Inkqubo yokwenziwa kwebhodi yePCB inokohlulwa ngokohlulwa ibe ngamanyathelo alishumi elinambini alandelayo.Inkqubo nganye ifuna ukuveliswa kwenkqubo eyohlukeneyo.Kufuneka kuqatshelwe ukuba ukuhamba kwenkqubo yeebhodi ezinezakhiwo ezahlukeneyo zihluke.Le nkqubo ilandelayo yimveliso epheleleyo ye-PCB enemigangatho emininzi.ukuhamba kwenkqubo;
Ekuqaleni.Umaleko wangaphakathi;ikakhulu ngokwenza umaleko wangaphakathi wesekethe yebhodi yesekethe PCB;inkqubo yemveliso yile:
1. Ibhodi yokusika: ukusika i-PCB substrate kwisayizi yemveliso;
2. Unyango lwangaphambili: coca umphezulu we-PCB substrate kwaye ususe ukungcola komhlaba
3. Ifilimu yokucoca: ncamathelisa ifilimu eyomileyo kumphezulu we-PCB substrate ukulungiselela ukuhanjiswa komfanekiso olandelayo;
4. Ukubonakaliswa: Sebenzisa izixhobo zokubonisa ukuveza i-substrate eqhotyoshelweyo yefilimu kunye nokukhanya kwe-ultraviolet, ukwenzela ukuba udlulise umfanekiso we-substrate kwifilimu eyomileyo;
5. DE: I-substrate emva kokuvezwa iphuhlisiwe, ifakwe, kwaye ifilimu isuswe, kwaye emva koko ukuveliswa kwebhodi yangaphakathi kugqityiwe.
Isibini.Uhlolo lwangaphakathi;ubukhulu becala ukuvavanya nokulungisa iisekethe zebhodi;
1. I-AOI: I-AOI yokuskena i-optical scanning, enokuthelekisa umfanekiso webhodi ye-PCB kunye nedatha yebhodi yemveliso elungileyo engenisiweyo, ukuze kufumaneke izikhewu, ukudakumba kunye nezinye izinto ezimbi kumfanekiso webhodi;
2. I-VRS: Idatha yomfanekiso ombi efunyenwe yi-AOI iya kuthunyelwa kwi-VRS ukuze iqwalaselwe ngokutsha ngabasebenzi abafanelekileyo.
3. Iingcingo ezongeziweyo: Songa ucingo lwegolide kwisithuba esisikhewu okanye ukudakumba ukuthintela ukusilela kombane;
Isithathu.Ukucinezela;njengoko igama lisitsho, iibhodi ezininzi zangaphakathi zicinezelwe kwibhodi enye;
1. I-Browning: I-Browning inokunyusa ukunamathela phakathi kwebhodi kunye ne-resin, kunye nokwandisa ukumanzisa kwendawo yobhedu;
2. I-Riveting: Sika i-PP ibe ngamaphepha amancinci kunye nobukhulu obuqhelekileyo ukwenza ibhodi yangaphakathi kunye nePP ehambelanayo ihlangane
3. Ukugqithisa kunye nokucinezela, ukudubula, i-gong edging, i-edging;
Isine.Ukugrumba: ngokweemfuno zabathengi, sebenzisa umatshini wokugrumba ukugrumba imingxuma enobubanzi obahlukeneyo kunye nobukhulu ebhodini, ukuze imingxuma phakathi kweebhodi ingasetyenziselwa ukusetyenzwa okulandelayo kweeplagi, kwaye inokunceda ibhodi ukuba ichithe. ubushushu;
Okwesihlanu, ubhedu oluphambili;ukufakwa kobhedu kwimingxuma egrunjiweyo yebhodi yangaphandle, ukwenzela ukuba imigca yoluhlu ngalunye lwebhodi iqhutywe;
1. Umgca we-Deburring: susa ii-burrs ekupheleni komngxuma webhodi ukukhusela ukufakwa kobhedu okubi;
2. Umgca wokususa iglue: susa i-glue eseleyo emngxunyeni;ukwenzela ukwandisa ukunamathela ngexesha le-micro-etching;
3. Ubhedu olunye (i-pth): Ukufakwa kobhedu emngxunyeni kwenza isiphaluka soluhlu ngalunye lwebhodi yokuqhuba, kwaye ngexesha elifanayo kwandisa ubukhulu bobhedu;
Owesithandathu, umaleko ongaphandle;umaleko wangaphandle uphantse ufana nenkqubo yangaphakathi yesinyathelo sokuqala, kwaye injongo yayo kukuququzelela inkqubo yokulandelela ukwenza isiphaluka;
