The kpọmkwem usoro nke PCB sekit osisi usoro

Enwere ike kewaa usoro nrụpụta osisi PCB n'ime usoro iri na abụọ ndị a.Usoro ọ bụla chọrọ nhazi usoro dị iche iche.Ekwesiri ighota na usoro nhazi nke mbadamba osisi nwere ihe owuwu di iche iche di iche iche.Usoro na-esonụ bụ mmepụta zuru oke nke PCB multi-layer.usoro eruba;

Mbụ.oyi akwa ime;tumadi n'ihi na-eme n'ime oyi akwa circuit nke PCB circuit osisi;usoro mmepụta bụ:
1. Ịcha osisi: ịcha PCB mkpụrụ n'ime mmepụta size;
2. Tupu ọgwụgwọ: hichaa elu nke PCB mkpụrụ ma wepụ elu pollutants
3. Laminating film: mado akọrọ film n'elu nke PCB mkpụrụ iji kwadebe maka ụdi image nyefe;
4. Ngosipụta: Jiri ngwa ikpughe ihe iji kpughee ihe nkiri ahụ jikọtara ya na ìhè ultraviolet, ka ị nyefee ihe oyiyi nke mkpụrụ ahụ na ihe nkiri akọrọ;
5. DE: A na-emepụta mkpụrụ osisi ahụ mgbe ekpughere ya, etched ma wepụ ihe nkiri ahụ, mgbe ahụ, a na-emecha mmepụta nke mbadamba oyi akwa n'ime.
Nke abụọ.Nyocha nke ime;tumadi maka ule na ịrụzi sekit osisi;
1. AOI: AOI optical scanning, nke nwere ike tụnyere ihe oyiyi nke PCB osisi na data nke ezi ngwaahịa osisi nke abanyela, ka ịchọta oghere, ịda mbà n'obi na ihe ndị ọzọ na-adịghị mma na ihe oyiyi osisi;
2. VRS: A ga-eziga data onyonyo ọjọọ nke AOI chọtara na VRS maka mmeghari site n'aka ndị ọrụ dị mkpa.
3. Waya mgbakwunye: Na-ere waya ọla edo na oghere ma ọ bụ ịda mbà n'obi iji gbochie ọdịda eletrik;
Nke atọ.Ịpịpị;dị ka aha ahụ pụtara, a na-agbanye ọtụtụ bọọdụ dị n'ime n'otu osisi;
1. Browning: Browning nwere ike ime ka adhesion n'etiti osisi na resin, na-amụba wettability nke ọla kọpa;
2. Riveting: Bee PP n'ime obere mpempe akwụkwọ na nha nkịtị iji mee ka bọọdụ dị n'ime na PP kwekọrọ ekwekọ ọnụ.
3. Ntukota na ịpị, agbapụ, gong edging, edging;
Nke anọ.Drilling: dị ka ndị ahịa chọrọ, jiri igwe na-egwupụta ihe na-egwupụta oghere dị iche iche na dayameta dị iche iche na osisi ahụ, nke mere na oghere dị n'etiti mbadamba nwere ike iji mee ihe maka nhazi nke nkwụnye nkwụnye na-esote, ọ pụkwara inyere osisi ahụ aka ịgbasa. okpomọkụ;

