I-Immersion Gold Multilayer PCB Ibhodi yeSekethe eprintiweyo ene-SMT kunye ne-DIP

Iinkcukacha zeMveliso

Ulwazi Olunxulumeneyo ngakumbi

1.I-SMT lelinye lamacandelo asisiseko kumacandelo e-elektroniki.Ibizwa ngokuba yi-surface Mount technology (okanye iteknoloji yokunyuka komphezulu).Yahlulahlulwe yaba akukho zikhokelo okanye iindlela ezimfutshane.Yindibano yesiphaluka edityaniswa nge-reflow soldering okanye idiphu soldering.Itekhnoloji ikwayeyona teknoloji idumileyo kunye nenkqubo kushishino lweendibano zombane.
Iimpawu: Ii-substrates zethu zingasetyenziselwa ukunikezelwa kwamandla, ukuhanjiswa komqondiso, ukutshatyalaliswa kobushushu, kunye nokubonelela ngesakhiwo.
Iimpawu: Inokumelana nobushushu kunye nexesha lokunyanga kunye ne-soldering.
I-flatness ihlangabezana neemfuno zenkqubo yokuvelisa.
Ilungele umsebenzi wokuphinda usebenze.
Ifanelekile kwinkqubo yokwenziwa kwe-substrate.
Inani eliphantsi le-dielectric kunye nokuchasana okuphezulu.
Izinto ezisetyenziswa ngokuqhelekileyo kwii-substrates zemveliso yethu zisempilweni kwaye zihambelana nokusingqongileyo i-epoxy resins kunye ne-phenolic resins, ezineempawu ezintle zokunqanda amadangatye, iimpawu zobushushu, iimpawu zoomatshini kunye ne-dielectric, kunye neendleko eziphantsi.
Oku kukhankanywe ngasentla kukuba i-substrate eqinile yimeko eqinile.
Iimveliso zethu zikwanazo ii-substrates eziguquguqukayo, ezinokuthi zisetyenziswe ukugcina indawo, ukugoba okanye ukujika, ukushukuma, kwaye zenziwe ngamashiti abhityileyo akhuselayo asebenza kakuhle kakhulu.
Ukungalungi kukuba inkqubo yendibano inzima, kwaye ayifanelekanga kwizicelo ze-micro-pitch.
Ndicinga ukuba iimpawu ze-substrate zizikhokelo ezincinci kunye nesithuba, ubukhulu obukhulu kunye nommandla, ukuhanjiswa kwe-thermal engcono, iipropati eziqinileyo zoomatshini, kunye nokuzinza okungcono.Ndicinga ukuba iteknoloji yokubeka kwi-substrate yintsebenzo yombane, kukho ukuthembeka, iindawo eziqhelekileyo.
Asinayo kuphela ukusebenza ngokuzenzekelayo kunye nokusebenza okudibeneyo, kodwa sinesiqinisekiso esiphindwe kabini sophicotho-zincwadi lwezandla kunye nophicotho lomatshini, kwaye izinga lokupasa kweemveliso liphezulu njenge-99.98%.
2.I-PCB yeyona nxalenye ibalulekileyo ye-elektroniki, kwaye akukho namnye.Ngokuqhelekileyo, iphethini yokuqhuba eyenziwe ngeesekethe eziprintiweyo, amacandelo aprintiweyo okanye indibaniselwano yezi zibini kwizinto ezikhuselayo ngokwe-design predetermined kuthiwa yisekethe eprintiweyo.Iphethini yokuqhuba enikezela uxhulumaniso lombane phakathi kwamacandelo kwi-insulating substrate ibizwa ngokuba yibhodi yesekethe eprintiweyo (okanye ibhodi yesekethe eprintiweyo), eyinkxaso ebalulekileyo kumacandelo e-elektroniki kunye nomthwali onokuthwala amacandelo.
Ndicinga ukuba sihlala sivula ikhibhodi yekhompyutheni ukuze sibone ifilimu ethambileyo (i-flexible insulating substrate) eprintwe ngesilivere-emhlophe (i-silver paste) imizobo eqhubayo kunye nemizobo yokumisa.Ngenxa yokuba olu hlobo lwepateni lufunyenwe yindlela yoshicilelo lwesikrini ngokubanzi, siyibiza le bhodi yesekethe eprintiweyo eguquguqukayo yesilivere eprintiweyo yebhodi yesekethe.Iibhodi zesekethe eziprintiweyo kwiibhodi zekhompyuter ezahlukeneyo, amakhadi emizobo, amakhadi enethiwekhi, iimodem, amakhadi esandi kunye nezixhobo zasekhaya esizibona kwisixeko sekhompyuter zahlukile.
