Karolelano ho tloha tlase ho ea holimo ke ka tsela e latelang:
94HB/94VO/22F/CEM-1/CEM-3/FR-4
Lintlha ke tse latelang:
94HB: Khateboto e tloaelehileng, eseng e sa chese mollo (thepa ea boemo bo tlase, e ke ke ea sebelisoa e le boto ea matla)
94V0: khateboto e thibelang lelakabe (ho phunya)
22F: Boto ea faeba ea khalase e nang le lehlakore le le leng (ho phunya)
CEM-1: Boto ea fiberglass e nang le lehlakore le le leng (e tlameha ho chekoa ka komporo, eseng ho otloa)
CEM-3: Boto ea semi-fiberglass e mahlakoreng a mabeli (ntle le khateboto e mahlakoreng a mabeli, e leng thepa e tlaase ka ho fetisisa bakeng sa liphanele tse nang le mahlakore a mabeli. mitha e theko e tlase ho feta FR-4)
FR-4: Boto ea fiberglass e mahlakoreng a mabeli
Molemo ka ho fetisisa karabo
1.c Ho aroloa ha thepa e thibelang lelakabe ho ka aroloa ka mefuta e mene: 94V—0/V-1/V-2 le 94-HB
2. Prepreg: 1080=0.0712mm, 2116=0.1143mm, 7628=0.1778mm
3. FR4 CEM-3 ke boto, fr4 ke boto ea fiber ea khalase, cem3 ke substrate e kopaneng
4. Halogen-mahala e bua ka thepa ea motheo e se nang halogen (fluorine, bromine, iodine le likarolo tse ling), hobane bromine e tla hlahisa khase e chefo ha e chesoa, e hlokehang ke tšireletso ea tikoloho.
Tse hlano.Tg ke mocheso oa phetoho ea khalase, ke hore, sebaka se qhibilihang.
Boto ea potoloho e tlameha ho mamella malakabe, e ke ke ea chesa mocheso o itseng, e ka nolofatsa feela.Sebaka sa mocheso ka nako ena se bitsoa mocheso oa phetoho ea khalase (Tg ntlha), 'me boleng bona bo amana le botsitso ba sebopeho sa boto ea PCB.
Boto ea potoloho ea Tg PCB e phahameng ke eng le melemo ea ho sebelisa Tg PCB e phahameng
Ha mocheso oa mapolanka a phahameng a Tg a hatisoang a nyolohela sebakeng se itseng, substrate e tla fetoha ho tloha "boemo ba khalase" ho "rabara boemo", 'me mocheso ka nako ena o bitsoa mocheso oa phetoho ea khalase (Tg) ea boto.Ke hore, Tg ke mocheso o phahameng ka ho fetisisa (° C.) oo substrate e lulang e tiile.Ka mantsoe a mang, lisebelisoa tse tloaelehileng tsa substrate tsa PCB ha li nolofatse feela, li senyeha, li qhibiliha, joalo-joalo ka mocheso o phahameng, empa hape li bontša ho fokotseha ho hoholo ha thepa ea mechine le ea motlakase (ke nahana hore ha u batle ho bona boemo bona lihlahisoa tsa hau. ka ho sheba lihlopha tsa liboto tsa PCB. ).Ka kopo o seke oa kopitsa litaba tsa sebaka sena sa marang-rang
Ka kakaretso, Tg ea poleiti e ka holimo ho likhato tse 130, Tg e phahameng ka kakaretso e kholo ho feta likhato tse 170, 'me Tg e bohareng e kholo ho feta likhato tse 150.
Ka kakaretso, liboto tse hatisitsoeng tsa PCB tse nang le Tg ≥ 170 ° C li bitsoa liboto tse hatisitsoeng tse phahameng tsa Tg.
Tg ea substrate e eketseha, 'me ho hanyetsa mocheso, ho hanyetsa mongobo, ho hanyetsa lik'hemik'hale, le botsitso ba boto e hatisitsoeng e tla ntlafatsoa le ho ntlafatsoa.Ha boleng ba TG bo phahame, bo ntlafatsa ho hanyetsa mocheso oa boto, haholo-holo ts'ebetsong e se nang loto, ho na le likopo tse ngata tse phahameng tsa Tg.
