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Kunyudzwa Goridhe Multilayer PCB Yakadhindwa Circuit Board ine SMT uye DIP

Tsanangudzo Pfupi


Product Detail

Product Tags

Product Details

Product Type PCB Gungano Min.Hole Size 0.12mm
Solder Mask Color Green, Blue, White, Black, Yellow, Red etc
Surface Finish
Surface Finish HASL, Enig, OSP, Gold Finger
Min Trace Width/Space 0.075/0.075mm Mhangura Kukora 1 – 12 Oz
Gungano Modes SMT, DIP, Kuburikidza Negomba Munda Wekushandisa LED, Medical, Industrial, Control Board
Samples Run Available Transport Package Vacuum Packing / Blister / Plastiki / Katuni

Mamwe Mashoko Anoenderana

OEM/ODM/EMS Services PCBA, PCB gungano: SMT & PTH & BGA
PCBA uye enclosure dhizaini
Components sourcing uye kutenga
Quick prototyping
Plastic jekiseni kuumba
Metal sheet stamping
Gungano rekupedzisira
Muedzo: AOI, In-Circuit Test (ICT), Functional Test (FCT)
Custom clearance yekutenga zvinhu kunze kwenyika uye kutumira kunze kwenyika
Zvimwe PCB Gungano Equipments SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4
Reflow Ovheni: FolunGwin FL-RX860
Wave Soldering Machine: FolunGwin ADS300
Automated Optical Inspection (AOI): Mutungamiri ALD-H-350B, X-RAY Testing Service
Fully Automatic SMT Stencil Printer: FolunGwin Win-5

