ʻO ka PCBA ka pōkole o Printed Circuit Board Assembly ma ka ʻōlelo Pelekania, ʻo ia hoʻi, hele ka papa PCB ʻole ma ka ʻaoʻao luna SMT, a i ʻole ke kaʻina holoʻokoʻa o DIP plug-in, i kapa ʻia ʻo PCBA.He ʻano hana maʻamau kēia ma Kina, ʻoiai ʻo ke ʻano maʻamau ma ʻEulopa a me ʻAmelika ʻo PCB' A, hoʻohui i "'", i kapa ʻia ʻo ka idiom official.
ʻO ka papa kaapuni paʻi, ʻike ʻia hoʻi ʻo ka papa kaapuni paʻi, ka papa kaapuni paʻi, hoʻohana pinepine i ka pōkole English PCB (Printed circuit board), he mea uila koʻikoʻi, he kākoʻo no nā ʻāpana uila, a he mea hāʻawi i nā pili kaapuni no nā mea uila.No ka mea ua hana ʻia me ka hoʻohana ʻana i nā ʻenehana paʻi uila, ua kapa ʻia ʻo ia he "paʻi" papa kaapuni.Ma mua o ka ʻike ʻia ʻana o nā papa kaapuni i paʻi ʻia, ua hilinaʻi ka pilina ma waena o nā mea uila i ka pilina pololei o nā uea e hana i kahi kaapuni piha.I kēia manawa, aia wale ka papa kaapuni ma ke ʻano he mea hana hoʻokolohua kūpono, a ua lilo ka papa kaapuni i paʻi ʻia i kūlana mana loa i ka ʻoihana uila.I ka hoʻomaka ʻana o ke kenekulia 20, i mea e maʻalahi ai ka hana ʻana i nā mīkini uila, e hoʻemi i ka wili ma waena o nā ʻāpana uila, a hoʻemi i ke kumukūʻai hana, ua hoʻomaka ka poʻe e aʻo i ke ʻano o ka hoʻololi ʻana i ka uwila me ka paʻi.I nā makahiki he 30 i hala iho nei, ua hoʻomau ka poʻe ʻenekinia e hoʻohui i nā conductors metala ma nā substrate insulating no ka uwila.ʻO ka mea lanakila loa i ka makahiki 1925, ua paʻi ʻo Charles Ducas o ʻAmelika Hui Pū ʻIa i nā mamana kaapuni ma luna o nā substrate insulating, a laila hoʻokumu maikaʻi i nā conductors no ka uwila ma ka electroplating.
A hiki i ka makahiki 1936, ua hoʻopuka ka Austrian Paul Eisler (Paul Eisler) i ka ʻenehana kiʻi ʻoniʻoni foil ma United Kingdom.Ua hoʻohana ʻo ia i ka papa kaapuni paʻi i loko o kahi mea lekiō;Ua noi maikaʻi ʻia no kahi patent no ke ʻano o ka puhi ʻana a me ka uea (Patent No. 119384).Ma waena o nā mea ʻelua, ua like ke ʻano o Paul Eisler me nā papa kaapuni paʻi i kēia lā.Kapa ʻia kēia ʻano hana ʻo ke ʻano unuhi, ʻo ia ka wehe ʻana i nā metala pono ʻole;ʻoiai ke ʻano o Charles Ducas lāua ʻo Miyamoto Kinosuke e hoʻohui wale i ka metala i makemake ʻia.Ua kapa ʻia ʻo uwila ʻano additive.Eia nō naʻe, no ka mea, ua nui ka wela o nā mea uila i kēlā manawa, paʻakikī ke hoʻohana pū ʻana i nā substrates o nā mea ʻelua, no laila ʻaʻohe hoʻohana maʻamau maʻamau, akā ua hana ʻo ia i ka ʻenehana kaapuni paʻi i kahi ʻanuʻu.
Moolelo
I ka makahiki 1941, ua pena ʻo ʻAmelika Hui Pū ʻIa i ka paʻi keleawe ma ka talc no ka uwila e hana i nā fuse kokoke.
