PCBA yog cov ntawv luv ntawm Printed Circuit Board Assembly ua lus Askiv, uas yog hais tias, lub rooj tsavxwm khoob PCB dhau los ntawm SMT sab sauv, lossis tag nrho cov txheej txheem ntawm DIP plug-in, hu ua PCBA.Qhov no yog ib txoj hauv kev siv ntau hauv Suav teb, thaum tus qauv qauv hauv Tebchaws Europe thiab Amelikas yog PCB 'A, ntxiv "'", uas yog hu ua nom tswv.
Printed circuit board, tseem hu ua board circuit board, printed circuit board, feem ntau siv cov lus Askiv luv luv PCB (Printed circuit board), yog cov khoom siv hluav taws xob tseem ceeb, kev txhawb nqa rau cov khoom siv hluav taws xob, thiab cov chaw muab kev sib txuas rau cov khoom siv hluav taws xob.Vim tias nws yog tsim los siv cov txheej txheem luam ntawv hluav taws xob, nws hu ua "luam tawm" Circuit board.Ua ntej qhov tshwm sim ntawm cov ntawv luam tawm Circuit Board, kev sib tshuam ntawm cov khoom siv hluav taws xob tau tso siab rau kev sib txuas ncaj qha ntawm cov xov hlau los ua ib qho kev ua tiav.Tam sim no, lub vaj huam sib luag hauv Circuit Court tsuas yog muaj raws li qhov kev sim ua tau zoo, thiab cov ntawv luam tawm Circuit Board tau dhau los ua txoj haujlwm tseem ceeb hauv kev lag luam hluav taws xob.Thaum pib ntawm lub xyoo pua 20th, txhawm rau ua kom yooj yim rau kev tsim cov tshuab hluav taws xob, txo cov kev sib txuas ntawm cov khoom siv hluav taws xob, thiab txo cov nqi tsim khoom, cov neeg pib kawm txog cov txheej txheem ntawm kev hloov cov xov hlau nrog luam ntawv.Nyob rau hauv 30 xyoo dhau los, engineers tau txuas ntxiv thov kom ntxiv cov hlau conductors ntawm insulating substrates rau thaiv.Qhov kev vam meej tshaj plaws yog xyoo 1925, Charles Ducas ntawm Tebchaws Meskas tau luam tawm cov qauv hauv Circuit Court ntawm insulating substrates, thiab tom qab ntawd ua tiav cov neeg xyuas pib rau kev xaim los ntawm electroplating.
Txog xyoo 1936, Austrian Paul Eisler (Paul Eisler) tau luam tawm cov ntawv xov xwm thev naus laus zis hauv tebchaws United Kingdom.Nws siv lub rooj tsav xwm luam tawm hauv xov tooj cua;Ua tiav daim ntawv thov patent rau txoj kev tshuab thiab xaim (Patent No. 119384).Ntawm ob, Paul Eisler txoj kev zoo ib yam li niaj hnub no cov ntawv luam tawm Circuit Board.Txoj kev no yog hu ua txoj kev rho tawm, uas yog tshem tawm cov hlau tsis tsim nyog;thaum txoj kev ntawm Charles Ducas thiab Miyamoto Kinosuke tsuas yog ntxiv cov hlau uas yuav tsum tau ua.Kev txuas yog hu ua additive method.Txawm li cas los xij, vim tias cov khoom siv hluav taws xob nyob rau lub sijhawm ntawd tau tsim hluav taws xob ntau, cov substrates ntawm ob qho tib si nyuaj rau kev siv ua ke, yog li tsis muaj kev siv tswv yim, tab sis nws kuj ua rau cov tshuab luam ntawv Circuit Court ib kauj ruam ntxiv.
Keeb kwm
Xyoo 1941, Tebchaws Meskas tau pleev xim tooj liab rau ntawm talc rau kev xaim los ua qhov sib thooj fuses.
Xyoo 1943, cov neeg Amelikas tau siv cov thev naus laus zis no ntau hauv xov tooj cua tub rog.
Xyoo 1947, epoxy resins pib siv los ua cov khoom siv hauv tsev.Nyob rau tib lub sijhawm, NBS tau pib kawm txog kev tsim cov thev naus laus zis xws li coils, capacitors, thiab resistors tsim los ntawm cov tshuab luam tawm hluav taws xob.
Xyoo 1948, Tebchaws Asmeskas tau lees paub qhov kev tsim khoom siv rau kev lag luam.
Txij li thaum xyoo 1950, cov khoom siv hluav taws xob nrog cov hluav taws xob qis qis tau hloov pauv ntau lub tshuab nqus tsev, thiab cov tshuab luam ntawv hluav taws xob hluav taws xob tsuas yog pib siv dav.Lub sijhawm ntawd, etching foil technology yog qhov tseem ceeb.
Xyoo 1950, Nyiv siv nyiaj xim rau kev xaim ntawm cov iav substrates;thiab tooj liab ntawv ci rau xaim ntawm daim ntawv phenolic substrates (CCL) ua los ntawm phenolic resin.
Xyoo 1951, cov tsos ntawm polyimide ua rau lub tshav kub tsis kam ntawm cov resin ib kauj ruam ntxiv, thiab polyimide substrates kuj tau tsim.
Nyob rau hauv 1953, Motorola tau tsim ib tug ob-sided plated los ntawm lub qhov.Txoj kev no kuj tseem siv rau tom qab ntau txheej Circuit Court boards.
Nyob rau xyoo 1960, tom qab lub rooj tsav xwm luam tawm tau siv dav rau 10 xyoo, nws cov cuab yeej siv tau ntau dua thiab paub tab.Txij li thaum Motorola lub rooj tsavxwm ob tog tau tawm los, ntau txheej luam tawm Circuit Court boards pib tshwm, uas nce qhov sib piv ntawm cov xaim mus rau thaj tsam substrate.
Xyoo 1960, V. Dahlgreen tau ua ib lub rooj tsav xwm hloov pauv hloov tau los ntawm kev muab cov ntawv hlau hlau luam tawm nrog lub voj voog hauv cov yas thermoplastic.
Xyoo 1961, Hazeltine Corporation ntawm Tebchaws Meskas tau xa mus rau txoj kev electroplating los ntawm lub qhov los tsim ntau txheej boards.
Xyoo 1967, "Plated-up thev naus laus zis", yog ib txoj hauv kev tsim txheej txheem, tau luam tawm.
Xyoo 1969, FD-R tau tsim cov ntawv luam tawm yooj yim nrog polyimide.
Xyoo 1979, Pactel tau luam tawm "Pactel method", ib qho ntawm txheej txheej ntxiv.
Nyob rau hauv 1984, NTT tau tsim "Copper Polyimide Method" rau nyias zaj duab xis circuits.
Xyoo 1988, Siemens tau tsim Microwiring Substrate tsim cov ntawv luam tawm Circuit Board.
Xyoo 1990, IBM tau tsim "Surface Laminar Circuit" (Surface Laminar Circuit, SLC) tsim cov ntawv luam tawm hluav taws xob.
Nyob rau hauv 1995, Matsushita Electric tsim ALIVH lub build-up printed circuit board.
Nyob rau hauv 1996, Toshiba tsim B2it tsim-up luam ntawv Circuit Court board.
Post lub sij hawm: Feb-24-2023