Tg e phahameng e bolela ho hanyetsa mocheso o phahameng.Ka tsoelo-pele e potlakileng ea indasteri ea lisebelisoa tsa elektronike, haholo-holo lihlahisoa tsa elektronike tse emeloang ke lik'homphieutha, li ntse li tsoela pele ho ea ho ts'ebetso e phahameng le lihlopha tse ngata tse phahameng, tse hlokang mocheso o phahameng oa ho hanyetsa thepa ea substrate ea PCB e le tiiso ea bohlokoa.Ho hlaha le nts'etsopele ea mahlale a phahameng a matla a phahameng a emeloang ke SMT le CMT li entse hore PCB e se ke ea arohanngoa le ho ts'ehetsa mocheso o phahameng oa ho hanyetsa mocheso oa substrate ho latela sebaka se senyenyane sa ho phunyeha, mohala o motle le ho fokotsa.
Ka hona, phapang pakeng tsa kakaretso ea FR-4 le Tg FR-4 e phahameng ke hore matla a mochine, botsitso ba dimensional, ho khomarela, ho kenngoa ha metsi, le ho senyeha ha mocheso oa thepa ho boemong bo chesang, haholo-holo ha ho futhumala ka mor'a ho kenngoa ha mongobo.Ho na le liphapang maemong a fapaneng joalo ka katoloso ea mocheso, 'me lihlahisoa tse phahameng tsa Tg ho hlakile hore li betere ho feta lisebelisoa tse tloaelehileng tsa PCB.
Lilemong tsa morao tjena, palo ea bareki ba hlokang liboto tse hatisitsoeng tsa Tg e eketsehile selemo le selemo.
Tsebo le litekanyetso tsa boto ea PCB (2007/05/06 17:15)
Hona joale, ho na le mefuta e mengata ea mapolanka a koporo a sebelisoang haholo naheng ea heso, 'me litšobotsi tsa bona li bontšoa tafoleng e ka tlase: mefuta ea mapolanka a koporo, tsebo ea mapolanka a koporo.
Ho na le mekhoa e mengata ea lihlopha tsa li-laminate tsa koporo.Ka kakaretso, ho ea ka lisebelisoa tse fapaneng tse matlafatsang tsa boto, e ka aroloa ka: setsi sa pampiri, setsi sa lesela sa khalase ea fiber pcb board,
Composite base (CEM letoto), laminated multi-lara boto motheo le khethehileng thepa motheo (ceramic, tšepe konokono base, joalo-joalo) mekhahlelo e mehlano.Haeba e sebelisoa ke boto _)(^$RFSW#$%T
Likhomaretsi tse fapaneng tsa resin li arotsoe, CCI e tloaelehileng e thehiloeng pampiring.E: phenolic resin (XPC, XxxPC, FR-1, FR
-2, joalo-joalo), epoxy resin (FE-3), polyester resin le mefuta e meng.Setsi se tloaelehileng sa khalase ea fiber CCL se na le epoxy resin (FR-4, FR-5), eo hajoale e leng mofuta o sebelisoang ka ho fetesisa oa lesela la lesela la khalase.Ho phaella moo, ho na le li-resin tse ling tse khethehileng (lesela la khalase, fiber polyamide, lesela le sa lohiloeng, joalo-joalo e le lisebelisoa tse eketsehileng): bismaleimide e fetotsoeng triazine resin (BT), polyimide resin (PI) , Diphenylene ether resin (PPO), maleic anhydride imine-styrene resin (MS), polycyanate resin, polyolefin resin, joalo-joalo Ho ea ka lelakabe retardant tshebetso ya CCL, e ka aroloa ka mefuta e 'meli ea mapolanka: lelakabe retardant (UL94-VO, UL94-V1) le bao e seng- se thibelang lelakabe (UL94-HB).Selemong se le seng kapa tse peli tse fetileng, ka ho hatisa ho feta ts'ireletso ea tikoloho, mofuta o mocha oa CCL o se nang bromine o arohane le CCL e thibelang lelakabe, e ka bitsoang "CCL e thibelang malakabe e tala".Ka nts'etsopele e potlakileng ea theknoloji ea lihlahisoa tsa elektroniki, ho na le litlhoko tse phahameng tsa ts'ebetso bakeng sa cCL.Ka hona, ho tloha sehlopheng sa ts'ebetso ea CCL, e arotsoe ka CCL ea ts'ebetso e akaretsang, CCL e tlaase ea dielectric kamehla, CCL e phahameng ea mocheso (ka kakaretso L ea boto e ka holimo ho 150 ° C), le coefficient e tlase ea mocheso oa CCL (e sebelisoang hangata ho liphutheloana tsa liphutheloana) ) le mefuta e meng.Ka tsoelo-pele le tsoelo-pele e tsoelang pele ea thekenoloji ea elektronike, litlhoko tse ncha li lula li behiloe pele bakeng sa lisebelisoa tsa substrate tse hatisitsoeng, kahoo li khothalletsa tsoelo-pele e tsoelang pele ea litekanyetso tsa koporo tsa laminate.Hona joale, litekanyetso tse ka sehloohong tsa thepa ea substrate ke tse latelang.
