PCBA bụ abbreviation nke Printed Circuit Board Assembly na Bekee, ya bụ, osisi PCB efu na-agafe n'akụkụ elu SMT, ma ọ bụ usoro dum nke nkwụnye DIP, nke a na-akpọ PCBA.Nke a bụ usoro a na-ejikarị na China, ebe usoro ọkọlọtọ na Europe na America bụ PCB' A, tinye "'", nke a na-akpọ akpaala okwu gọọmentị.
bọọdụ sekit e biri ebi, nke a makwaara dị ka bọọdụ sekit e biri ebi, bọọdụ sekit e biri ebi, na-ejikarị okwu mkpirisi Bekee PCB (Printed circuit board) eme ihe, bụ akụkụ elektrọnik dị mkpa, nkwado maka akụrụngwa eletrọnịkị, yana onye na-enye njikọ sekit maka akụrụngwa eletrọnịkị.Ebe ọ bụ na a na-eji usoro obibi akwụkwọ eletrọnịkị eme ya, a na-akpọ ya bọọdụ sekit “e biri ebi”.Tupu ọdịdị nke bọọdụ sekit ndị e biri ebi, njikọ dị n'etiti ihe elektrọnik na-adabere na njikọ kpọmkwem nke wires iji mepụta sekit zuru oke.Ugbu a, panel sekit dị naanị dị ka ngwá ọrụ nnwale dị irè, na bọọdụ sekit e biri ebi aghọwo ọnọdụ zuru oke na ụlọ ọrụ eletrọnịkị.Ná mmalite nke narị afọ nke 20, iji mee ka mmepụta nke igwe eletrik dị mfe, belata wiring n'etiti akụkụ eletrọnịkị, ma belata ọnụ ahịa mmepụta, ndị mmadụ malitere ịmụ usoro iji dochie wiring na mbipụta.N'ime afọ 30 gara aga, ndị injinia anọgidewo na-atụ aro ịgbakwunye ndị na-eduzi ígwè na ihe mkpuchi maka wiring.Nke kacha nwee ihe ịga nke ọma bụ na 1925, Charles Ducas nke United States bipụtara usoro sekit na ihe mkpuchi mkpuchi, wee guzobe ndị nduzi maka wiring site na electroplating.
Ruo 1936, onye Ọstria Paul Eisler (Paul Eisler) bipụtara teknụzụ ihe nkiri foil na United Kingdom.O ji bọọdụ sekit e biri ebi n’ime ihe redio;Ejiri nke ọma tinye akwụkwọ maka patent maka usoro ịfụ na wiring (Patent No. 119384).N'ime ha abụọ, usoro Paul Eisler yiri bọọdụ sekit e biri ebi taa.A na-akpọ usoro a ụzọ mwepu, nke bụ iwepụ ígwè na-adịghị mkpa;ebe usoro Charles Ducas na Miyamoto Kinosuke bụ ịgbakwunye naanị ígwè a chọrọ.A na-akpọ wiring usoro mgbakwunye.N'agbanyeghị nke ahụ, n'ihi na ihe ndị e ji emepụta ngwá electronic n'oge ahụ na-emepụta oké okpomọkụ, ihe ndị dị n'ime ihe abụọ ahụ na-esiri ike ijikọ ọnụ, n'ihi ya, ọ dịghị ihe ọ bụla a na-eji eme ihe, ma o mekwara ka nkà na ụzụ sekit e biri ebi bụrụ nzọụkwụ ọzọ.
Akụkọ ihe mere eme
Na 1941, United States na-ese ọla kọpa na talc maka wiring iji mee fuses nso.
Na 1943, ndị America jiri teknụzụ a mee ihe n'ọtụtụ ebe na redio ndị agha.
N'afọ 1947, a malitere iji resin epoxy dị ka ihe nrụpụta.N'otu oge ahụ, NBS malitere ịmụ teknụzụ n'ichepụta ihe dị ka coils, capacitors, na resistors nke teknụzụ sekit ebipụtara.
N'afọ 1948, United States kwadoro ihe e mepụtara maka iji azụmahịa.
Kemgbe afọ ndị 1950, transistor nwere ọgbọ okpomọkụ dị ala ejirila nke ukwuu dochie tubes agụụ, na teknụzụ bọọdụ sekit ebipụtara ka amalitela iji ya mee ihe.N'oge ahụ, etching foil technology bụ isi ihe.
Na 1950, Japan ji agba ọlaọcha mee wiring na iko iko;na foil ọla kọpa maka wiring na mpempe akwụkwọ phenolic (CCL) nke resin phenolic mere.
N'afọ 1951, ọdịdị nke polyimide mere ka okpomọkụ na-eguzogide resin na-aga n'ihu, a na-emepụtakwa ihe ndị dị na polyimide.
N'afọ 1953, Motorola mepụtara usoro nke nwere akụkụ abụọ nke nwere akụkụ oghere.A na-etinyekwa usoro a na bọọdụ sekit nke ọtụtụ oyi akwa.
N'afọ ndị 1960, mgbe e jichara bọọdụ sekit e biri ebi ruo afọ 10, nkà na ụzụ ya bịara na-eto eto.Ebe bọọdụ nwere akụkụ abụọ nke Motorola pụtara, bọọdụ sekit e biri ebi multilayer malitere ịpụta, nke mụbara oke nke wiring na mpaghara mkpụrụ.
N'afọ 1960, V. Dahlgreen mere bọọdụ sekit a na-ebipụta na-agbanwe agbanwe site n'ịkwado ihe nkiri metal foil nke e bipụtara na sekit na plastik thermoplastic.
Na 1961, Hazeltine Corporation nke United States na-ezo aka na usoro electroplating site-hole iji mepụta bọọdụ multi-layer.
N'afọ 1967, e bipụtara "Technology Plated-up", otu n'ime usoro ihe eji arụ ụlọ oyi akwa.
Na 1969, FD-R rụpụtara bọọdụ sekit na-agbanwe agbanwe na polyimide.
N'afọ 1979, Pactel bipụtara "Ụzọ Pactel", otu n'ime usoro ntinye oyi akwa.
N'afọ 1984, NTT mepụtara usoro "Copper Polyimide Method" maka sekit ihe nkiri dị mkpa.
N'afọ 1988, Siemens mepụtara bọọdụ sekit e biri ebi na Microwiring Substrate.
Na 1990, IBM mepụtara bọọdụ sekit e biri ebi na-ewuli elu “Surface Laminar Circuit” (Surface Laminar Circuit, SLC).
N'afọ 1995, Matsushita Electric mepụtara bọọdụ sekit e biri ebi nke ALIVH.
N'afọ 1996, Toshiba mepụtara bọọdụ sekit ebipụtara nke B2it.
Oge nzipu: Feb-24-2023