Classification kubva pasi kusvika kumusoro ndeiyi inotevera:
94HB/94VO/22F/CEM-1/CEM-3/FR-4
Mashoko acho ndeaya:
94HB: Wakajairwa kadhibhodhi, kwete moto (iyo yakaderera giredhi zvinhu, kufa punching, haigone kushandiswa sebhodhi remagetsi)
94V0: kadhibhodhi rinodzosa moto (kufa kubaya)
22F: Single-sided half glass fiber board (kufa kubaya)
CEM-1: Single-sided fiberglass board (inofanira kudhirwa nekombuta, kwete kubaiwa)
CEM-3: Kaviri-sided semi-fiberglass board (kunze kwekadhibhodhi rine mativi maviri, inova zvinhu zvakaderera-magumo kune mapaneru ane mativi maviri. Mapaneru akareruka ane mativi maviri anogona kushandisa chinhu ichi, chinova 5~10 yuan/square. mita yakachipa pane FR-4)
FR-4: Kaviri-sided fiberglass board
Best mhinduro
1.c Kurongeka kwezvinhu zvinodzosa moto zvinogona kukamurwa kuita mhando ina: 94V—0/V-1/V-2 uye 94-HB.
2. Prepreg: 1080=0.0712mm, 2116=0.1143mm, 7628=0.1778mm
3. FR4 CEM-3 ibhodhi, fr4 igirazi fiber board, cem3 ndiyo inoumbwa substrate
4. Halogen-isina inoreva zvinhu zvekutanga zvisina halogen (fluorine, bromine, iodine nezvimwe zvinhu), nokuti bromine ichabudisa gasi rinotyisa kana rapiswa, rinodiwa nekuchengetedzwa kwezvakatipoteredza.
Shanu.Tg ndiyo tembiricha yekushanduka kwegirazi, ndiko kuti, nzvimbo yekunyungudika.
Bhodhi redunhu rinofanirwa kunge risingachinji murazvo, harigone kupisa pane imwe tembiricha, rinogona kupfava chete.Iyo tembiricha yenzvimbo panguva ino inonzi tembiricha yegirazi (Tg point), uye kukosha uku kune hukama nekudzikama kweiyo PCB board.
Chii chakakwira Tg PCB redunhu bhodhi uye zvakanakira kushandisa yakakwira Tg PCB
Kana kutonhora kwepamusoro Tg mapuranga akadhindwa achikwira kune imwe nzvimbo, substrate ichachinja kubva ku "girazi mamiriro" kusvika ku "rubber state", uye kutonhora panguva ino kunonzi girazi rekuchinja kwegirazi (Tg) yebhodhi.Kureva kuti, Tg ndiyo tembiricha yepamusoro (° C.) apo substrate inoramba yakasimba.Kureva kuti, zvakajairika PCB substrate zvinhu kwete chete kupfava, deform, kunyunguduka, etc. panguva yepamusoro tembiricha, asi zvakare kuratidza kuderera kwakanyanya mumakanika uye magetsi zvivakwa (ndinofunga haudi kuona mamiriro aya mune zvigadzirwa zvako. nekutarisa kurongeka kwePCB mabhodhi. ).Ndokumbira usakope zviri pasaiti ino
Kazhinji, iyo Tg yendiro iri pamusoro pe130 madhigirii, iyo yakakwira Tg kazhinji yakakura kupfuura 170 madhigirii, uye yepakati Tg yakakura kupfuura 150 madhigirii.
Kazhinji, mabhodhi akadhindwa ePCB ane Tg ≥ 170 ° C anonzi mabhodhi akadhindwa epamusoro Tg.
Iyo Tg ye substrate inowedzerwa, uye kushorwa kwekupisa, kunyorova kwemvura, kupikisa kwemakemikari, uye kugadzikana kwebhodhi rakadhindwa kuchavandudzwa nekuvandudzwa.Iyo yakakwira iyo TG kukosha, zvirinani kupikisa tembiricha yebhodhi, kunyanya mukutungamira-isina maitiro, kune akawanda akakwira Tg maapplication.
