ʻO ka hoʻokaʻawale ʻana mai lalo a luna penei:
94HB/94VO/22F/CEM-1/CEM-3/FR-4
ʻO nā kikoʻī penei:
94HB: Kāleka maʻamau, ʻaʻole pale ahi (ʻo ka mea haʻahaʻa haʻahaʻa, make punching, ʻaʻole hiki ke hoʻohana ʻia ma ke ʻano he papa mana)
94V0: pahu pahu pale ahi (kuʻi make)
22F: ʻO ka ʻaoʻao hoʻokahi ʻaoʻao hapa aniani papa fiber (ke kuʻi make)
CEM-1: ʻO ka papa fiberglass ʻaoʻao hoʻokahi (pono e wili ʻia e ka lolouila, ʻaʻole i kuʻi ʻia)
CEM-3: ʻO ka papa semi-fiberglass ʻaoʻao ʻelua ʻaoʻao (koe wale ka pahu pahu ʻaoʻao ʻelua, ʻo ia ka mea haʻahaʻa haʻahaʻa loa no nā ʻaoʻao ʻelua. ʻoi aku ka maikaʻi o ka mika ma mua o FR-4)
FR-4: Papa fiberglass ʻaoʻao ʻelua
ʻO ka pane maikaʻi loa
1.c Hiki ke hoʻokaʻawale ʻia ka hoʻokaʻawale ʻana o nā waiwai pale ahi i ʻehā mau ʻano: 94V—0/V-1/V-2 a me 94-HB
2. Prepreg: 1080=0.0712mm, 2116=0.1143mm, 7628=0.1778mm
3. ʻO FR4 CEM-3 ka papa, ʻo fr4 ka papa fiber aniani, ʻo cem3 ka substrate composite.
4. ʻO ka halogen-free pili i ka mea kumu i loaʻa ʻole i ka halogen (fluorine, bromine, iodine a me nā mea ʻē aʻe), no ka mea, e hoʻopuka ka bromine i ke kinoea ʻawaʻawa ke puhi ʻia, e koi ʻia ana e ka mālama ʻana i ke kaiapuni.
ʻelima.ʻO Tg ka wela hoʻololi aniani, ʻo ia hoʻi, ka helu heheʻe.
Pono ka papa kaapuni e pale i ka lapalapa, ʻaʻole hiki ke wela i kekahi mahana, hiki ke palupalu wale.ʻO ka helu wela i kēia manawa ua kapa ʻia ʻo ke aniani hoʻololi wela (Tg point), a pili kēia waiwai i ke kūpaʻa dimensional o ka papa PCB.
He aha ka papa kaapuni Tg PCB kiʻekiʻe a me nā pono o ka hoʻohana ʻana i kahi PCB Tg kiʻekiʻe
Ke piʻi ka mahana o nā papa kiʻekiʻe Tg i paʻi ʻia i kekahi wahi, e hoʻololi ka substrate mai ka "mokuʻāina aniani" a i ka "ʻāina Ruber", a kapa ʻia ka mahana i kēia manawa ʻo ke aniani hoʻololi wela (Tg) o ka papa.ʻO ia hoʻi, ʻo Tg ka wela kiʻekiʻe loa (° C.) kahi e paʻa ai ka substrate.ʻO ia hoʻi, ʻaʻole palupalu wale nā mea substrate PCB maʻamau, deform, hoʻoheheʻe, a me nā mea ʻē aʻe i nā mahana kiʻekiʻe, akā hōʻike pū kekahi i ka emi ʻana o nā waiwai mechanical a me nā uila (manaʻo wau ʻaʻole makemake ʻoe e ʻike i kēia kūlana i kāu huahana ponoʻī. ma ka nānā ʻana i ka hoʻokaʻawale ʻana o nā papa PCB. ).Mai kope i ka ʻike o kēia pūnaewele
ʻO ka maʻamau, ʻoi aku ka Tg o ka pā ma luna o 130 degere, ʻoi aku ka nui o ka Tg kiʻekiʻe ma mua o 170 degere, a ʻoi aku ka nui o ka Tg ma mua o 150 degere.
ʻO ka maʻamau, kapa ʻia nā papa paʻi PCB me Tg ≥ 170 ° C he mau papa paʻi kiʻekiʻe Tg.
Hoʻonui ʻia ka Tg o ka substrate, a e hoʻomaikaʻi a hoʻomaikaʻi ʻia ka pale ʻana o ka wela, ka pale ʻana i ka wai, ka pale kemika, a me ke kūpaʻa o ka papa i paʻi ʻia.ʻO ke kiʻekiʻe o ka waiwai TG, ʻoi aku ka maikaʻi o ka pale wela o ka papa, ʻoi aku ka nui o ke kaʻina alakaʻi ʻole, ʻoi aku ka nui o nā noi Tg kiʻekiʻe.