I ka makahiki 1943, ua hoʻohana nui nā ʻAmelika i kēia ʻenehana i nā lekiō koa.
I ka makahiki 1947, hoʻomaka ka hoʻohana ʻana i nā resins epoxy e like me nā substrate hana.Ma ka manawa like, hoʻomaka ʻo NBS e aʻo i nā ʻenehana hana e like me nā coils, capacitors, a me nā mea pale i hana ʻia e ka ʻenehana kaapuni paʻi.
I ka makahiki 1948, ua ʻae ʻo ʻAmelika Hui Pū ʻIa i ka mea hou no ka hoʻohana pāʻoihana.
Mai ka makahiki 1950, ua hoʻololi nui nā transistors me ka haʻahaʻa haʻahaʻa i nā paipu māmā, a ua hoʻomaka ka hoʻohana nui ʻana o ka ʻenehana papa kaapuni paʻi.I kēlā manawa, ʻo ka ʻenehana etching foil ka mea nui.
I ka makahiki 1950, ua hoʻohana ʻo Iapana i ka pena kala no ka uwea ʻana i nā substrate aniani;a me ka pepa keleawe no ka uwea ana ma ka pepa phenolic substrates (CCL) i hanaia me ka resin phenolic.
I ka makahiki 1951, ua hana ʻia ke ʻano o ka polyimide i ka pale wela o ka resin i kahi ʻanuʻu, a ua hana pū ʻia nā substrates polyimide.
I ka makahiki 1953, ua hoʻomohala ʻo Motorola i kahi ʻaoʻao ʻelua ʻaoʻao ma waena o ka lua.Hoʻohana ʻia kēia ʻano hana i nā papa kaapuni multi-layer hope.
I nā makahiki 1960, ma hope o ka hoʻohana nui ʻia ʻana o ka papa kaapuni i paʻi ʻia no 10 mau makahiki, ua ʻoi aku ka nui o kāna ʻenehana.Ma muli o ka puka ʻana o ka papa ʻaoʻao ʻelua o Motorola, ua hoʻomaka ka puka ʻana o nā papa kaapuni paʻi multilayer, kahi i hoʻonui ai i ka ratio o ka uea i kahi substrate.
I ka makahiki 1960, ua hana ʻo V. Dahlgreen i ka papa kaapuni paʻi maʻalahi ma o ka hoʻopili ʻana i kahi kiʻi ʻoniʻoni metala i paʻi ʻia me kahi kaapuni i loko o kahi plastic thermoplastic.
I ka makahiki 1961, ua kuhikuhi ka Hazeltine Corporation o ʻAmelika Hui Pū ʻIa i ke ʻano electroplating through-hole e hana i nā papa multi-layer.
I ka makahiki 1967, ua paʻi ʻia ʻo "Plated-up technology", kekahi o nā ʻano hana kūkulu papa.
I ka makahiki 1969, ua hana ʻo FD-R i nā papa kaapuni paʻi maʻalahi me ka polyimide.
Ma 1979, paʻi ʻo Pactel i ka "Pactel method", kekahi o nā ʻano hana hoʻohui papa.
I ka makahiki 1984, ua hoʻomohala ʻo NTT i ka "Copper Polyimide Method" no nā kaapuni kiʻiʻoniʻoni lahilahi.
I ka makahiki 1988, ua hoʻomohala ʻo Siemens i ka papa kaapuni paʻi paʻi Microwiring Substrate.
I ka makahiki 1990, ua hoʻomohala ʻo IBM i ka "Surface Laminar Circuit" (Surface Laminar Circuit, SLC) kūkulu i ka papa kaapuni paʻi.
I ka makahiki 1995, ua kūkulu ʻo Matsushita Electric i ka papa kaapuni paʻi paʻi a ALIVH.
I ka makahiki 1996, ua hoʻomohala ʻo Toshiba i ka papa kaapuni paʻi paʻi a B2it.
Ka manawa hoʻouna: Feb-24-2023