Ibhodi yeSekethe eprintiweyo ekumgangatho ophezulu PCB

I-PCB (iNdibano ye-PCB) yeNkqubo yeZakhono

Malunga

I-PCB iye yaphuhliswa ukusuka kwi-single-layer ukuya kwi-double-side, i-multi-layer kunye neebhodi eziguquguqukayo, kwaye zihlala zikhula kwicala lokuchaneka okuphezulu, ukuxinana okuphezulu kunye nokuthembeka okuphezulu.Ngokuqhubekayo ukuncipha ubungakanani, ukunciphisa iindleko, kunye nokuphucula ukusebenza kuya kwenza ibhodi yesekethe eprintiweyo isagcina ubungqabavu obuqinileyo kuphuhliso lweemveliso ze-elektroniki kwixesha elizayo.Kwixesha elizayo, indlela yokuphuhlisa itekhnoloji yokuvelisa ibhodi yesekethe kukuphuhlisa kwicala loxinaniso oluphezulu, ukuchaneka okuphezulu, ukuvuleka okuncinci, ucingo oluncinci, i-pitch encinci, ukuthembeka okuphezulu, i-multi-layer, ukuhanjiswa kwesantya esiphezulu, ubunzima obulula kunye imilo ebhityileyo.

Amanyathelo aneenkcukacha kunye nezilumkiso zemveliso yePCB

1. Uyilo
Phambi kokuba inkqubo yokuvelisa iqale, iPCB kufuneka iyilwe/yilwe ngumsebenzi weCAD ngokusekelwe kucwangciso lwesekethe esebenzayo.Nje ukuba inkqubo yoyilo igqityiwe, uluhlu lwamaxwebhu lunikezelwa kumenzi wePCB.Iifayile zeGerber zibandakanyiwe kumaxwebhu, abandakanya ukucwangciswa kwe-layer-by-layer, iifayile ze-drillthrough, ukukhetha kunye nokubeka idatha, kunye neenkcazo zombhalo.Ukucubungula ushicilelo, ukubonelela ngemiyalelo yokucubungula ebalulekileyo kwimveliso, yonke inkcazo ye-PCB, imilinganiselo kunye nokunyamezela.

2. Ukulungiselela phambi kokuvelisa
Nje ukuba indlu yePCB ifumane ipakethe yefayile yomyili, banokuqalisa ukwenza isicwangciso senkqubo yokuvelisa kunye nephakheji yomsebenzi wobugcisa.Iimpawu zokwenziwa kwezinto ziya kugqiba isicwangciso ngokudwelisa izinto ezinje ngodidi lwemathiriyeli, ukugqiba komphezulu, iplating, uluhlu lweepaneli zomsebenzi, umzila wenkqubo, nokunye.Ukongeza, iseti yemisebenzi yobugcisa ebonakalayo inokudalwa ngokucwangcisa ifilimu.Umsebenzi wobugcisa uya kubandakanya zonke iileya zePCB kunye nomsebenzi wobugcisa we-soldermask kunye nokumakishwa kwexesha.

3. Ukulungiselela izinto eziphathekayo
Inkcazo yePCB efunwa ngumyili imisela uhlobo lwezinto eziphathekayo, ubukhulu obungundoqo kunye nobunzima bobhedu obusetyenziselwa ukuqalisa ukulungiswa kwezinto.Icala elinye kunye namacala amabini aqinileyo PCBs ayifuni nakuphi na ukusetyenzwa kwangaphakathi kwaye uye ngqo kwinkqubo yokomba.Ukuba i-PCB ine-multi-layered, ukulungiswa kwezinto ezifanayo kuya kwenziwa, kodwa ngendlela yeeleyile zangaphakathi, ezihlala zincinci kakhulu kwaye zinokwakhiwa ukuya kubukhulu obumiselweyo bokugqibela (i-stackup).
Ubungakanani bephaneli yemveliso eqhelekileyo yi-18″x24″, kodwa nayiphi na isayizi ingasetyenziswa ukuba ingaphakathi kwi-PCB yokuvelisa amandla.