① Litekanyetso tsa naha Hajoale, maemo a naha ea heso bakeng sa ho hlophisoa ha lisebelisoa tsa substrate pcb board li kenyelletsa GB/T4721-47221992 le GB4723-4725-1992.Tekanyetso ea li-laminate tsa koporo tsa Taiwan, Chaena ke maemo a CNS, a ipapisitseng le maemo a Majapane a JIs., e lokollotsoeng ka 1983. gfgfgfggdgeeeejhjj
② Litekanyetso tsa mantlha tsa maemo a mang a naha ke: JIS standard ea Japane, ASTM, NEMA, MIL, IPc, ANSI, UL standard ea United States, Bs standard ea United Kingdom, DIN le VDE standard ea Jeremane, NFC le UTE standard. ea Fora, CSA ea Maemo a Canada, maemo a AS a Australia, maemo a mehleng a Soviet Union a FOCT, maemo a machaba a IEC, joalo-joalo.
Barekisi ba thepa ea mantlha ea moralo oa PCB ba sebelisoa hangata ke motho e mong le e mong: Shengyi\Jiantao\International, jj.
● Litokomane tse amoheloang: protel autocad powerpcb orcad gerber kapa boto ea kopi e tiileng, joalo-joalo.
● Mofuta oa poleiti: CEM-1, CEM-3 FR4, thepa e phahameng ea TG;
● Boholo bo boholo ba boto: 600mm*700mm(24000mil*27500mil)
● Botenya ba boto ea ho sebetsa: 0.4mm-4.0mm(15.75mil-157.5mil)
● Maemo a phahameng a ho sebetsa: 16Layers
● Botenya ba lera la koporo: 0.5-4.0(oz)
● Mamello ea botenya ba poleiti e felile: +/-0.1mm(4mil)
● Molding dimension tolerance: Ho sila ka komporo: 0.15mm (6mil) Die stamping: 0.10mm (4mil)
● Bophahamo bo fokolang ba mola/sebaka: 0.1mm (4mil) Bokhoni ba ho laola bophara ba mola: ＜+-20%
● Bophahamo ba bonyane ba ho cheka sehlahisoa se felileng: 0.25mm (10mil)
E qetile bophara ba lesoba la ho phunya: 0.9mm (35mil)
Mamello ea lesoba e felileng: PTH: + -0.075mm (3mil)
NPTH: +-0.05mm (2mil)
● Botenya ba lesoba la lesoba la koporo: 18-25um (0.71-0.99mil)
● Bonyane bo phahameng ba SMT: 0.15mm (6mil)
● Ho roala ka holim'a metsi: khauta e qoelisoang ka lik'hemik'hale, HASL, khauta e kentsoeng ka boto eohle (metsi/khauta e bonolo), sekhomaretsi sa silika se putsoa, joalo-joalo.
● Botenya ba mask a solder holim'a boto: 10-30μm (0.4-1.2mil)
● Matla a lekhapetla: 1.5N/mm (59N/mil)
● boima ba mask a solder: ~ 5H
● Solder resistance plugging capacity: 0.3-0.8mm (12mil-30mil)
● Dielectric kamehla: ε = 2.1-10.0
● Ho hanyetsa mocheso: 10KΩ-20MΩ
● Tšitiso ea sebopeho: 60 ohm±10％
● Tšisinyeho ea mocheso: 288℃, 10 sec
● Warpage ea boto e felileng: <0.7%
● Sesebelisoa sa sehlahisoa: lisebelisoa tsa puisano, lisebelisoa tsa elektroniki tsa likoloi, lisebelisoa, sistimi ea boemo ba lefatše, komporo, MP4, phepelo ea motlakase, lisebelisoa tsa lapeng, jj.
Nako ea poso: Mar-30-2023