PCBA na PCB Board Assembly maka ngwaahịa eletrọnịkị
Nkọwa ngwaahịa
| Ụdị NO. | ETP-005 | Ọnọdụ | Ọhụrụ |
| Obosara/Oghere Obere Chọpụta | 0.075 / 0.075mm | Ọkpụkpụ ọla kọpa | 1 – 12 Oz |
| Ụdị Mgbakọ | SMT, DIP, Site na oghere | Ubi ngwa | LED, Medical, Industrial, Control Board |
| Sample Run | Dị | Ngwungwu njem | Mbukota Vacuum/Blister/Plastic/Katuunu |
PCB (PCB Assembly) ikike nhazi
| Achọrọ nka na ụzụ | Ọkachamara elu-n'ịgbakwasị na Site-hole soldering Technology |
| Ụdị dị iche iche dị ka 1206,0805,0603 components SMT technology | |
| ICT (N'ime ule sekit), teknụzụ FCT (Ule Circuit arụ ọrụ). | |
| Mgbakọ PCB na UL,CE,FCC,Rohs nkwado | |
| Nitrogen gas reflow technology soldering maka SMT | |
| High Standard SMT&Solder Assembly Line | |
| Ikike teknụzụ ntinye osisi jikọtara ọnụ njupụta dị elu | |
| Nkwupụta & Mmepụta chọrọ | Faịlụ Gerber ma ọ bụ faịlụ PCB maka imepụta bọọdụ PCB efu |
| Bom (Bill of Material) maka Mgbakọ, PNP (Pick and Place file) yana ọnọdụ akụrụngwa chọkwara na mgbakọ. | |
| Iji belata oge ntinye akwụkwọ, biko nye anyị nọmba akụkụ zuru oke maka akụrụngwa ọ bụla, ọnụọgụ kwa bọọdụ yana ọnụọgụ maka iwu. | |
| Ntuziaka Nleba&Ụzọ Nnwale ọrụ iji hụ na ịdịmma ruru ihe fọrọ nke nta ka ọ bụrụ 0% nbibi |
The kpọmkwem usoro nke PCBA
1) Usoro nhazi nke akụkụ abụọ na nkà na ụzụ.
① Mbelata ihe - mwepu-oghere na zuru efere electroplating-nfefe ụkpụrụ (ihe nkiri e guzobere, ikpughe, mmepe) -etching na film mwepụ - solder nkpuchi na odide-HAL ma ọ bụ OSP, wdg-ụdị nhazi-nlebaanya-emechara ngwaahịa.
② Ịcha ihe - egwu egwu - oghere - nfefe ụkpụrụ - eletrọnịkị - iwepụ ihe nkiri na etching - mwepụ ihe nkiri mgbochi corrosion (Sn, ma ọ bụ Sn / pb) - nkwụnye ihe nkwụnye - - ihe mkpuchi na ihe odide - HAL ma ọ bụ OSP, wdg - nhazi nhazi. -nyocha-emecha ngwaahịa
(2) Usoro bọọdụ multi-layer conventional na teknụzụ.
Mkpụcha ihe—mmepụta oyi akwa ime—ọgwụgwọ ọxịdashọn—lamination—mkpọpu ihe—ịkwadebe oghere (nwere ike kewaa ya n'ime bọọdụ zuru oke na ihe nrụnye ụkpụrụ) — mmepụta oyi akwa elu — mkpuchi elu — Nhazi ụdị—Nnyocha—Emechaala ngwaahịa.
(Rịba ama 1): Mmepụta oyi akwa dị n'ime na-ezo aka na usoro nke osisi na-arụ ọrụ mgbe emechara ihe - nnyefe ụkpụrụ (mmepụta ihe nkiri, ikpughe, mmepe) -etching na mwepụ ihe nkiri - nyocha, wdg.
(Rịba ama 2): Ịmepụta akwa oyi akwa na-ezo aka na usoro nke ime efere site na oghere electroplating-nfefe (mmepụta ihe nkiri, ikpughe, mmepe) -etching na ihe nkiri.
(Rịba ama 3): mkpuchi elu (plating) pụtara na mgbe emechara oyi akwa nke mpụta - ihe mkpuchi solder na ihe odide - mkpuchi (plating) oyi akwa (dị ka HAL, OSP, chemical Ni / Au, chemical Ag, chemical Sn, wdg. Chere. ).
(3) Eliri / kpuru ìsì site na usoro nhazi na teknụzụ multilayer.
A na-ejikarị usoro lamination usoro.nke bu:
Mbelata ihe - na-akpụ isi bọọdụ (nke dabara na bọọdụ nwere akụkụ abụọ ma ọ bụ multi-layer) -lamination - usoro a bụ otu ihe ahụ dị ka bọọdụ ọtụtụ oyi akwa.
(Rịba ama 1): Ịmepụta bọọdụ isi na-ezo aka n'ịmepụta bọọdụ multi-layer nke nwere oghere ndị e liri / kpuru ìsì dị ka usoro ihe a chọrọ ka emechara bọọdụ nwere akụkụ abụọ ma ọ bụ multi-layer site na usoro ọdịnala.Ọ bụrụ na akụkụ akụkụ nke oghere nke isi ihe dị ukwuu, a ga-eme ọgwụgwọ nkwụsị nke oghere iji hụ na a pụrụ ịdabere na ya.
(4) Usoro eruba na nkà na ụzụ nke laminated multi-layer osisi.
Ngwọta otu nkwụsị
Ihe ngosi ụlọ ahịa
Dị ka a ọrụ-eduga PCB n'ichepụta na PCB mgbakọ (PCBA) ibe, Evertop na-agbalịsi ike na-akwado mba obere-ọkara azụmahịa na engineering ahụmahụ na Electronic Manufacturing Services (EMS) ruo ọtụtụ afọ.