Nke ise, isi ọla kọpa;ihe mkpuchi ọla kọpa maka oghere ndị a kpụrụ akpụ nke osisi oyi akwa, nke mere na a na-eduzi ahịrị nke oyi akwa nke ọ bụla;
1. Deburring akara: wepụ burrs na nsọtụ nke osisi oghere iji gbochie dara ogbenye plain ọla kọpa;
2. Ahịrị iwepụ gluu: wepụ ihe fọdụrụ n'ime oghere;iji mee ka adhesion dịkwuo elu n'oge micro-etching;
3. Otu ọla kọpa (pth): Ọla kọpa na oghere na-eme ka sekit nke oyi akwa nke ọ bụla na-eduzi ụgbọ mmiri, ma n'otu oge ahụ na-abawanye ụbara ọla kọpa;
Nke isii, akwa oyi akwa;oyi akwa nke dị n'elu dị ka usoro nke ime ime nke nzọụkwụ mbụ, na nzube ya bụ ịkwado usoro nleba anya iji mee ka sekit;
1. Ngwọta mbụ: Hichaa elu nke osisi site na pickling, brushing na ihicha iji mee ka adhesion nke ihe nkiri akọrọ;
2. Laminating film: mado akọrọ film n'elu nke PCB mkpụrụ iji kwadebe maka ụdi image nyefe;
3. Ngosipụta: irradiate na ọkụ UV na-eme ka ihe nkiri akọrọ na osisi na-etolite ọnọdụ polymerized na unpolymerized;
4. Mmepe: igbari ihe nkiri akọrọ nke na-emebeghị polymerized n'oge usoro ikpughe, na-ahapụ oghere;
Nke asaa, ọla kọpa nke abụọ na etching;akwa ọla kọpa nke abụọ, etching;
1. Nke abụọ ọla kọpa: Electroplating ụkpụrụ, cross kemịkalụ ọla kọpa maka ebe na-adịghị kpuchie na akọrọ film n'ime oghere;n'otu oge ahụ, ọzọ dịkwuo conductivity na ọla kọpa ọkpụrụkpụ, na mgbe ahụ na-aga site tin plating iji chebe iguzosi ike n'ezi ihe nke sekit na oghere n'oge etching;
2. SES: Etch ala ọla kọpa na mgbakwunye ebe nke mpụta oyi akwa akọrọ film (mmiri film) site na usoro dị ka film mwepụ, etching, na tin ewepụghị, na elu oyi akwa circuit ugbu a dechara;

Nke asatọ, solder eguzogide: ọ nwere ike ichebe osisi ma gbochie oxidation na ndị ọzọ phenomena;
1. Pretreatment: pickling, ultrasonic ịsacha na usoro ndị ọzọ iji wepụ oxides na osisi na-amụba roughness nke ọla kọpa elu;
2. Mbipụta: Na-ekpuchi akụkụ nke osisi PCB nke na-adịghị mkpa ka a na-ere ya na solder na-eguzogide ink iji rụọ ọrụ nchebe na mkpuchi;
3. Pre-baking: ihicha ihe mgbaze na solder eguzogide ink, na n'otu oge ahụ hardening ink maka ikpughe;
4. Ngosipụta: Ịgwọ onye na-ere ahịa na-eguzogide ink site na ọkụ ọkụ UV, na ịmepụta polymer dị elu site na photopolymerization;
5. Mmepe: wepụ ihe ngwọta sodium carbonate na ink na-enweghị polymerized;
6. Post-baking: iji mee ka ink sie ike nke ọma;
Nke itoolu, ederede;ederede e biri ebi;
1. Pickling: Hichaa elu nke osisi ahụ, wepụ oxidation elu iji mee ka adhesion nke ink obibi akwụkwọ sikwuo ike;
2. Ederede: ederede e biri ebi, adaba maka usoro ịgbado ọkụ na-esote;
Nke iri, ọgwụgwọ elu OSP;A na-ekpuchi akụkụ nke efere ọla kọpa na-enweghị ihe ọ bụla a ga-agbado iji mepụta ihe nkiri organic iji gbochie nchara na oxidation;
Nke iri na otu, na-akpụ;A na-emepụta ụdị osisi a chọrọ nke onye ahịa chọrọ, nke dị mma maka onye ahịa na-eme ntinye na mgbakọ SMT;
Nke iri na abụọ, ule nyocha na-efe efe;nwalee sekit nke osisi iji zere ọpụpụ nke obere mpempe akwụkwọ;
Nke iri na atọ, FQC;nyocha ikpeazụ, nlele na nyocha zuru oke mgbe emechara usoro niile;
Nke iri na anọ, nkwakọ ngwaahịa na site na ụlọ nkwakọba ihe;kpochaa bọọdụ PCB emechara, mkpọ na ụgbọ mmiri, ma mezue nnyefe ahụ;