1.SMT ndechimwe chezvinhu zvakakosha zvezvikamu zvemagetsi.Inonzi surface mount tekinoroji (kana pamusoro pekukwira tekinoroji).Iyo yakakamurwa pasina inotungamira kana mapfupi madiki.Igungano redunhu rinounganidzwa nereflow soldering kana dip soldering.Tekinoroji zvakare ndiyo inonyanya kufarirwa tekinoroji uye maitiro muindasitiri yegungano remagetsi.
Zvimiro: Ma substrates edu anogona kushandiswa kugovera magetsi, kufambisa kwemasaini, kupisa kupisa, uye kupihwa kwechimiro.
Zvimiro: Inogona kumira tembiricha uye nguva yekurapa uye solder.
Iyo flatness inosangana nezvinodiwa zvekugadzira maitiro.
Inokodzera rework basa.
Inokodzera nzira yekugadzira ye substrate.
Yakaderera dielectric count uye yakakwirira kuramba.
Zvinhu zvinowanzo shandiswa zvechigadzirwa chedu zvine hutano uye zvine hushamwari epoxy resins uye phenolic resins, ine yakanaka-inodzoreredza murazvo zvivakwa, tembiricha zvivakwa, michina uye dielectric zvivakwa, uye mutengo wakaderera.
Izvo zvataurwa pamusoro apa ndezvekuti iyo substrate yakaoma yakasimba.
Zvigadzirwa zvedu zvakare zvine ma substrates anochinjika, anogona kushandiswa kuchengetedza nzvimbo, kupeta kana kutendeuka, kufamba, uye akagadzirwa neakanyanya kutetepa insulating sheets ane yakanaka high frequency performance.
Izvo zvakashata ndezvekuti maitiro egungano akaoma, uye haakodzere micro-pitch application.
Ini ndinofunga maitiro eiyo substrate madiki anotungamira uye nzvimbo, yakakura ukobvu nenzvimbo, zvirinani kupisa conductivity, kuomarara kwemagetsi zvivakwa, uye kugadzikana kuri nani.Ndinofunga kuti tekinoroji yekuisa pane substrate ndeyekuita kwemagetsi, kune kuvimbika, zvikamu zvakajairika.
Isu hatingove nekuzara otomatiki uye yakabatanidzwa mashandiro, asi zvakare tine vimbiso yakapetwa kaviri yebhuku rekuongorora uye ongororo yemuchina, uye chiyero chekupasa kwezvigadzirwa chakakwira se99.98%.
2.PCB ndiyo inonyanya kukosha yemagetsi zvikamu, uye hapana.Kazhinji, conductive pateni yakagadzirwa neakadhindwa maseketi, akadhindwa zvikamu kana musanganiswa wezviviri pane insulating zvinhu zvinoenderana neyakafanotemerwa dhizaini inonzi yakadhindwa redunhu.Iyo conductive pateni inopa kubatana kwemagetsi pakati pezvikamu pane insulating substrate inonzi yakadhindwa redunhu bhodhi (kana yakadhindwa redunhu bhodhi), inova yakakosha tsigiro yemagetsi zvikamu uye mutakuri anogona kutakura zvikamu.
Ini ndinofunga tinowanzo kuvhura kiibhodhi yekombuta kuti tione firimu rakapfava (flexible insulating substrate) rakadhindwa nesirivha-chena (silver paste) conductive graphics uye positioning graphics.Nekuti rudzi urwu rwepateni runowanikwa neyakajairwa chidzitiro kudhinda nzira, isu tinodaidza iyi yakadhindwa yedunhu bhodhi inochinjika sirivheri paste yakadhindwa redunhu bhodhi.The akadhindwa redunhu mapuranga pamusoro siyana kombiyuta motherboards, Graphics makadhi, network makadhi, modem, ruzha makadhi uye midziyo yemumba zvatinoona muguta kombiyuta zvakasiyana.
Iyo base zvinhu yainoshandisa inogadzirwa nebepa base (inowanzo shandiswa kune rimwe divi) kana girazi jira base (inowanzo shandiswa maviri-mativi uye akawanda-layer), pre-impregnated phenolic kana epoxy resin, rimwe divi kana mativi ese epamusoro. inonamirwa nemhangura yakashongedzwa uye ipapo laminated uye inorapwa yakagadzirwa.Rudzi urwu rwekutenderera bhodhi copper-clad sheet, tinoridaidza kuti rigid board.Mushure mekugadzira bhodhi redunhu rakadhindwa, tinoridaidza kuti rigid rakadhindwa redunhu bhodhi.
A rakadhindwa redunhu bhodhi ane rakadhindwa redunhu pateni kune rimwe divi inonzi rimwe divi rakadhindwa redunhu bhodhi, rakadhindwa redunhu bhodhi rine rakadhindwa redunhu pateni pamativi ese, uye rakadhindwa redunhu bhodhi rinoumbwa nekaviri-mativi interconnection kuburikidza ne metallization ye. maburi, tinoridaidza kuti bhodhi rine mativi maviri.Kana yakadhindwa bhodhi redunhu rine mativi maviri emukati remukati, maviri ega-sided ekunze layer, kana maviri-aviri mativi emukati layer uye maviri ega-sided ekunze layer akashandiswa, iyo yekumisikidza sisitimu uye insulating bonding zvinhu zvinochinjika pamwe uye Iyo yakadhindwa yedunhu. bhodhi ine conductive pateni yakabatana maererano nezvinodiwa zvekugadzira inova mana-layer uye matanhatu-layer yakadhindwa redunhu bhodhi, inozivikanwawo seyakawanda-layer yakadhindwa redunhu bhodhi.
3.PCBA chimwe chezvinhu zvakakosha zvemagetsi zvikamu.Iyo PCB inoenda kuburikidza nemaitiro ese epamusoro Mount tekinoroji (SMT) uye kuiswa kweDIP plug-ins, iyo inonzi PCBA maitiro.Muchokwadi, iPCB ine chidimbu chakabatanidzwa.Imwe ibhodhi rakapedzwa uye imwe ibhodhi isina chinhu.