ʻO Tg kiʻekiʻe ke ʻano o ka pale wela kiʻekiʻe.Me ka hoʻomohala wikiwiki ʻana o ka ʻoihana uila, ʻoi aku ka nui o nā huahana uila i hōʻike ʻia e nā kamepiula, ke ulu nei i ka hana kiʻekiʻe a me nā ʻāpana kiʻekiʻe kiʻekiʻe, e koi ana i ka pale wela kiʻekiʻe o nā mea PCB substrate ma ke ʻano he hōʻoia nui.ʻO ka puka ʻana a me ka hoʻomohala ʻana o nā ʻenehana hoʻokiʻekiʻe kiʻekiʻe i hōʻike ʻia e SMT a me CMT ua hana ʻoi aku ka PCB a ʻoi aku ka hiki ʻole ke hoʻokaʻawale ʻia mai ke kākoʻo ʻana o ke kūpaʻa wela kiʻekiʻe o ka substrate ma ke ʻano o ka aperture liʻiliʻi, laina maikaʻi, a me ka thinning.
No laila, ʻo ka ʻokoʻa ma waena o ka FR-4 maʻamau a me ka Tg FR-4 kiʻekiʻe, ʻo ia ka ikaika mechanical, dimensional stability, adhesion, absorption wai, a me ka hoʻoheheʻe wela o ka mea i loko o ke kūlana wela, ʻoi aku ka wā i hoʻomehana ʻia ma hope o ka lawe ʻana i ka wai.Aia nā ʻokoʻa i nā kūlana like ʻole e like me ka hoʻonui wela, a ʻoi aku ka maikaʻi o nā huahana Tg kiʻekiʻe ma mua o nā mea substrate PCB maʻamau.
I nā makahiki i hala iho nei, ua hoʻonui ʻia ka nui o nā mea kūʻai aku e koi ana i nā papa paʻi kiʻekiʻe Tg i kēlā me kēia makahiki.
ʻIke a me nā kūlana maʻamau o ka papa PCB (2007/05/06 17:15)
I kēia manawa, nui nā ʻano o nā papa keleawe i hoʻohana nui ʻia ma koʻu ʻāina, a ua hōʻike ʻia ko lākou mau hiʻohiʻona ma ka papa ma lalo nei: nā ʻano o nā papa keleawe, ʻike o nā papa keleawe
Nui nā ʻano hoʻohālikelike o nā laminates ʻaʻahu keleawe.ʻO ka mea maʻamau, e like me nā mea hoʻoikaika like ʻole o ka papa, hiki ke hoʻokaʻawale ʻia i: kumu pepa, kumu lole o ke aniani fiber pcb papa,
Ke kumu kumu (CEM series), laminated multi-layer papa base a kūikawā kumu waiwai (ceramic, metal core base, etc.) ʻelima waeʻano.Inā hoʻohana ʻia e ka papa _)(^$RFSW#$%T
Hoʻokaʻawale ʻia nā mea hoʻopili resin like ʻole, CCI maʻamau i ka pepa.ʻAe: resin phenolic (XPC, XxxPC, FR-1, FR
-2, etc.), epoxy resin (FE-3), polyester resin a me nā ʻano ʻē aʻe.He epoxy resin (FR-4, FR-5) ka waihona lole pulu aniani maʻamau CCL, ʻo ia ka mea i hoʻohana nui ʻia i kēia manawa ke ʻano o ka waihona lole aniani.Eia kekahi, aia kekahi mau resins kūikawā (ka lole aniani fiber, polyamide fiber, non-woven fabric, etc. e like me nā mea hou aku): bismaleimide modified triazine resin (BT), polyimide resin (PI), Diphenylene ether resin (PPO), maleic anhydride imine-styrene resin (MS), polycyanate resin, polyolefin resin, a me nā mea'ē aʻe. E like me ka hana hoʻopaʻa ahi o CCL, hiki ke hoʻokaʻawale ʻia i ʻelua ʻano o nā papa: flame retardant (UL94-VO, UL94-V1) a me ka non- pale ahi (UL94-HB).I nā makahiki hoʻokahi a ʻelua paha i hala, me ka manaʻo nui i ka mālama ʻana i ke kaiapuni, ua hoʻokaʻawale ʻia kahi ʻano CCL hou ʻaʻole i loaʻa i ka bromine mai ka CCL pale ahi, hiki ke kapa ʻia ʻo "CCL flame-retardant green".Me ka hoʻomohala wikiwiki o ka ʻenehana huahana uila, aia nā koi hana kiʻekiʻe no cCL.No laila, mai ka hoʻohālikelike hana o CCL, ua māhele ʻia i ka CCL hana maʻamau, CCL mau dielectric haʻahaʻa, CCL pale wela kiʻekiʻe (maʻamau ka L o ka papa ma luna o 150 ° C), a me ka coefficient hoʻonui thermal haʻahaʻa CCL (hoʻohana mau ʻia ma luna. nā substrates hoʻopili) ) a me nā ʻano ʻē aʻe.Me ka hoʻomohala ʻana a me ka holomua mau ʻana o ka ʻenehana uila, hoʻopuka mau ʻia nā koi hou no nā mea substrate papa i paʻi ʻia, a laila e hoʻoikaika nei i ka hoʻomohala mau ʻana o nā kūlana laminate copper clad.I kēia manawa, ʻo nā kūlana nui no nā mea substrate e like me kēia.
