PCBA uye PCB Bhodhi Gungano reMagetsi Zvigadzirwa
Product Details
| Muenzaniso NO. | ETP-005 | Condition | New |
| Min Trace Width/Space | 0.075/0.075mm | Mhangura Kukora | 1 – 12 Oz |
| Gungano Modes | SMT, DIP, Kuburikidza Negomba | Munda Wekushandisa | LED, Medical, Industrial, Control Board |
| Samples Run | Available | Transport Package | Vacuum Packing / Blister / Plastiki / Katuni |
PCB (PCB Gungano) Process Kugona
| Technical Inodiwa | Professional Surface-mounting uye Through-hole soldering Technology |
| Saizi dzakasiyana siyana se1206,0805,0603 zvikamu zveSMT tekinoroji | |
| ICT (In Circuit Test), FCT (Functional Circuit Test) tekinoroji | |
| PCB Gungano NeUL, CE, FCC, Rohs Kubvumirwa | |
| Nitrogen gasi reflow soldering tekinoroji yeSMT | |
| High Standard SMT & Solder Assembly Line | |
| High density yakabatana bhodhi yekuisa tekinoroji kugona | |
| Quote&Production Chinodiwa | Gerber Faira kana PCB Faira yeBare PCB Board Fabrication |
| Bom (Bhiri reZvinhu) yeGungano, PNP (Sarudza uye Nzvimbo faira) uye Zvikamu Nzvimbo inodiwawo mugungano. | |
| Kuti uderedze nguva yekotesheni, ndapota tipei iyo yakazara chikamu nhamba yechinhu chimwe nechimwe, Huwandu pabhodhi zvakare huwandu hwemaodha. | |
| Testing Guide&Function Testing nzira yekuona kuti mhando yekusvika ingangoita 0% chirairo mwero |
Iyo chaiyo maitiro ePCBA
1) Yakajairwa kaviri-mativi maitiro ekuyerera uye tekinoroji.
① Kucheka kwezvinhu-kuchera-gomba uye yakazara ndiro electroplating-pattern kutamisa (kuumbwa kwefirimu, kuratidzwa, kukura)-etching uye kubviswa kwemafirimu-mutengesi masiki uye mavara-HAL kana OSP, nezvimwewo-chimiro chekugadzirisa-kuongorora-chakapedzwa chigadzirwa.
② Kucheka zvinhu-kuchera-kuburikidza-pattern kufambisa-electroplating-kubvisa firimu uye etching-anti-corrosion firimu kubviswa (Sn, kana Sn/pb)-plating plug- -Solder mask uye mavara-HAL kana OSP, nezvimwewo-kugadzirisa chimiro. -kuongorora-yakapera chigadzirwa
(2) Yakajairika yakawanda-layer board process uye tekinoroji.
Kucheka zvinhu-yemukati layer kugadzirwa-oxidation kurapwa-lamination-drilling-gomba plating (inogona kupatsanurwa kuita yakazara bhodhi uye pateni plating)-yekunze dhizaini kugadzirwa-yepamusoro yekupotera-Shape kugadzirisa-Kuongorora-Yakapedza chigadzirwa
(Cherechedza 1): Kugadzirwa kwemukati kwemukati kunoreva maitiro e-in-process board mushure mekunge zvinhu zvachekwa-pattern transfer (kuumbwa kwemafirimu, kuratidzwa, kukura) -etching uye kubvisa firimu-kuongorora, nezvimwewo.
(Cherechedza 2): Kugadzirwa kwekunze kwemutsetse kunoreva maitiro ekugadzira ndiro kuburikidza negomba electroplating-pattern transfer (kuumbwa kwemafirimu, kuratidzwa, kukura) -etching uye kubvisa firimu.
(Cherechedzo 3): Surface coating (plating) zvinoreva kuti mushure mekunze kwekunze kwagadzirwa-solder mask uye mavara-coating (plating) layer (yakadai seHAL, OSP, chemical Ni/Au, chemical Ag, chemical Sn, etc. Mira )
(3) Kuvigwa/kupofumadzwa kuburikidza nemultilayer board process kuyerera uye tekinoroji.
Sequential lamination nzira dzinowanzo shandiswa.zvinova:
Material cutting-forming core board (yakaenzana neyakajairwa maviri-sided kana akawanda-layer board)-lamination-inotevera maitiro akafanana neyakajairika akawanda-layer board.
(Cherechedza 1): Kugadzira bhodhi repakati kunoreva kuumbwa kwebhodhi re-multi-layer rine maburi akavigwa/mapofu zvichienderana nezvinodiwa zvechimiro mushure mekunge bhodhi remativi maviri kana akawanda-layer raumbwa nenzira dzakajairwa.Kana chikamu chechikamu chegomba re core board yakakura, gomba rinovharira kurapwa rinofanira kuitwa kuti rive nechokwadi chekuvimbika kwayo.
(4) Iyo nzira yekuyerera uye tekinoroji yelaminated multi-layer board.
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Semubatsiri-anotungamira PCB kugadzira uye PCB musangano (PCBA) mubatsiri, Evertop inoyedza kutsigira bhizinesi diki-repakati neruzivo rweinjiniya muElectronics Manufacturing Services (EMS) kwemakore.