Izinto ezisisiseko ezisebenzisayo zenziwe ngesiseko sephepha (esiqhele ukusetyenziswa kwicala elinye) okanye isiseko selaphu leglasi (elihlala lisetyenziselwa amacala amabini kunye noluhlu oluninzi), i-phenolic pre-impregnated okanye i-epoxy resin, icala elinye okanye macala omabini omhlaba. iqatywe ngentsimbi yobhedu emva koko yalanywa kwaye yanyangwa yenziwe.Olu hlobo lwebhodi yesekethe ishidi lobhedu, siyibiza ngokuba yibhodi eqinile.Emva kokwenza ibhodi yesiphaluka eprintiweyo, siyibiza ngokuba yibhodi yesiphaluka eqinileyo eprintiweyo.
Ibhodi yesekethe eprintiweyo enepateni yesekethe eprintiweyo kwelinye icala ibizwa ngokuba yibhodi yesekethe eprintiweyo enecala elinye, ibhodi yesekethe eprintiweyo enepateni yesekethe eprintiweyo kumacala omabini, kunye nebhodi yesekethe eprintiweyo eyenziwe ngokudityaniswa kwamacala amabini nge-metalization ye-metallization. imingxunya, siyibiza ngokuba yibhodi enamacala amabini.Ukuba ibhodi yesekethe eprintiweyo enomaleko wangaphakathi onamacala amabini, umaleko wangaphandle omacala omabini, okanye umaleko wangaphakathi onamacala amabini kunye necala elinye elingaphandle liyasetyenziswa, inkqubo yokubeka kunye nezinto zokugquma ezigqumayo ziyatshintshwa kunye kunye nesekethe eprintiweyo. ibhodi kunye iphethini conductive ezidityanisiweyo ngokweemfuno uyilo iba umaleko-four kunye nebhodi yesekethe eprintiweyo ezintandathu, eyaziwa ngokuba multi- umaleko eprintiweyo ibhodi yesekethe.
3.I-PCBA yenye yezinto ezisisiseko zamacandelo e-elektroniki.I-PCB ihamba kuyo yonke inkqubo ye-surface Mount technology (SMT) kunye nokufakwa kweeplagi ze-DIP, ezibizwa ngokuba yinkqubo ye-PCBA.Enyanisweni, yi-PCB eneqhekeza eliqhotyoshelweyo.Enye yibhodi egqityiweyo kwaye enye yibhodi engenanto.
I-PCBA inokuqondwa njengebhodi yesekethe egqityiweyo, oko kukuthi, emva kokuba zonke iinkqubo zebhodi yesekethe zigqityiwe, i-PCBA ingabalwa.Ngenxa ye-miniaturization eqhubekayo kunye nokucocwa kweemveliso ze-elektroniki, ezininzi iibhodi zeesekethe zangoku zifakwe kunye ne-etching resists (i-lamination okanye i-coating).Emva kokuvezwa kunye nophuhliso, iibhodi zeesekethe zenziwe nge-etching.
Ngaphambili, ukuqonda ukucocwa kwakunganelanga ngenxa yokuba ubuninzi bendibano ye-PCBA babungekho phezulu, kwaye kwakukholelwa kwakhona ukuba i-residu ye-flux yayingekho i-conductive kunye ne-benign, kwaye ayiyi kuchaphazela ukusebenza kombane.
Iindibano ze-elektroniki zanamhlanje zithande ukuba zincinci, izixhobo ezincinci, okanye iipayithi ezincinci.Izikhonkwane kunye neepads ziya zisondela kwaye zisondele.Izikhewu zanamhlanje ziya zincinci kwaye zincinci, kwaye ungcoliseko lunokuthi lubambeke kwizikhewu, okuthetha ukuba amasuntswana amancinci, ukuba ahlala phakathi kwezi zithuba zimbini, anokuba yinto embi ebangelwa yisekethe emfutshane.
Kwiminyaka yakutshanje, ishishini lendibano ye-elektroniki liye laqaphela ngakumbi kunye nelizwi malunga nokucoca, kungekhona nje kwiimfuno zemveliso, kodwa nakwiimfuno zokusingqongileyo kunye nokukhuselwa kwempilo yabantu.Ngoko ke, baninzi ababoneleli bezixhobo zokucoca kunye nezisombululo, kwaye ukucoca kuye kwaba yinto ephambili yokutshintshiselana kwezobugcisa kunye neengxoxo kwishishini le-electronic assembly.
