PCBA ndiyo chidimbu chePrinted Circuit Board Assembly muChirungu, kureva kuti, PCB board isina chinhu inopfuura nepakati peSMT chikamu chepamusoro, kana maitiro ese eDIP plug-in, anonzi PCBA.Iyi inzira inowanzoshandiswa muChina, nepo nzira yakajairwa muEurope neAmerica iri PCB' A, wedzera “'”, inodaidzwa kuti dimikira repamutemo.
Yakadhindwa redunhu bhodhi, inozivikanwawo seyakadhindwa redunhu bhodhi, rakadhindwa redunhu bhodhi, rinowanzoshandisa Chirungu chipfupiso chePCB (Yakadhindwa redunhu bhodhi), chinhu chakakosha chemagetsi chikamu, tsigiro yemagetsi zvinoriumba, uye mupi wedunhu kubatana kwemagetsi zvinoriumba.Nemhaka yekuti inogadzirwa uchishandisa michina yekudhinda yemagetsi, inonzi "yakadhindwa" bhodhi redunhu.Pamberi pekuonekwa kwemapuranga edunhu akadhindwa, kuwirirana pakati pezvikamu zvemagetsi kwaivimba nekubatana kwakananga kwetambo kuti dzigadzire dunhu rakazara.Ikozvino, dunhu redunhu rinongowanikwa sechishandiso chekuyedza chinoshanda, uye bhodhi redunhu rakadhindwa rave chinzvimbo chakazara muindasitiri yemagetsi.Pakutanga kwezana remakore rechi20, kuitira kuti kugadzirwa kwemichina yemagetsi kuve nyore, kuderedza wiring pakati pezvikamu zvemagetsi, uye kuderedza mari yekugadzira, vanhu vakatanga kudzidza nzira yekutsiva wiring nekudhinda.Mumakore makumi matatu apfuura, mainjiniya vakaramba vachikurudzira kuwedzera simbi conductor pane insulating substrates for wiring.Yakanyanya kubudirira maive muna 1925, Charles Ducas wekuUnited States akadhinda mapatani edunhu pane insulating substrates, ndokuzobudirira kugadzira makondukita e wiring ne electroplating.
Kusvika 1936, weAustria Paul Eisler (Paul Eisler) akaburitsa foil film tekinoroji muUnited Kingdom.Akashandisa bhodhi redunhu rakadhindwa mumudziyo weredhiyo;Kubudirira kushandiswa kwepatent yenzira yekufuridzira uye wiring (Patent No. 119384).Pakati pezviviri, nzira yaPaul Eisler inonyanya kufanana nemapuranga edunhu akadhindwa nhasi.Iyi nzira inonzi nzira yekubvisa, inova kubvisa simbi isingakoshi;nepo nzira yaCharles Ducas naMiyamoto Kinosuke ndeyekuwedzera chete simbi inodiwa.Wiring inonzi additive method.Kunyange zvakadaro, nokuti zvikamu zvemagetsi panguva iyoyo zvakagadzira kupisa kwakawanda, substrates yezviviri zvakanga zvakaoma kushandisa pamwe chete, saka pakanga pasina kushandiswa kwepamutemo kunoshanda, asi yakaitawo kuti yakadhindwa yedunhu teknolojia danho rinopfuurira.
Nhoroondo
Muna 1941, United States yakapenda paste yemhangura pa talc kuitira wiring kuti iite mafizi epedyo.
Muna 1943, vanhu vekuAmerica vakashandisa tekinoroji iyi zvakanyanya mumaredhiyo emauto.
Muna 1947, epoxy resins yakatanga kushandiswa sekugadzira substrates.Panguva imwecheteyo, NBS yakatanga kudzidza matekinoroji ekugadzira senge coils, capacitors, uye resistors akaumbwa neakadhindwa wedunhu tekinoroji.
Muna 1948, United States yakabvuma zviri pamutemo kugadzirwa kwekutengesa.
Kubva kuma1950s, transistors ine yakaderera kupisa chizvarwa yakatsiva vacuum machubhu, uye yakadhindwa yedunhu bhodhi tekinoroji yatotanga kushandiswa zvakanyanya.Panguva iyoyo, etching foil tekinoroji ndiyo yaive huru.
Muna 1950, Japan yakashandisa pendi yesirivha nokuda kwokuisa waya pazvikamu zviduku zvegirazi;uye foil yemhangura ye wiring papepa phenolic substrates (CCL) yakagadzirwa ne phenolic resin.
Muna 1951, kutaridzika kwe polyimide kwakaita kuti kupisa kweresin kuwedzere danho, uye polyimide substrates yakagadzirwawo.
Muna 1953, Motorola yakagadzira nzira yakapetwa kaviri-yakapetwa kuburikidza neburi.Iyi nzira inoshandiswawo kune gare gare akawanda-layer redunhu mabhodhi.
Muma1960, mushure mekunge bhodhi redunhu rakadhindwa rakashandiswa zvakanyanya kwemakore gumi, tekinoroji yayo yakawedzera kukura.Sezvo Motorola's double-sided board yakabuda, multilayer akadhindwa edunhu mabhodhi akatanga kuoneka, izvo zvakawedzera chiyero che wiring kune substrate nzvimbo.
Muna 1960, V. Dahlgreen akagadzira bhodhi redunhu rakadhindwa nekunamira firimu resimbi rakadhindwa nedunhu mupurasitiki yethermoplastic.
Muna 1961, iyo Hazeltine Corporation yekuUnited States yakataura nezve electroplating kuburikidza-gomba nzira yekugadzira akawanda-layer board.
Muna 1967, "Plated-up tekinoroji", imwe yenzira dzekugadzira-mutsetse, yakabudiswa.
Muna 1969, FD-R yakagadzira mabhodhi edunhu anochinjika ane polyimide.
Muna 1979, Pactel akaburitsa iyo "Pactel nzira", imwe yenzira dzekuwedzera.
Muna 1984, NTT yakagadzira "Copper Polyimide Method" yemasekita-mafirimu matete.
Muna 1988, Siemens yakagadzira Microwiring Substrate kuvaka-up yakadhindwa redunhu bhodhi.
Muna 1990, IBM yakagadzira "Surface Laminar Circuit" (Surface Laminar Circuit, SLC) kuvaka-up yakadhindwa redunhu bhodhi.
Muna 1995, Matsushita Electric yakagadzira ALIVH's kuvaka-up yakadhindwa redunhu board.
Muna 1996, Toshiba akagadzira B2it's kuvaka-up yakadhindwa redunhu bhodhi.
Nguva yekutumira: Feb-24-2023