Ndondomeko yeniyeni ya ndondomeko ya bolodi ya PCB

Njira yopangira ma board a PCB imatha kugawidwa m'magawo khumi ndi awiri otsatirawa.Njira iliyonse imafunikira njira zosiyanasiyana zopangira.Tikumbukenso kuti ndondomeko otaya matabwa ndi nyumba zosiyana ndi osiyana.Njira yotsatirayi ndiyo kupanga kwathunthu kwa PCB yamitundu yambiri.njira yopita;

Choyamba.Wosanjikiza wamkati;makamaka kupanga mkati wosanjikiza dera la bolodi PCB dera;kupanga ndi:
1. Kudula bolodi: kudula gawo lapansi la PCB kukhala kukula kwake;
2. Chithandizo chisanachitike: yeretsani pamwamba pa gawo lapansi la PCB ndikuchotsa zowononga pamtunda
3. Laminating filimu: muiike youma filimu pamwamba pa gawo lapansi PCB kukonzekera wotsatira fano kutengerapo;
4. Kuwonekera: Gwiritsani ntchito zipangizo zowonetsera kuti muwonetse gawo lapansi lophatikizidwa ndi filimu ndi kuwala kwa ultraviolet, kuti mutenge chithunzi cha gawo lapansi ku filimu yowuma;
5. DE: Gawoli pambuyo powonekera limapangidwa, lokhazikika, ndikuchotsedwa filimu, ndiyeno kupanga bolodi lamkati lamkati kumatsirizidwa.
Chachiwiri.Kuyendera mkati;makamaka kuyesa ndi kukonza mabwalo a board;
1. AOI: AOI optical scanning, yomwe ingafananize chithunzi cha bolodi ya PCB ndi deta ya bolodi yabwino yomwe yalowetsedwa, kuti mupeze mipata, kukhumudwa ndi zochitika zina zoipa pa chithunzi cha bolodi;
2. VRS: Zithunzi zoyipa zomwe zapezedwa ndi AOI zitumizidwa ku VRS kuti ziwonjezedwe ndi ogwira nawo ntchito.
3. Waya wowonjezera: Solder waya wa golide pamphang'ono kapena kukhumudwa kuti magetsi asathe;
Chachitatu.Kupondereza;monga momwe dzinalo likusonyezera, matabwa angapo amkati amapanikizidwa mu bolodi limodzi;
1. Browning: Browning amatha kuonjezera kugwirizana pakati pa bolodi ndi utomoni, ndikuwonjezera kunyowa kwa mkuwa;
2. Riveting: Dulani PP m'mapepala ang'onoang'ono ndi kukula kwabwino kuti mupange bolodi lamkati ndi PP yogwirizana
3. Kupiringizana ndi kukanikiza, kuwombera, gong edging, edging;
Chachinayi.Kubowola: malinga ndi zofuna za makasitomala, gwiritsani ntchito makina obowola pobowola mabowo okhala ndi ma diameter osiyanasiyana ndi kukula kwake pa bolodi, kuti mabowo pakati pa matabwa azitha kugwiritsidwa ntchito pokonza pulagi-ins, ndipo angathandizenso bolodi kuti iwonongeke. kutentha;