PCBA inogona kunzwisiswa seyakapedzwa redunhu bhodhi, ndiko kuti, mushure mekunge maitiro ese edunhu bhodhi apera, PCBA inogona kuverengerwa.Nekuda kwekuenderera mberi miniaturization uye kunatsiridza zvigadzirwa zvemagetsi, mazhinji emazuva ano edunhu mabhodhi akabatanidzwa ne etching resists (lamination kana coating).Mushure mekuratidzwa uye kusimudzira, mapuranga edunhu anogadzirwa ne etching.
Munguva yakapfuura, kunzwisiswa kwekuchenesa kwakanga kusina kukwana nokuti gungano rePCBA rakanga risina kukwirira, uye yaitendwawo kuti iyo yakasara yakasara yakanga isiri-conductive uye yakaipa, uye yaisazokanganisa kushanda kwemagetsi.
Magungano emazuva ano emagetsi anowanzoita kunge ari madiki, kunyangwe midziyo midiki, kana matinji madiki.Mapini nemapedhi ari kuswedera pedyo nekuswedera.Mazuva ano maburi ari kuita madiki uye madiki, uye zvinosvibisa zvinogona zvakare kunamira mumipata, izvo zvinoreva kuti zvidimbu zvidiki, kana zvikaramba zviri pakati pemapupa maviri, zvinogona zvakare kuve Zvakaipa chiitiko chinokonzerwa nepfupi dunhu.
Mumakore achangopfuura, indasitiri yemagungano emagetsi yave kuwedzera kuziva uye kutaura nezvekuchenesa, kwete chete kune zvinodiwa zvechigadzirwa, asiwo nezvezvakatipoteredza zvinodiwa uye kuchengetedza hutano hwevanhu.Naizvozvo, kune vazhinji vatengesi vemidziyo yekuchenesa uye mhinduro, uye kuchenesa kwavewo chimwe chezvinhu zvikuru zviri mukati mekutsinhana kwehunyanzvi uye nhaurirano muindasitiri yegungano remagetsi.
4. DIP chimwe chezvikamu zvakakosha zvezvikamu zvemagetsi.Inodaidzwa kuti mbiri-in-mutsara yekurongedza tekinoroji, iyo inoreva akasanganiswa edunhu machipisi akaiswa mune mbiri-mu-mutsara kurongedza.Iyi fomu yekurongedza inoshandiswawo mune akawanda madiki uye epakati-saizi akabatanidzwa maseketi., nhamba yepini kazhinji haipfuure zana.
Iyo CPU chip yeDIP yekurongedza tekinoroji ine mitsara miviri yemapini, ayo anoda kuiswa muchip socket ine DIP chimiro.
Zvechokwadi, inogonawo kuiswa zvakananga mubhodhi redunhu nenhamba yakafanana yemakomba ekutengesa uye geometric kuronga kwekutengesa.
DIP yekurongedza tekinoroji inofanirwa kutarisisa zvakanyanya paunenge uchiisa nekuburitsa kubva pane chip socket kudzivirira kukuvadzwa kwepini.
Zvimiro ndezvi: multi-layer ceramic DIP DIP, single-layer ceramic DIP DIP, lead frame DIP (kusanganisira girazi ceramic sealing type, epurasitiki kurongedza chimiro chemhando, ceramic yakaderera kunyungudika girazi mhando) zvichingodaro.
DIP plug-in inobatanidza mukugadzirwa kwemagetsi, kune manyorero plug-ins, asiwo AI muchina plug-ins.Isa zvinhu zvakatsanangurwa munzvimbo yakatarwa.Manual plug-ins zvakare inofanirwa kuenda kuburikidza ne wave soldering kune solder zvemagetsi zvikamu pabhodhi.Pamusoro pezvikamu zvakaiswa, zvakakosha kutarisa kuti zvakapinzwa zvisiri izvo here kana kuti zvakapotsa.
DIP plug-in post-soldering inzira yakakosha zvikuru mukugadziriswa kwepcba patch, uye maitiro ayo ekugadzirisa anokanganisa zvakananga basa repcba board, kukosha kwayo kunokosha zvikuru.Zvadaro post-soldering, nokuti zvimwe zvikamu, maererano nemiganhu yegadziriro uye zvinhu, hazvigone kutengeswa nemuchina wekutengesa solder, uye zvinogona kuitwa chete nemaoko.
Izvi zvinoratidzawo kukosha kweDIP plug-ins muzvikamu zvemagetsi.Chete nekuteerera kune zvese zvinogona kuve zvisinganzwisisiki zvachose.
Mune izvi zvikamu zvina zvikuru zvemagetsi, chimwe nechimwe chine zvakanakira, asi chinopindirana kugadzira iyi nhevedzano yekugadzira maitiro.Chete nekutarisa mhando yezvigadzirwa zvekugadzira zvinogona kuwanda kwevashandisi uye vatengi kuona zvinangwa zvedu.

One-stop Solution

PD-2

Factory Exhibition

PD-1

Semubatsiri-anotungamira PCB kugadzira uye PCB musangano (PCBA) mubatsiri, Evertop inoyedza kutsigira bhizinesi diki-repakati neruzivo rweinjiniya muElectronics Manufacturing Services (EMS) kwemakore.

FAQ

Q1: unoita sei shuwa kunaka kwePCBs?
A1: MaPCB edu ese 100% bvunzo kusanganisira Flying Probe Test, E-test kana AOI.

Q2: Ndingawana mutengo wakanakisisa here?
A2: Hongu.Kubatsira vatengi kudzora mutengo ndizvo zvatiri kugara tichiedza kuita.Mainjiniya edu achapa yakanakisa dhizaini kuchengetedza PCB zvinhu.

Q3: Ndinogona kuwana sampuli yemahara?
A3: Hongu, Kugamuchirwa kuti uwane basa redu uye unhu.Unoda kuita mubhadharo pakutanga, uye tichadzorera mutengo wemuenzaniso apo yako inotevera yakawanda yakawanda.


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