High Tg zvinoreva kupisa kwakanyanya.Nekukurumidza kukura kweindasitiri yemagetsi, kunyanya zvigadzirwa zvemagetsi zvinomiririrwa nemakomputa, zviri kusimukira zvichienda kumabasa epamusoro uye akakwira akawanda-matanho, izvo zvinoda yakakwirira kupisa kupisa kwePCB substrate zvinhu sevimbiso yakakosha.Kubuda nekusimudzirwa kwepamusoro-density mounting technologies inomiririrwa neSMT neCMT yakaita kuti PCB iwedzere uye isingagoni kupatsanurika kubva pakutsigirwa kwekupisa kwekupisa kwe substrate maererano nekuvhura kuduku, mutsara wakanaka, uye kuonda.
Naizvozvo, mutsauko uripo pakati peyakajairwa FR-4 uye yakakwirira Tg FR-4 ndeyekuti iyo mechanic simba, dimensional kugadzikana, adhesion, kunyura kwemvura, uye kuparara kwekupisa kwezvinhu zviri munzvimbo inopisa, kunyanya kana inopisa mushure mekunyorova kwemvura.Kune misiyano mumamiriro akasiyana akadai sekuwedzera kwemafuta, uye yakakwira Tg zvigadzirwa zviri pachena zviri nani pane zvakajairwa PCB substrate zvinhu.
Mumakore achangopfuura, nhamba yevatengi vanoda yakakwirira Tg yakadhindwa mabhodhi yakawedzera gore negore.
PCB board zvinhu ruzivo uye zviyero (2007/05/06 17:15)
Parizvino, kune marudzi akawanda emapuranga akavharidzirwa emhangura anoshandiswa zvakanyanya munyika yangu, uye maitiro avo anoratidzwa mune tafura iri pasi apa: marudzi emapuranga-akapfeka mapuranga, ruzivo rwemapuranga-akapfeka mapuranga.
Kune dzakawanda nzira dzekugadzirisa dzemhangura dzakapfeka laminates.Kazhinji, zvinoenderana neakasiyana ekusimbisa zvinhu zvebhodhi, inogona kukamurwa kuita: pepa base, jira rejira regirazi fiber pcb board,
Composite base (CEM series), laminated multi-layer board base uye yakakosha zvinhu base (ceramic, metal core base, etc.) zvikamu zvishanu.Kana ikashandiswa nebhodhi _)(^$RFSW#$%T
Yakasiyana resin adhesives yakakamurwa, yakajairika mapepa-based CCI.Hongu: phenolic resin (XPC, XxxPC, FR-1, FR
-2, nezvimwewo), epoxy resin (FE-3), polyester resin uye mamwe marudzi.Iyo yakajairika girazi faibha jira base CCL ine epoxy resin (FR-4, FR-5), inova ndiyo inonyanya kushandiswa mhando yegirazi fiber jira base.Mukuwedzera, kune mamwe masara anokosha (girazi fiber jira, polyamide faibha, jira risiri rakarukwa, nezvimwewo sezvimwe zvinhu): bismaleimide yakagadziridzwa triazine resin (BT), polyimide resin (PI) , Diphenylene ether resin (PPO), maleic anhydride imine-styrene resin (MS), polycyanate resin, polyolefin resin, etc. Maererano nekushanda kwemoto weCCL, inogona kugoverwa mumhando mbiri dzemapuranga: flame retardant (UL94-VO, UL94-V1) uye isiri- murazvo unodzoreredza (UL94-HB).Mumakore maviri apfuura, nekunyanya kukoshesa kuchengetedzwa kwezvakatipoteredza, rudzi rutsva rweCCL rusina bromine rwakaparadzaniswa neCCL inopisa moto, iyo inogona kunzi "green flame-retardant CCL".Nekukurumidza kusimudzira kwemagetsi chigadzirwa tekinoroji, kune yakakwirira kuita zvinodiwa zvecCL.Naizvozvo, kubva pachikamu chekushanda kweCCL, yakakamurwa kuita CCL, yakaderera dielectric inogara CCL, yakanyanya kupisa kupisa CCL (kazhinji iyo L yebhodhi iri pamusoro pe150 ° C), uye yakaderera yekupisa yekuwedzera coefficient CCL (inowanzo shandiswa pa kurongedza substrates)) nemamwe marudzi.Nekuvandudzwa uye kuenderera mberi kwehunyanzvi hwemagetsi, zvinodiwa zvitsva zvinogara zvichiiswa pamberi pezvakadhindwa bhodhi substrate zvinhu, nekudaro zvichikurudzira kuenderera mberi kwemhando yemhangura yakapfeka laminate.Parizvino, iwo makuru zviyero zve substrate zvinhu ndeaya anotevera.
