Kodi PCBA ndi mbiri yake yachitukuko ndi chiyani

PCBA ndiye chidule cha Printed Circuit Board Assembly mu Chingerezi, ndiye kuti, bolodi yopanda kanthu ya PCB imadutsa kumtunda kwa SMT, kapena njira yonse ya pulagi ya DIP, yotchedwa PCBA.Iyi ndi njira yomwe imagwiritsidwa ntchito kwambiri ku China, pomwe njira yokhazikika ku Europe ndi America ndi PCB' A, onjezerani "'", yomwe imatchedwa chiganizo chovomerezeka.

Losindikizidwa dera bolodi, amatchedwanso kusindikizidwa dera bolodi, kusindikizidwa dera bolodi, nthawi zambiri amagwiritsa English chidule PCB (Kusindikizidwa dera bolodi), ndi yofunika pakompyuta chigawo chimodzi, thandizo kwa zigawo zikuluzikulu pakompyuta, ndi wopereka kugwirizana dera kwa zigawo zikuluzikulu zamagetsi.Chifukwa chakuti amapangidwa pogwiritsa ntchito njira zosindikizira zamagetsi, amatchedwa bolodi "losindikizidwa".Asanayambe kuwonekera kwa matabwa a dera osindikizidwa, kugwirizanitsa pakati pa zipangizo zamagetsi kumadalira kugwirizana kwa mawaya kuti apange dera lonse.Tsopano, gulu dera limakhalapo ngati chida choyesera chothandiza, ndipo bolodi losindikizidwa lakhala gawo lalikulu kwambiri pamakampani opanga zamagetsi.Kumayambiriro kwa zaka za m’ma 1900, pofuna kuchepetsa kupanga makina amagetsi, kuchepetsa mawaya pakati pa zipangizo zamagetsi, komanso kuchepetsa mtengo wopangira, anthu anayamba kuphunzira njira yosinthira waya ndi kusindikiza.M'zaka 30 zapitazi, mainjiniya akhala akuganiza zowonjezera ma conductor zitsulo pazigawo zotsekera zopangira mawaya.Chopambana kwambiri chinali mu 1925, Charles Ducas waku United States adasindikiza mawonekedwe ozungulira pazigawo zotchingira, ndiyeno adakhazikitsa bwino ma kondakitala opangira ma waya ndi electroplating.

Mpaka 1936, Paul Eisler waku Austrian (Paul Eisler) adafalitsa ukadaulo wamakanema ojambulidwa ku United Kingdom.Anagwiritsa ntchito bolodi ladera losindikizidwa mu chipangizo cha wailesi;Anagwiritsidwa ntchito bwino patent ya njira yowomba ndi waya (Patent No. 119384).Pakati pa ziwirizi, njira ya Paul Eisler ndi yofanana kwambiri ndi matabwa a dera osindikizidwa masiku ano.Njirayi imatchedwa njira yochotsera, yomwe ndi kuchotsa zitsulo zosafunikira;pamene njira ya Charles Ducas ndi Miyamoto Kinosuke ndiyowonjezera zitsulo zofunikira zokha.Wiring amatchedwa njira yowonjezera.Ngakhale zinali choncho, chifukwa chakuti zida zamagetsi panthawiyo zinkapanga kutentha kwakukulu, magawo awiriwa anali ovuta kugwiritsira ntchito palimodzi, kotero panalibe ntchito yovomerezeka yogwiritsidwa ntchito, koma inachititsanso kuti makina osindikizira osindikizira apite patsogolo.

Mbiri
Mu 1941, United States inapenta phala lamkuwa pa talc kuti apange mawaya kuti apange ma fuse oyandikira.
Mu 1943, anthu aku America adagwiritsa ntchito ukadaulo uwu kwambiri pamawailesi ankhondo.
Mu 1947, ma epoxy resins adayamba kugwiritsidwa ntchito ngati magawo opangira.Nthawi yomweyo, NBS idayamba kuphunzira zaukadaulo wopanga monga ma coils, ma capacitor, ndi zopinga zomwe zimapangidwa ndiukadaulo wamagawo osindikizidwa.
Mu 1948, dziko la United States linavomereza mwalamulo kupangidwa kwa malonda.
Kuyambira m'ma 1950, ma transistors okhala ndi kutentha pang'ono asintha kwambiri machubu a vacuum, ndipo ukadaulo wa board board wosindikizidwa wangoyamba kugwiritsidwa ntchito kwambiri.Panthawiyo, teknoloji ya etching foil inali yofala kwambiri.
Mu 1950, Japan anagwiritsa ntchito utoto wasiliva poika mawaya pa magalasi;ndi zojambulazo zamkuwa zopangira waya pamapepala a phenolic substrates (CCL) opangidwa ndi phenolic resin.
Mu 1951, mawonekedwe a polyimide adapangitsa kuti kutentha kwa utomoni kupitirire patsogolo, ndipo magawo a polyimide adapangidwanso.
Mu 1953, Motorola idapanga njira yokhala ndi mbali ziwiri.Njirayi imagwiritsidwanso ntchito kumagulu am'tsogolo amitundu yambiri.
M’zaka za m’ma 1960, gulu loyendera dera losindikizidwa litagwiritsidwa ntchito kwambiri kwa zaka 10, ukadaulo wake unakula kwambiri.Popeza bolodi la mbali ziwiri la Motorola linatuluka, matabwa osindikizira a multilayer anayamba kuonekera, zomwe zinawonjezera chiŵerengero cha mawaya ku gawo lapansi.

Mu 1960, V. Dahlgreen anapanga bolodi losinthasintha losindikizidwa mwa kumata filimu yachitsulo yachitsulo yosindikizidwa ndi dera mu pulasitiki ya thermoplastic.
Mu 1961, bungwe la Hazeltine ku United States linatchula njira ya electroplating kupyolera-bowo kuti apange matabwa amitundu yambiri.
Mu 1967, "Plated-up technology", imodzi mwa njira zomangira zosanjikiza, idasindikizidwa.
Mu 1969, FD-R idapanga matabwa osinthika osindikizidwa okhala ndi polyimide.
Mu 1979, Pactel adasindikiza "njira ya Pactel", imodzi mwa njira zowonjezera zowonjezera.
Mu 1984, NTT inapanga "Copper Polyimide Method" yozungulira mafilimu ochepa.
Mu 1988, Nokia idapanga bolodi yosindikiza ya Microwiring Substrate.
Mu 1990, IBM idapanga "Surface Laminar Circuit" (Surface Laminar Circuit, SLC) yosindikiza yosindikiza.
Mu 1995, Matsushita Electric adapanga gulu losindikizidwa la ALIVH.
Mu 1996, Toshiba adapanga bolodi losindikizidwa la B2it.