Wamkelekile kwiwebhusayithi yethu.

Inkqubo ethile yenkqubo yebhodi yesekethe yePCB

Inkqubo yokwenziwa kwebhodi yePCB inokohlulwa ngokohlulwa ibe ngamanyathelo alishumi elinambini alandelayo.Inkqubo nganye ifuna ukuveliswa kwenkqubo eyohlukeneyo.Kufuneka kuqatshelwe ukuba ukuhamba kwenkqubo yeebhodi ezinezakhiwo ezahlukeneyo zihluke.Le nkqubo ilandelayo yimveliso epheleleyo ye-PCB enemigangatho emininzi.ukuhamba kwenkqubo;

Ekuqaleni.Umaleko wangaphakathi;ikakhulu ngokwenza umaleko wangaphakathi wesekethe yebhodi yesekethe PCB;inkqubo yemveliso yile:
1. Ibhodi yokusika: ukusika i-PCB substrate kwisayizi yemveliso;
2. Unyango lwangaphambili: coca umphezulu we-PCB substrate kwaye ususe ukungcola komhlaba
3. Ifilimu yokucoca: ncamathelisa ifilimu eyomileyo kumphezulu we-PCB substrate ukulungiselela ukuhanjiswa komfanekiso olandelayo;
4. Ukubonakaliswa: Sebenzisa izixhobo zokubonisa ukuveza i-substrate eqhotyoshelweyo yefilimu kunye nokukhanya kwe-ultraviolet, ukwenzela ukuba udlulise umfanekiso we-substrate kwifilimu eyomileyo;
5. DE: I-substrate emva kokuvezwa iphuhlisiwe, ifakwe, kwaye ifilimu isuswe, kwaye emva koko ukuveliswa kwebhodi yangaphakathi kugqityiwe.
Isibini.Uhlolo lwangaphakathi;ubukhulu becala ukuvavanya nokulungisa iisekethe zebhodi;
1. I-AOI: I-AOI yokuskena i-optical scanning, enokuthelekisa umfanekiso webhodi ye-PCB kunye nedatha yebhodi yemveliso elungileyo engenisiweyo, ukuze kufumaneke izikhewu, ukudakumba kunye nezinye izinto ezimbi kumfanekiso webhodi;
2. I-VRS: Idatha yomfanekiso ombi efunyenwe yi-AOI iya kuthunyelwa kwi-VRS ukuze iqwalaselwe ngokutsha ngabasebenzi abafanelekileyo.
3. Iingcingo ezongeziweyo: Songa ucingo lwegolide kwisithuba esisikhewu okanye ukudakumba ukuthintela ukusilela kombane;
Isithathu.Ukucinezela;njengoko igama lisitsho, iibhodi ezininzi zangaphakathi zicinezelwe kwibhodi enye;
1. I-Browning: I-Browning inokunyusa ukunamathela phakathi kwebhodi kunye ne-resin, kunye nokwandisa ukumanzisa kwendawo yobhedu;
2. I-Riveting: Sika i-PP ibe ngamaphepha amancinci kunye nobukhulu obuqhelekileyo ukwenza ibhodi yangaphakathi kunye nePP ehambelanayo ihlangane
3. Ukugqithisa kunye nokucinezela, ukudubula, i-gong edging, i-edging;
Isine.Ukugrumba: ngokweemfuno zabathengi, sebenzisa umatshini wokugrumba ukugrumba imingxuma enobubanzi obahlukeneyo kunye nobukhulu ebhodini, ukuze imingxuma phakathi kweebhodi ingasetyenziselwa ukusetyenzwa okulandelayo kweeplagi, kwaye inokunceda ibhodi ukuba ichithe. ubushushu;