①Maitiro eNyika Parizvino, nyika yangu miyero yerudzi rwe substrate zvinhu pcb mabhodhi anosanganisira GB/T4721-47221992 uye GB4723-4725-1992.Iyo chiyero chemhangura yakapfeka laminates muTaiwan, China ndiyo CNS chiyero, iyo yakavakirwa pane yeJapan JIs standard., yakabudiswa muna 1983. gfgfgfggdgeeeejhjj
② Mitemo mikuru yemamwe mazinga enyika ndeiyi: JIS chiyero cheJapan, ASTM, NEMA, MIL, IPc, ANSI, UL standard yeUnited States, Bs standard yeUnited Kingdom, DIN uye VDE chiyero cheGermany, NFC uye UTE mwero. yeFrance, CSA yeCanada Standards, Australia's AS standard, yaimbova Soviet Union's FOCT standard, iyo yepasi rose IEC standard, nezvimwe.
Vatengesi vepakutanga PCB dhizaini zvinhu zvinowanzo shandiswa nemunhu wese: Shengyi\Jiantao\International, nezvimwe.
● Zvinyorwa zvakagamuchirwa: protel autocad powerpcb orcad gerber kana yakasimba kopi bhodhi, nezvimwewo.
● Plate type: CEM-1, CEM-3 FR4, high TG zvinhu;
● Maximum board size: 600mm*700mm(24000mil*27500mil)
● Kugadzira bhodhi ukobvu: 0.4mm-4.0mm(15.75mil-157.5mil)
● Maximum processing layers: 16Layers
● Copper foil layer ukobvu: 0.5-4.0(oz)
● Akapedza ndiro ukobvu kushivirira: +/-0.1mm(4mil)
● Molding dimension tolerance: Kugaya kombiyuta: 0.15mm (6mil) Die stamping: 0.10mm (4mil)
● Mutsara wakaderera wehupamhi / nzvimbo: 0.1mm (4mil) Mutsara wehupamhi hwekutonga kugona: ＜+-20%
● Hudiki hwekuchera dhayamita yechigadzirwa chakapedzwa: 0.25mm (10mil)
Yapedza shoma yekubaya dhayamita yegomba: 0.9mm (35mil)
Yakapedzwa gomba kushivirira: PTH: + -0.075mm (3mil)
NPTH: +-0.05mm (2mil)
● Yakapera gomba madziro mhangura ukobvu: 18-25um (0.71-0.99mil)
● Minimum SMT pitch: 0.15mm (6mil)
● Kuputira pamusoro: chemikemikari immersion goridhe, HASL, bhodhi rose nickel-plated goridhe (mvura / goridhe rakapfava), silk screen blue glue, nezvimwewo.
● Solder mask ukobvu pabhodhi: 10-30μm (0.4-1.2mil)
● Simba rePeel: 1.5N/mm (59N/mil)
● Solder mask kuoma: ＞5H
● Solder resistance plugging capacity: 0.3-0.8mm (12mil-30mil)
● Dielectric nguva dzose: ε = 2.1-10.0
● Insulation resistance: 10KΩ-20MΩ
● Hunhu impedance: 60 ohm±10％
● Thermal shock: 288℃, 10 sec
● Warpage yebhodhi rakapedzwa: <0.7%
● Chigadzirwa chekushandisa: midziyo yekukurukurirana, motokari yemagetsi, instrumentation, global positioning system, komputa, MP4, magetsi, midziyo yemumba, nezvimwewo.
Nguva yekutumira: Mar-30-2023