Introduction
3C products such as computers and related products, communication products and consumer electronics are the main application fields of PCB. According to data released by the Consumer Electronics Association (CEA), global consumer electronics sales will reach US$964 billion in 2011, a year-on-year increase of 10%. The 2011 figure was pretty close to $1 trillion. According to CEA, the largest demand comes from smart phones and notebook computers, and other products with significant sales include digital cameras, LCD TVs and other products.
smart phone
According to the latest market research report released by Markets and Markets, the global mobile phone market will increase to US$341.4 billion in 2015, of which the sales revenue of smartphones will reach US$258.9 billion, accounting for 76% of the total revenue of the entire mobile phone market; while Apple will Occupy the global mobile phone market with a 26% market share.
iPhone 4 PCB adopts Any Layer HDI board, any layer high-density connection board. In order to fit all the chips in the front and back of the iPhone 4 in a very small PCB area, the Any Layer HDI board is used to avoid the waste of space caused by the boot or drilling, and to achieve the purpose of conducting on any layer.
touch panel
With the popularity of iPhone and iPad all over the world and the popularity of multi-touch applications, it is predicted that the trend of touch control will become the next wave of growth drivers for soft boards. DisplaySearch expects shipments of touchscreens required for tablets to reach 260 million units in 2016, a 333% increase from 2011.
computer
According to Gartner analysts, notebook computers have been the growth engine of the PC market over the past five years, with an average annual growth rate of nearly 40%. Based on expectations of weakening demand for notebook computers, Gartner predicts that worldwide PC shipments will reach 387.8 million units in 2011 and 440.6 million units in 2012, a 13.6 percent increase over 2011. Sales of mobile computers, including tablets, will reach $220 billion in 2011, and sales of desktop computers will hit $96 billion in 2011, bringing total PC sales to $316 billion, the CEA said.
The iPad 2 was officially released on March 3, 2011, and will use 4th-order Any Layer HDI in the PCB process. The Any Layer HDI adopted by Apple iPhone 4 and iPad 2 will trigger an industry boom. It is expected that Any Layer HDI will be applied in more and more high-end mobile phones and tablet computers in the future.
e-book
According to DIGITIMES Research, global e-book shipments are expected to reach 28 million units in 2013, with a compound annual growth rate of 386% from 2008 to 2013. According to the analysis, by 2013, the global e-book market will reach 3 billion US dollars. The design trend of PCB boards for e-books: first, the number of layers is required to increase; second, blind and buried via technology is required; third, PCB substrates suitable for high-frequency signals are required.
digital camera
Digital camera production will begin to stagnate in 2014 as the market becomes saturated, ISuppli said. Shipments are expected to decline 0.6 percent to 135.4 million units in 2014, with low-end digital cameras facing strong competition from camera phones. But there are still some areas of the industry that can see growth, such as hybrid high-definition (HD) cameras, future 3D cameras, and higher-end cameras like digital single-lens reflex cameras (DSLRs). Other growth areas for digital cameras include the integration of features such as GPS and Wi-Fi, increasing their attractiveness and potential for everyday use. Prompting the further improvement of the FPC market, in fact, any thin, light and small electronic products have a strong demand for FPCs.
LCD TV
Market research firm DisplaySearch predicts that global LCD TV shipments will reach 215 million units in 2011, a year-on-year increase of 13%. In 2011, as manufacturers gradually replace the backlight of LCD TVs, LED backlight modules will gradually become the mainstream, bringing technological trends to LED heat dissipation substrates: 1. High heat dissipation, heat dissipation substrate with precise dimensions; 2. Strict line alignment Accuracy, high-quality metal circuit adhesion; 3. Use yellow light lithography to make thin-film ceramic heat dissipation substrates to improve LED high power.
LED lighting
DIGITIMES Research analysts pointed out that in response to the ban on the production and sales of incandescent lamps in 2012, the shipment of LED bulbs will grow significantly in 2011, and the output value is estimated to reach about 8 billion US dollars. Driven by factors such as the implementation of subsidy policies for green products such as LED lighting, and the high willingness of stores, stores and factories to replace them with LED lighting, the penetration rate of the global LED lighting market in terms of output value has a great chance to exceed 10%. LED lighting, which took off in 2011, will definitely drive a large demand for aluminum substrates.
LED lighting
Post time: Feb-27-2023