Okwesihlanu, ubhedu oluphambili;ukufakwa kobhedu kwimingxuma egrunjiweyo yebhodi yangaphandle, ukwenzela ukuba imigca yoluhlu ngalunye lwebhodi iqhutywe;
1. Umgca we-Deburring: susa ii-burrs ekupheleni komngxuma webhodi ukukhusela ukufakwa kobhedu okubi;
2. Umgca wokususa iglue: susa i-glue eseleyo emngxunyeni;ukwenzela ukwandisa ukunamathela ngexesha le-micro-etching;
3. Ubhedu olunye (i-pth): Ukufakwa kobhedu emngxunyeni kwenza isiphaluka soluhlu ngalunye lwebhodi yokuqhuba, kwaye ngexesha elifanayo kwandisa ubukhulu bobhedu;
Owesithandathu, umaleko ongaphandle;umaleko wangaphandle uphantse ufana nenkqubo yangaphakathi yesinyathelo sokuqala, kwaye injongo yayo kukuququzelela inkqubo yokulandelela ukwenza isiphaluka;
1. Unyango lwangaphambili: Coca umphezulu webhodi ngokukhetha, ukuxubha kunye nokumisa ukunyusa ukunamathela kwefilimu eyomileyo;
2. Ifilimu yokucoca: ncamathelisa ifilimu eyomileyo kumphezulu we-PCB substrate ukulungiselela ukuhanjiswa komfanekiso olandelayo;
3. Ukubonakaliswa: i-irradiate kunye nokukhanya kwe-UV ukwenza ifilimu eyomileyo ebhodini ifake i-polymerized state kunye ne-unpolymerized state;
4. Uphuhliso: nyibilikisa ifilimu eyomileyo engazange yenziwe i-polymerized ngexesha lenkqubo yokuvezwa, ishiya isithuba;
Okwesixhenxe, ubhedu lwesibini kunye ne-etching;ukufakwa kobhedu okwesibini, ukuqholwa;
1. Ubhedu lwesibini: Ipateni ye-Electroplating, ubhedu lweekhemikhali ezinqamlezileyo kwindawo engagqunywanga ngefilimu eyomileyo emngxunyeni;kwangaxeshanye, ngakumbi ukwandisa conductivity kunye ukutyeba kobhedu, uze uhambe nge tin plating ukukhusela ingqibelelo yesekethe kunye nemingxuma ngexesha etching;
2. I-SES: Faka ubhedu olusezantsi kwindawo encamathiselweyo yefilimu eyomileyo yangaphandle (ifilimu emanzi) ngokusebenzisa iinkqubo ezinjengokususwa kwefilimu, i-etching, kunye ne-tin stripping, kunye nesekethe yangaphandle yomaleko ngoku igqityiwe;

Okwesibhozo, ukuxhathisa i-solder: inokukhusela ibhodi kunye nokuthintela i-oxidation kunye nezinye izinto;
1. Ukulungiswa kwangaphambili: i-pickling, ukuhlamba i-ultrasonic kunye nezinye iinkqubo zokususa i-oxides ebhodini kunye nokwandisa ubuninzi bobhedu;
2. Ushicilelo: Gquma iindawo zebhodi ye-PCB ekungafunekiyo ukuba zithengiswe nge-inki yokuxhathisa i-solder ukudlala indima yokukhusela kunye nokugquma;
3. Ukubhaka kwangaphambili: ukomisa i-solvent kwi-solder yokuxhathisa inki, kwaye kwangaxeshanye uqina i-inki yokuvezwa;
4. Ukubonakaliswa: Ukunyanga i-solder yokumelana ne-inki nge-UV ukukhanya kwe-irradiation, kunye nokwenza i-polymer ephezulu ye-molecular ngokusebenzisa i-photopolymerization;
5. Uphuhliso: susa isisombululo se-sodium carbonate kwi-inki engabonakaliyo;
6. Emva kokubhaka: ukuqinisa ngokupheleleyo inki;
Okwesithoba, isicatshulwa;umbhalo oshicilelweyo;
1. I-Pickling: Coca umphezulu webhodi, susa i-oxidation yomhlaba ukuqinisa ukubambelela kwi-inki yokushicilela;
2. Umbhalo: umbhalo oshicilelweyo, olungele inkqubo ye-welding elandelayo;
Okweshumi, i-OSP yonyango lomphezulu;icala lepleyiti yobhedu engenanto ukuba idityaniswe ifakwe kwifilimu yendalo yokuthintela umhlwa kunye ne-oxidation;
Eleshumi elinanye, ukubumba;imilo yebhodi efunwa ngumthengi iveliswa, ekulungele ukuba umthengi aqhube ukubekwa kwe-SMT kunye nokudibanisa;
Ishumi elinesibini, uvavanyo lophando olubhabhayo;ukuvavanya isiphaluka sebhodi ukuphepha ukuphuma kwebhodi yesiphaluka esifutshane;
Ishumi elinesithathu, i-FQC;uhlolo lokugqibela, isampulu kunye nokuhlolwa okupheleleyo emva kokugqiba zonke iinkqubo;
Ishumi elinesine, ukupakishwa nokuphuma kwindawo yokugcina impahla;vacuum-pakisha ibhodi PCB egqityiweyo, pakisha kunye nenqanawa, kwaye ugqibezele ukuhanjiswa;

Eshicilelweyo yeNdibano yeBhodi yeSekethe PCB


Ixesha lokuposa: Apr-24-2023