Chachisanu, mkuwa woyambirira;kuyika mkuwa pamabowo obowoleza a bolodi lakunja, kotero kuti mizere ya gulu lililonse imachitika;
1. Deburring line: chotsani ma burrs pamphepete mwa dzenje la bolodi kuti mupewe kuyika kwa mkuwa kosauka;
2. Mzere wochotsa zomatira: chotsani zotsalira za guluu mu dzenje;kuonjezera zomatira pa micro-etching;
3. Mkuwa umodzi (pth): Kuyika kwa mkuwa mu dzenje kumapangitsa kuzungulira kwa gawo lililonse la bolodi, ndipo nthawi yomweyo kumawonjezera makulidwe amkuwa;
Wachisanu ndi chimodzi, wosanjikiza wakunja;gawo lakunja liri lofanana ndi ndondomeko ya mkati mwa sitepe yoyamba, ndipo cholinga chake ndikuthandizira ndondomeko yotsatila kuti apange dera;
1. Pre-mankhwala: Yeretsani pamwamba pa bolodi mwa pickling, kupaka ndi kuyanika kuti muwonjezere kumamatira kwa filimu youma;
2. Laminating filimu: muiike filimu youma pamwamba pa gawo lapansi la PCB kukonzekera kutengerapo chithunzi chotsatira;
3. Kuwonekera: irradiate ndi UV kuwala kuti youma filimu pa bolodi kupanga polymerized ndi unpolymerized boma;
4. Chitukuko: sungunulani filimu yowuma yomwe siinapangidwe polima panthawi yowonekera, ndikusiya kusiyana;
Chachisanu ndi chiwiri, chachiwiri mkuwa ndi etching;plating yachiwiri yamkuwa, etching;
1. Chachiwiri mkuwa: Electroplating chitsanzo, mtanda mankhwala mkuwa kwa malo osaphimbidwa ndi youma filimu mu dzenje;pa nthawi yomweyo kuonjezera madutsidwe ndi makulidwe mkuwa, ndiyeno kudutsa malata plating kuteteza umphumphu wa dera ndi mabowo pa etching;
2. SES: Ikani mkuwa wapansi pamalo omata filimu yakunja yowuma (filimu yonyowa) kudzera munjira monga kuchotsa filimu, etching, ndi kuvula malata, ndipo gawo lakunja lamalizidwa;

Chachisanu ndi chitatu, kukana kwa solder: kumatha kuteteza bolodi ndikuletsa makutidwe ndi okosijeni ndi zochitika zina;
1. Pretreatment: pickling, akupanga kutsuka ndi njira zina kuchotsa oxides pa bolodi ndi kuonjezera roughness wamkuwa pamwamba;
2. Kusindikiza: Phimbani mbali za bolodi la PCB zomwe siziyenera kugulitsidwa ndi inki ya solder kuti igwire ntchito yoteteza ndi kutchinjiriza;
3. Pre-kuphika: kuyanika zosungunulira mu solder kukana inki, ndipo nthawi yomweyo kuumitsa inki kukhudzana;
4. Kuwonekera: Kuchiritsa solder kukana inki ndi UV kuwala walitsa, ndi kupanga mkulu maselo polima kudzera photopolymerization;
5. Chitukuko: chotsani njira yothetsera sodium carbonate mu inki yopanda polymerized;
6. Pambuyo kuphika: kuumitsa kwathunthu inki;
Chachisanu ndi chinayi, malemba;zolemba zosindikizidwa;
1. Pickling: Yeretsani pamwamba pa bolodi, chotsani makutidwe ndi okosijeni pamwamba kuti mulimbikitse kumamatira kwa inki yosindikiza;
2. Zolemba: zolemba zosindikizidwa, zosavuta kutengera njira yowotcherera;
Chakhumi, pamwamba mankhwala OSP;mbali ya mbale yamkuwa yopanda kanthu kuti iwotchedwe imakutidwa kuti ipange filimu yachilengedwe kuti iteteze dzimbiri ndi makutidwe ndi okosijeni;
Chakhumi ndi chimodzi, kupanga;mawonekedwe a bolodi amafunidwa ndi kasitomala amapangidwa, omwe ndi osavuta kuti kasitomala achite kuyika ndi kusonkhana kwa SMT;
Chakhumi ndi chiwiri, kuyesa kofufuza kowuluka;yesani dera la bolodi kuti mupewe kutuluka kwa bolodi lalifupi;
Chakhumi ndi chitatu, FQC;kuyendera komaliza, sampuli ndi kuyendera kwathunthu mukamaliza njira zonse;
Chakhumi ndi chinayi, kulongedza ndi kutuluka m'nyumba yosungiramo katundu;vacuum-paketi yomalizidwa PCB bolodi, paketi ndi sitima, ndi malizitsani yobereka;