4. I-PCB ye-Multilayer kuphela - ukusetyenzwa kwe-layer yangaphakathi
Emva kobukhulu obufanelekileyo, uhlobo lwezinto eziphathekayo, ubukhulu be-core kunye nobunzima bobhedu bomgangatho wangaphakathi bulungiswa, buthunyelwa ukubhoboza imingxuma eyenziwe ngoomatshini kwaye emva koko uprinte.Omabini amacala ale maleko aqatywe ngefotoresist.Lungelelanisa amacala usebenzisa umzobo wangaphakathi kunye nemingxunya yesixhobo, emva koko uveze icala ngalinye kwisibane se-UV esichaza i-optical negative ye trace kunye neempawu ezikhankanyiweyo kulo maleko.Ukukhanya kwe-UV okuwela kwi-photoresist kudibanisa ikhemikhali kwindawo yobhedu, kwaye ikhemikhali eseleyo engabonakaliyo iyasuswa kwibhafu ekhulayo.

Isinyathelo esilandelayo kukususa ubhedu oluveziweyo ngokusebenzisa inkqubo yokubhala.Oku kushiya imikhondo yobhedu efihliweyo phantsi kwe-photoresist layer.Ngexesha lenkqubo etching, zombini ukugxininiswa kwe-etchant kunye nexesha lokuvezwa yiparameters eziphambili.Ukuxhathisa ke kuhluthwe, kushiya imikhondo kunye neempawu kumaleko angaphakathi.

Uninzi lwababoneleli be-PCB basebenzisa iinkqubo zokuhlola ezizenzekelayo zokuhlola iileya kunye ne-post-etch punches ukwandisa imingxunya yesixhobo sokulayita.

5. Multilayer PCB kuphela – Laminate

Ukupakishwa kwangaphambili kwenkqubo kusekwa ngexesha lenkqubo yoyilo.Inkqubo ye-lamination iqhutyelwa kwindawo ecocekileyo yegumbi kunye ne-layer epheleleyo yangaphakathi, i-prepreg, i-foil yobhedu, iipleyiti ze-press, izikhonkwane, i-stainless steel spacers kunye ne-backing plates.Isitaki ngasinye sokushicilela sinokuthatha iibhodi ezi-4 ukuya kwezi-6 ngokuvula umatshini ngamnye, kuxhomekeke kubunzima bePCB egqityiweyo.Umzekelo we-4-layer board stackup iya kuba: i-platen, i-separator yensimbi, i-foil yobhedu (i-4th layer), i-prepreg, i-core 3-2 layers, i-prepreg, i-copper foil, kunye nokuphinda.Emva kokuba ii-PCB ezi-4 ukuya kwezi-6 zidityanisiwe, khusela iplaten ephezulu kwaye uyibeke kwi-lamination press.Umshicileli unyuka ukuya kwi-contours kwaye ufaka uxinzelelo de i-resin inyibilike, apho i-prepreg ihamba, idibanisa iileyile kunye, kwaye i-press ipholile.Xa ikhutshwa kwaye ilungile

6. Ukugrumba
Inkqubo yokugaya yenziwa ngumatshini wokugaya olawulwa yi-CNC osebenzisa i-spindle ephezulu ye-RPM kunye ne-carbide drill bit eyenzelwe ukugaya i-PCB.I-vias eqhelekileyo inokuba yincinci njenge-0.006″ ukuya ku-0.008″ yombiwe ngesantya esingaphezulu kwe-100K RPM.

Inkqubo yokomba idala udonga lomngxuma olucocekileyo, olugudileyo olungayi konakalisa umaleko wangaphakathi, kodwa ukugrumba kunika indlela yokudibanisa amanqwanqwa angaphakathi emva kokucwenga, kwaye umngxuma ongaphumeleli uphelela ekubeni likhaya ukuya kumacandelo omngxuma.
Imingxuma engafakwanga idla ngokugrunjwa njengomsebenzi wesibini.

7. Ukufakwa kobhedu
I-Electroplating isetyenziswa ngokubanzi kwimveliso ye-PCB apho ifakwe kwimingxunya efunekayo.Injongo kukufaka umaleko wobhedu kwi-conductive substrate ngothotho lonyango lwekhemikhali, kwaye emva koko ngeendlela ezilandelayo ze-electroplating zokunyusa ubukhulu bomaleko wobhedu ukuya kubukhulu boyilo oluthile, ngokuqhelekileyo i-1 mil okanye ngaphezulu.

