Umahluko phakathi kwetshiphu kunye nebhodi yesekethe

Umahluko phakathi kwetshiphu kunye nebhodi yesekethe:
Ukuqulunqwa kwahlukile: I-Chip: Yindlela yokwenza iisekethe ezincinci (ikakhulukazi zibandakanya izixhobo ze-semiconductor, kubandakanywa amacandelo angenayo, njl.), kwaye idla ngokuveliswa kumphezulu we-semiconductor wafers.ISekethe eDityanisiweyo: Isixhobo sombane esincinci okanye icandelo.
Iindlela ezahlukeneyo zokuvelisa: i-chip: sebenzisa i-crystal silicon wafer enye njengomaleko wesiseko, emva koko sebenzisa ifotolithography, idoping, i-CMP kunye nobunye ubuchwepheshe ukwenza amacandelo afana ne-MOSFETs okanye i-BJTs, emva koko usebenzise ifilimu ebhityileyo kunye nobuchwepheshe beCMP ukwenza iingcingo, ukuze ukuveliswa kwetshiphu kugqityiwe.
Isekethe edibeneyo: Ukusebenzisa inkqubo ethile, i-transistors, i-resistors, i-capacitors, i-inductors kunye namanye amacandelo kunye ne-wiring efunekayo kwisekethe idityaniswe kunye, yenziwe kwi-chips encinci okanye emininzi ye-semiconductor encinci okanye i-dielectric substrates, kwaye emva koko ifakwe ngaphakathi kwityhubhu. iqokobhe.

Yazisa:
Emva kokuba i-transistor yaqanjwa kwaye yaveliswa ngobuninzi, amacandelo ahlukeneyo e-semiconductor ye-solid-state efana ne-diode kunye nee-transistors zisetyenziswe ngokubanzi, zithatha indawo yomsebenzi kunye nendima ye-vacuum tubes kwiisekethe.Embindini nasekupheleni kwenkulungwane yama-20, inkqubela phambili yetekhnoloji yokuvelisa i-semiconductor yenza ukuba iisekethe ezidityanisiweyo zenzeke.Sebenzisa amacandelo e-elektroniki ahlukeneyo ngokuchasene nokudibanisa iisekethe ngesandla.
Iisekethe ezidibeneyo zinokudibanisa inani elikhulu le-microtransistors kwi-chip encinci, eyinkqubela enkulu.Ukwenziwa kobunzima beesekethe ezidibeneyo, ukuthembeka, kunye nendlela yemodyuli yoyilo lwesekethe yaqinisekisa ukwamkelwa ngokukhawuleza kweesekethe ezidityanisiweyo ezisemgangathweni endaweni yoyilo olusebenzisa ii-transistors ezidityanisiweyo.
Iisekethe ezidibeneyo zineenzuzo ezimbini eziphambili ngaphezu kwee-transistors ezicacileyo: iindleko kunye nokusebenza.Ixabiso eliphantsi libangelwa ukuba i-chip inezo zonke iinqununu zayo eziprintiweyo njengeyunithi nge-photolithography, kunokuba yenze i-transistor enye kuphela ngexesha.
Ukusebenza okuphezulu kubangelwa ukutshintshwa ngokukhawuleza kwamacandelo kunye nokusetyenziswa kwamandla aphantsi kuba amacandelo amancinci kwaye asondelene.Ngo-2006, indawo yetshiphu yayisusela kwiimilimitha ezimbalwa ukuya kwi-350mm², kwaye mm² nganye inokufikelela kwisigidi seetransistors.