Ibhodi yeSekethe yeSekethe ye-SMT ye-PCB ekwicala eliMbini

Ibhodi yeSekethe ye-SMT ye-PCB ye-Side ephindwe kabini eFanelekileyo

Inkcazelo emfutshane:

Iinkcukacha zeMveliso

Iithegi zeMveliso

Iinkcukacha zeMveliso

Ukucaphula kunye neMfuneko yeMveliso	IFayile yeGerber okanye iFayile yePCB yeBhodi ye-Bare PCB
	I-Bom (iBhili yeMathiriyeli) yeNdibano, i-PNP (Khetha kunye nefayile yeNdawo) kunye neNdawo yeMicimbi nayo iyafuneka kwindibano
	Ukunciphisa ixesha lekowuti, nceda usinike inani elipheleleyo lenxalenye yecandelo ngalinye, Ubungakanani bebhodi nganye kunye nobuninzi bee-odolo.
	Isikhokelo soVavanyo kunye nendlela yoVavanyo loMsebenzi wokuqinisekisa umgangatho wokufikelela phantse kwi-0% yereyithi ye-scrap
Iinkonzo ze-OEM/ODM/EMS	PCBA, PCB indibano: SMT & PTH & BGA
	PCBA kunye noyilo ebiyelweyo
	Ukuthengwa kwezinto kunye nokuthengwa
	Iprototyping ekhawulezayo
	Ukubumba inaliti yeplastiki
	Isitampu sephepha lesinyithi
	Indibano yokugqibela
	Uvavanyo: I-AOI, uvavanyo lweSekethe (ICT), uvavanyo oluSebenzayo (FCT)
	Imvume yesiko lokungeniswa kwezinto kunye nokuthunyelwa kwemveliso kumazwe angaphandle

Inkqubo yethu

1. Inkqubo yokuntywiliselwa kwegolide: Injongo yenkqubo yokuntywiliselwa kwegolide kukufaka i-nickel-gold coating kunye nombala ozinzileyo, ukuqaqamba okulungileyo, ukugquma okugudileyo kunye ne-solderability entle kumphezulu wePCB, enokwahlulwa ngokwesiseko ngokwezigaba ezine: ukunyangwa kwangaphambili. (Ukunciphisa i-degreasing, i-micro-etching, i-activation, i-post-dipping), i-nickel yokucwiliswa, igolide yokuntywila, i-post-treatment, (inkunkuma yokuhlamba igolide, ukuhlamba kwe-DI, ukomisa).

2. Itoti etshizwe ngelothe: Iqondo lobushushu le-eutectic elinelothe lingaphantsi kunelo le-alloy engenalothe.Isixa esithile sixhomekeke ekubunjweni kwe-alloy-free alloy.Ngokomzekelo, i-eutectic ye-SNAGCU yi-217 degrees.Ubushushu be-soldering bubushushu be-eutectic kunye ne-30-50 degrees, kuxhomekeke ekubunjweni.Okwenyani uhlengahlengiso, i-eutectic ekhokelayo yi-183 degrees.Amandla omatshini, ukukhanya, njl njl.

3. Ukutshiza i-lead-free tin: I-Lead iya kuphucula umsebenzi we-tin wire kwinkqubo ye-welding.Kulula ukusebenzisa ucingo lwenkcenkce olungenalothe, kodwa ilothe inetyhefu, yaye ayiwulungelanga umzimba womntu ukuba isetyenziswe ixesha elide.Kwaye i-tin engenalothe iya kuba neqondo eliphezulu lokunyibilika kune-lead-tin, ukuze i-solder joints ibe namandla kakhulu.