8. Unyango lwangaphandle
Ukusetyenzwa komaleko wangaphandle kuyafana nenkqubo echazwe ngaphambili kumaleko angaphakathi.Omabini amacala omaleko aphezulu nasezantsi aqatywe ngefotoresist.Lungelelanisa amacala usebenzisa umzobo wangaphandle kunye nemingxunya yesixhobo, emva koko uveze icala ngalinye kwisibane se-UV ukuze ufumane iinkcukacha zepateni engalunganga yokulandela umkhondo kunye neempawu.Ukukhanya kwe-UV okuwela kwi-photoresist kudibanisa ikhemikhali kumphezulu wobhedu, kwaye ikhemikhali eseleyo engabonakaliyo iyasuswa kwibhafu ekhulayo.Isinyathelo esilandelayo kukususa ubhedu oluveziweyo ngokusebenzisa inkqubo yokubhala.Oku kushiya imikhondo yobhedu efihliweyo phantsi kwe-photoresist layer.Ukuxhathisa ke kuhluthwe, kushiya imikhondo kunye neempawu kumaleko angaphandle.Iziphene zomaleko wangaphandle zinokufunyanwa phambi kwemaski ye-solder usebenzisa i-automated optical inspection.

9. Intlama yesolder
Usetyenziso lwemaski yeSolder luyafana neenkqubo zomaleko wangaphakathi nangaphandle.Umahluko ophambili kukusetyenziswa kwemaski enemifanekiso enefoto endaweni yefotoresist phezu komhlaba wonke wepaneli yemveliso.Emva koko sebenzisa umsebenzi wobugcisa ukuthatha imifanekiso kumaleya aphezulu nasezantsi.Emva kokuvezwa, imaski ihlanjululwe kwindawo enemifanekiso.Injongo kukuveza kuphela indawo apho amacandelo aya kufakwa kunye nokuthengiswa.Imaski ikwanciphisa ukuphela komphezulu wePCB kwiindawo ezivelileyo.

10. Unyango lomphezulu

Kukho iinketho ezininzi zokugqitywa komphezulu wokugqibela.Gold, isilivere, OSP, ilothe-free solder, ilothe-equlathe solder, etc. Zonke ezi ziyasebenza, kodwa ngokwenene ubilise phantsi iimfuno zoyilo.Igolide kunye nesilivere zisetyenziswa nge-electroplating, ngelixa ii-solder ezingenalo i-lothe kunye ne-lothe-ziqulathe zisetyenziswa ngokuthe tye nge-solder yomoya oshushu.

11. Uluhlu lwamagama
Uninzi lwee-PCBs zikhuselwe kwiimpawu kumphezulu wazo.Olu phawu lusetyenziswa kakhulu kwinkqubo yokuhlanganisa kwaye lubandakanya imizekelo efana nokumakishwa kwereferensi kunye nokumakishwa kwe-polarity.Olunye uphawu lunokuba lula njengenxalenye yokuchongwa kwenombolo okanye iikhowudi zomhla wokuvelisa.

12. Ibhodi engaphantsi
Ii-PCB ziveliswa kwiiphaneli zemveliso epheleleyo ekufuneka zikhutshiwe kwikhontolo yazo yokuvelisa.Uninzi lweePCB zisetwe ngokweendlela zokuphucula ukusebenza kakuhle kwendibano.Kunokubakho inani elingenasiphelo laluluhlu.Andikwazi ukuchaza.

Uninzi lwee-arrays lunokuba yiprofayili egayiweyo kwi-CNC yokusila kusetyenziswa izixhobo ze-carbide okanye amanqaku kusetyenziswa izixhobo ezigutyungelwe ngedayimane.Zombini iindlela zivumelekile, kwaye ukhetho lwendlela ludla ngokugqitywa liqela lendibano, elidla ngokuvuma uluhlu olwakhiwe kwasekuqaleni.

13. Uvavanyo
Abavelisi be-PCB badla ngokusebenzisa inkqubo yovavanyo olubhabhayo okanye ibhedi yenkqubo yokuvavanya iinzipho.Indlela yovavanyo emiselwa bubuninzi bemveliso kunye/okanye nezixhobo ezikhoyo

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Inkonzo yethu

1. IiNkonzo zeNdibano ze-PCB: SMT, DIP&THT, ukulungiswa kweBGA kunye nokubuyisela ibhola kwakhona
2. I-ICT, i-Constant Temperature Burn-in kunye noVavanyo lweMsebenzi
3. Istencil, iiCables kunye neEnclosure building
4. Ukupakishwa okusemgangathweni kunye nokuhanjiswa kwexesha