①National standard I kēia manawa, ʻo koʻu ʻāina nā kūlana ʻāina no ka hoʻokaʻawale ʻana i nā mea substrate pcb boards e komo pū me GB/T4721-47221992 a me GB4723-4725-1992.ʻO ka maʻamau no nā laminates copper clad ma Taiwan, ʻo Kina ka maʻamau CNS, i hoʻokumu ʻia ma ka maʻamau JIs Iapana., hoʻokuʻu ʻia i ka makahiki 1983. gfgfgfggdgeeeejhjj
② ʻO nā kūlana nui o nā kūlana aupuni ʻē aʻe: JIS maʻamau o Iapana, ASTM, NEMA, MIL, IPc, ANSI, UL maʻamau o ʻAmelika Hui Pū ʻIa, Bs maʻamau o United Kingdom, DIN a me VDE maʻamau o Kelemānia, NFC a me UTE maʻamau o Palani, CSA o Canada Standards, Australia's AS standard, the former Soviet Union's FOCT standard, the international IEC standard, etc.
Hoʻohana mau ʻia nā mea hoʻolako o nā mea hoʻolālā PCB mua e nā mea a pau: Shengyi\Jiantao\International, etc.
● Nā palapala i ʻae ʻia: protel autocad powerpcb orcad gerber a i ʻole papa kope paʻa, etc.
● ʻAno pā: CEM-1, CEM-3 FR4, mea kiʻekiʻe TG;
● Nui papa nui: 600mm*700mm(24000mil*27500mil)
● Mānoanoa papa hana: 0.4mm-4.0mm(15.75mil-157.5mil)
● Nā papa hana kiʻekiʻe: 16Layers
● ʻO ka mānoanoa o ka ʻāpana keleawe: 0.5-4.0(oz)
● Hoʻopau ʻia ka mānoanoa o ka pā: +/-0.1mm(4mil)
● Molding dimension tolerance: Computer milling: 0.15mm (6mil) Die stamping: 0.10mm (4mil)
● Ka laulā laina liʻiliʻi: 0.1mm (4mil) Hiki ke hoʻomalu i ka laulā laina: ＜+-20%
● ʻO ke anawaena wili liʻiliʻi o ka huahana i hoʻopau ʻia: 0.25mm (10mil)
Hoʻopau ʻia ka liʻiliʻi liʻiliʻi loa punching puka anawaena: 0.9mm (35mil)
ʻO ka hoʻomanawanui puka i pau: PTH: +-0.075mm (3mil)
NPTH: +-0.05mm (2mil)
● Paʻa puka paʻa keleawe mānoanoa: 18-25um (0.71-0.99mil)
● Kaila SMT liʻiliʻi: 0.15mm (6mil)
● ili uhi: kemika immersion gula, HASL, holoʻokoʻa papa nickel-plated gula (wai / palupalu gula), kilika pale uliuli glue, etc.
● Solder mask mānoanoa ma ka papa: 10-30μm (0.4-1.2mil)
● ikaika Peel: 1.5N/mm (59N/mil)
● Solder mask paakiki: ＞5H
● hiki ke hoʻopili ʻia ke kūpaʻa kūʻai: 0.3-0.8mm (12mil-30mil)
● Dielectric mau: ε= 2.1-10.0
● Kū'ē kū'ē: 10KΩ-20MΩ
● Impedance hiʻona: 60 ohm±10％
● Haʻalulu wela: 288 ℃, 10 sec
● Warpage o ka papa i pau: < 0.7%
● Hoʻohana huahana: nā lako kamaʻilio, nā uila uila, nā mea kani, ka ʻōnaehana hoʻonohonoho honua, kamepiula, MP4, lako mana, nā mea hana hale, etc.
Ka manawa hoʻouna: Mar-30-2023