo kunye nemveliso kufuneka zithintele ukuba kufutshane kwaye zihambelane enye kwenye kangangoko kunokwenzeka.Kungcono ukongeza ucingo lomhlaba phakathi kwemigca ukuphepha ukudibanisa impendulo.
② Ububanzi obuncinci bocingo lwebhodi yesekethe eprintiweyo ubukhulu becala buchongwa ngamandla okubambelela phakathi kocingo kunye ne-insulating substrate kunye nexabiso langoku elihamba ngazo.
Xa ubukhulu be-foil yobhedu bu-0.05 mm kunye nobubanzi bu-1 ukuya kwi-15 mm, ubushushu abuyi kuba ngaphezulu kwe-3 ° C ngokusebenzisa i-current ye-2 A, ngoko ububanzi bocingo buyi-1.5 mm ukuhlangabezana neemfuno.Kwiisekethe ezidibeneyo, ngokukodwa iisekethe zedijithali, ububanzi bocingo lwe-0.02-0.3 mm ngokuqhelekileyo lukhethwa.Ewe, kangangoko kunokwenzeka, sebenzisa iingcingo ezibanzi, ngakumbi amandla kunye neengcingo zomhlaba.
Ubuncinci bezithuba zee-conductors buchongwa ngokukodwa ngokuxhatshazwa kwe-insulation embi kakhulu phakathi kwemigca kunye ne-voltage breakdown.Kwiisekethe ezidibeneyo, ngakumbi iisekethe zedijithali, ngokude nje inkqubo ivumela, i-pitch ingaba yincinci njenge-5-8 um.
③ Iikona zeengcingo eziprintiweyo ngokuqhelekileyo ziyi-arc, ngelixa ii-angles ezifanelekileyo okanye i-angles ezibandakanyiweyo ziyakuchaphazela ukusebenza kombane kwiisekethe eziphezulu ze-frequency.Ukongeza, zama ukunqanda ukusebenzisa indawo enkulu yefoyile yobhedu, kungenjalo, xa ushushu ixesha elide, kulula ukubangela ukuba ifoyile yobhedu yande kwaye iwele.Xa kufuneka kusetyenziswe indawo enkulu ye-foil yobhedu, kungcono ukusebenzisa imilo yegridi, enenzuzo yokuphelisa igesi eguquguqukayo eyenziwa yi-adhesive phakathi kwe-foil yobhedu kunye ne-substrate xa ishushu.
Iphedi
Umngxuma osembindini wephedi mkhulu kancinane kunobubanzi besixhobo sokukhokela.Ukuba iphedi inkulu kakhulu, kulula ukwenza i-solder edibeneyo.Idayamitha engaphandle ye-D yepadi ngokuqhelekileyo ayikho ngaphantsi kwe-d+1.2 mm, apho u-d yi-diameter yomngxuma okhokelela.Kwiisekethe zedijithali ezinoxinano oluphezulu, ubuncinci bobubanzi bepadi bunokuba ngu-d + 1.0 mm.
PCB ibhodi software ukuhlela
Ixesha lokuposa: Mar-13-2023