1. Unyango lwangaphambili: Coca umphezulu webhodi ngokukhetha, ukuxubha kunye nokumisa ukunyusa ukunamathela kwefilimu eyomileyo;
2. Ifilimu yokucoca: ncamathelisa ifilimu eyomileyo kumphezulu we-PCB substrate ukulungiselela ukuhanjiswa komfanekiso olandelayo;
3. Ukubonakaliswa: i-irradiate kunye nokukhanya kwe-UV ukwenza ifilimu eyomileyo ebhodini ifake i-polymerized state kunye ne-unpolymerized state;
4. Uphuhliso: nyibilikisa ifilimu eyomileyo engazange yenziwe i-polymerized ngexesha lenkqubo yokuvezwa, ishiya isithuba;
Okwesixhenxe, ubhedu lwesibini kunye ne-etching;ukufakwa kobhedu okwesibini, ukuqholwa;
1. Ubhedu lwesibini: Ipateni ye-Electroplating, ubhedu lweekhemikhali ezinqamlezileyo kwindawo engagqunywanga ngefilimu eyomileyo emngxunyeni;kwangaxeshanye, ngakumbi ukwandisa conductivity kunye ukutyeba kobhedu, uze uhambe nge tin plating ukukhusela ingqibelelo yesekethe kunye nemingxuma ngexesha etching;
2. I-SES: Faka ubhedu olusezantsi kwindawo encamathiselweyo yefilimu eyomileyo yangaphandle (ifilimu emanzi) ngokusebenzisa iinkqubo ezinjengokususwa kwefilimu, i-etching, kunye ne-tin stripping, kunye nesekethe yangaphandle yomaleko ngoku igqityiwe;
Okwesibhozo, ukuxhathisa i-solder: inokukhusela ibhodi kunye nokuthintela i-oxidation kunye nezinye izinto;
1. Ukulungiswa kwangaphambili: i-pickling, ukuhlamba i-ultrasonic kunye nezinye iinkqubo zokususa i-oxides ebhodini kunye nokwandisa ubuninzi bobhedu;
2. Ushicilelo: Gquma iindawo zebhodi ye-PCB ekungafunekiyo ukuba zithengiswe nge-inki yokuxhathisa i-solder ukudlala indima yokukhusela kunye nokugquma;
3. Ukubhaka kwangaphambili: ukomisa i-solvent kwi-solder yokuxhathisa inki, kwaye kwangaxeshanye uqina i-inki yokuvezwa;
4. Ukubonakaliswa: Ukunyanga i-solder yokumelana ne-inki nge-UV ukukhanya kwe-irradiation, kunye nokwenza i-polymer ephezulu ye-molecular ngokusebenzisa i-photopolymerization;
5. Uphuhliso: susa isisombululo se-sodium carbonate kwi-inki engabonakaliyo;
6. Emva kokubhaka: ukuqinisa ngokupheleleyo inki;
Okwesithoba, isicatshulwa;umbhalo oshicilelweyo;
1. I-Pickling: Coca umphezulu webhodi, susa i-oxidation yomhlaba ukuqinisa ukubambelela kwi-inki yokushicilela;
2. Umbhalo: umbhalo oshicilelweyo, olungele inkqubo ye-welding elandelayo;
Okweshumi, i-OSP yonyango lomphezulu;icala lepleyiti yobhedu engenanto ukuba idityaniswe ifakwe kwifilimu yendalo yokuthintela umhlwa kunye ne-oxidation;
Eleshumi elinanye, ukubumba;imilo yebhodi efunwa ngumthengi iveliswa, ekulungele ukuba umthengi aqhube ukubekwa kwe-SMT kunye nokudibanisa;
Ishumi elinesibini, uvavanyo lophando olubhabhayo;ukuvavanya isiphaluka sebhodi ukuphepha ukuphuma kwebhodi yesiphaluka esifutshane;
Ishumi elinesithathu, i-FQC;uhlolo lokugqibela, isampulu kunye nokuhlolwa okupheleleyo emva kokugqiba zonke iinkqubo;
Ishumi elinesine, ukupakishwa nokuphuma kwindawo yokugcina impahla;vacuum-pakisha ibhodi PCB egqityiweyo, pakisha kunye nenqanawa, kwaye ugqibezele ukuhanjiswa;
Ixesha lokuposa: Apr-24-2023