4. I-DIP lelinye lamacandelo asisiseko amacandelo e-elektroniki.Ibizwa ngokuba yitekhnoloji yokupakisha kabini kwi-line, ebhekisa kwiitshiphusi zesekethe ezidityanisiweyo ezipakishwe kwi-in-line yokupakisha.Le fom yokupakisha iphinda isetyenziswe kwiisekethe ezidibeneyo ezincinci kunye neziphakathi., inani lezikhonkwane ngokubanzi alidluli kwi-100.
I-CPU chip yeteknoloji yokupakisha ye-DIP inemiqolo emibini yezikhonkwane, ekufuneka ifakwe kwi-socket ye-chip kunye nesakhiwo se-DIP.
Ngokuqinisekileyo, inokuthi ifakwe ngokuthe ngqo kwibhodi yesekethe kunye nenani elifanayo lemingxuma ye-solder kunye nokulungiswa kwejometri yokuthengisa.
I-teknoloji yokupakisha ye-DIP kufuneka ithathele ingqalelo ekhethekileyo xa ufaka kunye nokukhupha kwi-socket ye-chip ukuphepha umonakalo kwizikhonkwane.
Iimpawu zezi: i-DIP ye-ceramic ye-multi-layer ye-ceramic DIP, i-DIP ye-ceramic DIP, isakhelo esikhokelayo se-DIP (kubandakanywa uhlobo lokutywinwa kweglasi ye-ceramic, uhlobo lokupakisha lweplastiki, uhlobo lokupakisha lweglasi olunyibilikayo olusezantsi) njalo njalo.
I-plug-in ye-DIP yikhonkco kwinkqubo yokuvelisa i-elektroniki, kukho iiplagi ze-manual, kodwa kunye neeplagi zomatshini we-AI.Faka izinto ezichaziweyo kwindawo echaziweyo.I-plug-ins ye-manual kufuneka ihambe nge-soldering ye-solder kwi-solder ye-electronic components ebhodini.Kumacandelo afakiweyo, kuyimfuneko ukujonga ukuba ngaba zifakwe ngokungalunganga okanye ziphosakele.
Iplagi ye-DIP yokufaka i-post-soldering yinkqubo ebaluleke kakhulu kwi-processing ye-pcba patch, kwaye umgangatho wayo wokucubungula uchaphazela ngokuthe ngqo umsebenzi webhodi ye-pcba, ukubaluleka kwayo kubaluleke kakhulu.Emva koko i-post-soldering, ngenxa yokuba amanye amacandelo, ngokwemida yenkqubo kunye nezinto eziphathekayo, azikwazi ukuthengiswa ngumatshini wokuthungatha amaza, kwaye angenziwa kuphela ngesandla.
Oku kwakhona kubonisa ukubaluleka kweeplagi ze-DIP kumacandelo e-elektroniki.Kuphela ngokunikela ingqalelo kwiinkcukacha ezinokuthi zingabonakali ngokupheleleyo.
Kula macandelo amane amakhulu e-elektroniki, nganye ineenzuzo zayo, kodwa iyancedisana ukwenza olu luhlu lweenkqubo zokuvelisa.Kuphela ngokujonga umgangatho weemveliso zemveliso unako uluhlu olubanzi lwabasebenzisi kunye nabathengi baqonde iinjongo zethu.

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Umboniso wefektri

Njengomlingane ohamba phambili kwinkonzo yokwenziwa kwe-PCB kunye nendibano ye-PCB (PCBA), i-Evertop izabalazela ukuxhasa ishishini elincinane lamazwe ngamazwe elinamava obunjineli kwiiNkonzo zokuVelisa i-Electronic (EMS) iminyaka.

FAQ

I-Q1: Uqinisekisa njani umgangatho weePCB?
I-A1: Ii-PCB zethu zonke ziyi-100% yovavanyo olubandakanya uvavanyo lwe-Flying Probe, uvavanyo lwe-E okanye i-AOI.

I-Q2: Ndingalifumana ixabiso elifanelekileyo?
A2: Ewe.Ukunceda abathengi balawule iindleko yinto esihlala sizama ukuyenza.Iinjineli zethu ziya kubonelela ngoyilo oluhle kakhulu lokugcina izinto zePCB.

I-Q3: Ngaba ndingayifumana isampuli yamahhala?
A3: Ewe, Wamkelekile ukuba ube namava ngenkonzo yethu kunye nomgangatho.Ufuna ukwenza intlawulo ekuqaleni, kwaye siya kubuyisela iisampulu yeendleko xa iodolo yakho yesambuku elandelayo.