Inkqubo ethile yenkqubo yokuvelisa ibhodi yesekethe yePCB emacaleni kabini
1. CNC ukomba
Ukuze kwandiswe ukuxinana kwendibano, imingxuma kwibhodi yesekethe enamacala amabini ePCB iya isiba ncinci kwaye incinci.Ngokubanzi, iibhodi ze-pcb ezinamacala amabini zombiwa ngoomatshini bokomba be-CNC ukuqinisekisa ukuchaneka.
2. Inkqubo yomngxuma we-Electroplating
Inkqubo yomngxuma ecwecwe, eyaziwa ngokuba yi-metallized hole, yinkqubo apho udonga lonke lomngxuma lufakwe ngentsimbi ukuze iipateni zokuqhuba phakathi kwamaleko angaphakathi nangaphandle ebhodi yesekethe eprintiweyo kabini inokudityaniswa ngombane.
3. Ukuprintwa kwesikrini
Izinto ezikhethekileyo zokuprinta zisetyenziselwa iipateni zesekethe yoshicilelo lwesikrini, iipateni zemaski ye-solder, iipatheni zamanqaku oonobumba, njl.
4. Electroplating tin-lead ingxubevange
I-Electroplating i-tin-lead alloys inemisebenzi emibini: okokuqala, njenge-anti-corrosion layer protective ngexesha le-electroplating kunye ne-etching;okwesibini, njengengubo ethengiswayo yebhodi egqityiweyo.I-Electroplating tin-lead alloys kufuneka ilawule ngokungqongqo ukuhlamba kunye neemeko zenkqubo.Ubukhulu be-tin-lead alloy plating layer kufuneka ibe ngaphezu kwe-8 microns, kwaye udonga lomngxuma alufanele lube ngaphantsi kwe-2.5 microns.
ibhodi yesekethe eprintiweyo
5. Ukurhabula
Xa usebenzisa i-tin-lead ingxubevange njengomaleko wokuxhathisa ukwenza ipaneli enamacala amabini ngepatheni ye-electroplating etching method, isisombululo se-acid copper chloride etching kunye ne-ferric chloride etching solution ayinakusetyenziswa ngenxa yokuba ziphinde zidle ialloyi ye-tin-lead.Kwinkqubo ye-etching, "i-side etching" kunye nokwandiswa kwe-coating zizinto ezichaphazela u-etching: umgangatho
(1) Umhlwa ecaleni.I-Corrosion yecala yinto eyenzeka ngokutshona okanye ukutshona kwemiphetho ye-conductor ebangelwa kukukrolwa.Ubungakanani bomhlwa kwicala bunxulumene nesisombululo se-etching, izixhobo kunye neemeko zenkqubo.Ukwehla komhlwa kweflank kungcono.
(2) Ukwaleka kwandiswa.Ukwandiswa kwengubo kubangelwa ukugqithiswa kwengubo, okwenza ububanzi becala elinye locingo budlule ububanzi beplate ephantsi egqityiweyo.
6. Ukucwenga kwegolide
I-Gold plating ine-conductivity egqwesileyo yombane, ukuxhathisa ukudibanisa okuncinci kunye nozinzile kunye nokumelana nokunxiba okugqwesileyo, kwaye yeyona nto ilungileyo yokubeka iiplagi zebhodi yesekethe eprintiweyo.Kwangaxeshanye, inozinzo olugqwesileyo lweekhemikhali kunye nokuqina, kwaye inokusetyenziswa njenge-resistant-resistant, solderable and protective coating on surface Mount PCBs.
7. Ukunyibilika okushushu kunye nomgangatho womoya oshushu
(1) Ukunyibilika okushushu.I-pcb efakwe kwi-alloy ye-Sn-Pb ishushu ngaphezu kwendawo yokunyibilika ye-Sn-Pb i-alloy, ukwenzela ukuba i-Sn-Pb kunye ne-Cu yenze i-compound yesinyithi, ukwenzela ukuba i-Sn-Pb i-coating ixinene, iqaqambe kwaye ingabi namingxuma, kwaye ukuxhathisa i-corrosion kunye ne-solderability ye-coating iyaphuculwa.ngesondo.I-Hot-melt isetyenziswa ngokuqhelekileyo i-glycerol eshushu-enyibilikayo kunye ne-infrared eshushu-enyibilikayo.
(2) Umgangatho womoya oshushu.Ikwaziwa njengokutshiza ngetoti, ibhodi yesekethe ye-solder imaski eprintiweyo yesekethe ilungelelaniswe ngokuguquguquka ngumoya oshushu, emva koko ihlasele ichibi elinyibilikisiweyo, emva koko idlule phakathi kweemela ezimbini zomoya ukuvuthela i-solder engaphezulu ukuze ifumane i-solder eqaqambileyo, iyunifomu, egudileyo. ukutyabeka nge-solder.Ngokuqhelekileyo, iqondo lokushisa lokuhlambela i-solder lilawulwa kwi-230 ~ 235, iqondo lokushisa lomoya lilawulwa ngaphezu kwe-176, ixesha le-welding ye-dip yi-5 ~ 8s, kwaye ubukhulu bengubo bulawulwa kwi-6 ~ 10 microns.
Ibhodi yeSekethe eprintiweyo emacaleni amabini
Ukuba ibhodi yesekethe yePCB emacaleni kabini ilahliwe, ayinakuphinda isetyenziswe, kwaye umgangatho wayo wokuvelisa uya kuchaphazela ngokuthe ngqo umgangatho kunye neendleko zemveliso yokugqibela.