Imithetho yoyilo lwePCB:
1. Kwiimeko eziqhelekileyo, onke amacandelo kufuneka acwangciswe kwindawo efanayo yebhodi yesekethe.Kuphela xa amacandelo aphezulu axinene kakhulu apho ezinye izixhobo ezinobude obulinganiselweyo kunye nokuveliswa kobushushu obuphantsi, njengezichasi zetshiphu, ii-chip capacitors, kunye ne-Chip ICs zibekwe kumaleko asezantsi.
2. Ngaphantsi kwesiseko sokuqinisekisa ukusebenza kombane, amacandelo kufuneka abekwe kwigridi kwaye ahlelwe ngokuhambelana nomnye okanye ngokuthe ngqo ukuze ahlambuluke kwaye ahle.Ngokubanzi, amacandelo awavumelekanga ukuba adibane;amacandelo kufuneka acwangciswe ngokudibeneyo, kwaye amacandelo kufuneka alungelelaniswe kwi-layout yonke.Ukuhanjiswa okufanayo kunye noxinaniso olungaguqukiyo.
3. Ubuncinci bezithuba phakathi kweepatheni zepadi ezimeleneyo zamacandelo ahlukeneyo kwibhodi yesekethe kufuneka zibe ngaphezu kwe-1MM.
4. Umgama ukusuka kumda webhodi yesekethe ngokuqhelekileyo ungabi ngaphantsi kwe-2MM.Ubume obugqwesileyo bebhodi yesekethe luxande kunye nomlinganiselo we-3: 2 okanye 4: 3.Xa ubukhulu bebhodi yesekethe bukhulu kune-200MM nge-150MM, ibhodi yesekethe inokuthwala amandla oMatshini.
PCB Designingingqwalasela
(1) Kuphephe ukulungelelanisa imigca yomqondiso ebalulekileyo kumda wePCB, njengewotshi kunye nemiqondiso yokusetha kwakhona.
(2) Umgama phakathi kwe-chassis yocingo oluphantsi kunye nomgca wesignali ubuncinane yi-4 mm;gcina i-spect ratio ye-chassis yocingo lomhlaba ngaphantsi kwe-5: 1 ukunciphisa i-inductance effect.
(3) Sebenzisa umsebenzi we-LOCK ukutshixa izixhobo kunye neentambo ezinezikhundla eziye zamiselwa, ukuze zingaphathwa kakubi kwixesha elizayo.
(4) Ubuncinane bobubanzi bocingo akufunekanga bube ngaphantsi kwe-0.2mm (8mil).Kwiisekethe eziprintiweyo eziphezulu kunye nezichanekileyo ezichanekileyo, ububanzi kunye nezithuba zeengcingo ngokuqhelekileyo ziyi-12mil.
(5) Imigaqo ye-10-10 kunye ne-12-12 ingasetyenziswa kwiingcingo phakathi kwe-IC pins ye-package ye-DIP, oko kukuthi, xa iingcingo ezimbini zidlula phakathi kwezikhonkwane ezimbini, i-pad diameter inokusetwa kwi-50mil, kwaye Ububanzi bomgca kunye nesithuba somgca zombini ziyi-10mil, xa ucingo olunye kuphela ludlula phakathi kwezikhonkwane ezimbini, ububanzi bepadi bunokusetwa ku-64mil, kunye nobubanzi bomgca kunye nesithuba somgca zombini ziyi-12mil.
(6) Xa ububanzi be-pad buyi-1.5mm, ukwenzela ukwandisa amandla e-peeling ye-pad, ungasebenzisa i-pad ende yesetyhula kunye nobude obungekho ngaphantsi kwe-1.5mm kunye nobubanzi be-1.5mm.
(7) Uyilo Xa umkhondo odityaniswe kwiipads uncinci, ukudibanisa phakathi kweepads kunye neetrayisi kufuneka kuqulunqwe kwimilo yethontsi, ukwenzela ukuba iipads zingabi lula ukukhupha kunye neentambo kunye neepads azilula ukuqhawula.
(8) Xa uyila imivalo yobhedu yendawo enkulu, kufuneka kubekho iifestile kwindawo yobhedu, imingxuma yokukhupha ubushushu kufuneka yongezwe, kwaye iifestile kufuneka ziyilwe zibe yimo yemesh.
(9) Nciphisa umdibaniso phakathi kwamacandelo aphezulu-frequency kangangoko kunokwenzeka ukunciphisa iiparamitha zabo zokuhambisa kunye nokuphazamiseka kwe-electromagnetic.Izixhobo ezinokuthi ziphazamiseke azikwazi ukusondelana kakhulu, kwaye igalelo kunye nemveliso kufuneka zigcinwe kude kangangoko kunokwenzeka.
Ixesha lokuposa: Apr-14-2023