I kēia manawa, aia kekahi mau ʻano o nā laminates ʻaʻahu keleawe i hoʻohana nui ʻia ma koʻu ʻāina, a ʻo kā lākou mau hiʻohiʻona e like me kēia: nā ʻano o nā laminates ʻaʻahu keleawe, ʻike i nā laminates ʻaʻahu keleawe, a me nā ʻano hoʻohālikelike o nā laminates ʻaʻahu keleawe.ʻO ka mea maʻamau, e like me nā mea hoʻoikaika ʻokoʻa o ka papa, hiki ke hoʻokaʻawale ʻia i ʻelima mau ʻāpana: ka waihona pepa, ke kumu lole aniani, ka base composite (CEM series), laminated multi-layer board base a me nā kumu waiwai kūikawā (ceramic, metal core. base, etc.).Inā hoʻokaʻawale ʻia e like me ka resin adhesive i hoʻohana ʻia i ka papa, ʻo ka CCI maʻamau ma ka pepa.Aia: phenolic resin (XPC, XxxPC, FR-1, FR-2, etc.), epoxy resin (FE-3), polyester resin a me nā ʻano ʻē aʻe.He epoxy resin (FR-4, FR-5) ka waihona lole pulu aniani maʻamau CCL, ʻo ia ka mea i hoʻohana nui ʻia i kēia manawa ke ʻano o ka waihona lole aniani.Eia kekahi, aia kekahi mau resins kūikawā (ka lole aniani fiber, polyamide fiber, non-woven fabric, etc. e like me nā mea hou aku): bismaleimide modified triazine resin (BT), polyimide resin (PI), Diphenylene ether resin (PPO), maleic anhydride imine-styrene resin (MS), polycyanate resin, polyolefin resin, a me nā mea'ē aʻe. E like me ka hana hoʻopaʻa ahi o CCL, hiki ke hoʻokaʻawale ʻia i ʻelua ʻano o nā papa: flame retardant (UL94-VO, UL94-V1) a me ka non- pale ahi (UL94-HB) .I loko o hoʻokahi a i ʻelua mau makahiki i hala iho nei, me ka manaʻo nui i ka mālama ʻana i ke kaiapuni, ua hoʻokaʻawale ʻia kahi ʻano CCL hou i loaʻa ʻole ka bromine mai ka CCL pale ahi, hiki ke kapa ʻia ʻo "'ōmaʻomaʻo lapalapa. -CCL hoʻopaneʻe".Me ka hoʻomohala wikiwiki o ka ʻenehana huahana uila, aia nā koi hana kiʻekiʻe no cCL.No laila, mai ka hoʻohālikelike hana o CCL, ua māhele ʻia i ka CCL hana maʻamau, CCL mau dielectric haʻahaʻa, CCL pale wela kiʻekiʻe (maʻamau ka L o ka papa ma luna o 150 ° C), a me ka coefficient hoʻonui thermal haʻahaʻa CCL (hoʻohana mau ʻia ma luna. nā substrates hoʻopili) ) a me nā ʻano ʻē aʻe.Me ka hoʻomohala ʻana a me ka holomua mau ʻana o ka ʻenehana uila, hoʻopuka mau ʻia nā koi hou no nā mea substrate papa i paʻi ʻia, a laila e hoʻoikaika nei i ka hoʻomohala mau ʻana o nā kūlana laminate copper clad.I kēia manawa, ʻo nā kūlana nui o nā mea substrate e like me kēia
① Kūlana aupuni: ʻo GB/T4721-47221992 a me GB4723-4725-1992 nā kūlana aupuni o koʻu ʻāina e pili ana i nā mea substrate.ʻO ka maʻamau no nā laminates copper clad ma Taiwan, Kina ka CNS standard, i hoʻokumu ʻia ma muli o ke kūlana Japanese JIS a ua hoʻokumu ʻia ma 1983. hoʻokuʻu.
② Nā kūlana honua: Ke kūlana JIS o Iapana, American ASTM, NEMA, MIL, IPc, ANSI, UL standard, British Bs standard, German DIN, VDE standard, French NFC, UTE standard, Canadian CSA standard, Australian standard AS standard, FOCT standard of ka Soviet Union mua, ka pae honua IEC, etc.;nā mea hoʻolako o nā mea hoʻolālā PCB, maʻamau a hoʻohana mau ʻia: Shengyi\Kingboard\International, etc.
PCB kaapuni papa mea hoʻolauna: e like me ka brand quality pae mai lalo a kiʻekiʻe, ua maheleia penei: 94HB-94VO-CEM-1-CEM-3-FR-4
ʻO nā ʻāpana kikoʻī a me ka hoʻohana ʻana penei:
94HB
: Kāleka maʻamau, ʻaʻole pale ahi (ʻo ka mea haʻahaʻa haʻahaʻa, make punching, ʻaʻole hiki ke hoʻohana ʻia ma ke ʻano he papa mana)
94V0: pahu pahu pale ahi (kuʻi make)
22F
: ʻO ka ʻaoʻao hoʻokahi ʻaoʻao hapa aniani papa fiber (ke kuʻi make)
CEM-1
: ʻO ka papa fiberglass ʻaoʻao hoʻokahi (pono e wili ʻia e ke kamepiula, ʻaʻole i kuʻi ʻia)
CEM-3
: ʻO ka papa semi-fiberglass ʻaoʻao ʻelua ʻaoʻao (koe wale ka pahu pahu ʻaoʻao ʻelua, ʻo ia ka mea haʻahaʻa haʻahaʻa loa no nā ʻaoʻao ʻelua. FR-4)
FR-4:
ʻO ka papa fiberglass ʻaoʻao ʻelua
1. Hiki ke hoʻokaʻawale ʻia ka hoʻokaʻawale ʻana o nā waiwai pale ahi i ʻehā mau ʻano: 94VO-V-1-V-2-94HB
2. Prepreg: 1080=0.0712mm, 2116=0.1143mm, 7628=0.1778mm
3. ʻO FR4 CEM-3 nā papa a pau, ʻo ka fr4 he papa fiber aniani, a ʻo ka cem3 he mea hoʻohuihui.
4. Halogen-free e pili ana i nā substrate i loaʻa ʻole nā halogens (nā mea e like me ka fluorine, bromine, iodine, a me nā mea ʻē aʻe), no ka mea, e hoʻopuka ka bromine i nā kinoea ʻawaʻawa ke puhi ʻia, e koi ʻia e ka mālama ʻana i ke kaiapuni.
5. ʻO Tg ka mahana hoʻololi aniani, ʻo ia ka helu heheʻe.
6. Pono ka papa kaapuni e pale i ka lapalapa, ʻaʻole hiki ke wela i kekahi mahana, hiki ke palupalu wale.ʻO ka helu wela i kēia manawa ua kapa ʻia ʻo ke aniani hoʻololi wela (Tg point), a pili kēia waiwai i ka lōʻihi o ka papa PCB.
He aha ke kiʻekiʻe Tg?ʻO ka papa kaapuni PCB a me nā mea maikaʻi o ka hoʻohana ʻana i ka Tg PCB kiʻekiʻe: Ke piʻi ka mahana o ka papa kaapuni paʻi kiʻekiʻe Tg i kahi paepae, e hoʻololi ka substrate mai ka "mokuʻāina aniani" a i "ka moku'āina Ruber", a kapa ʻia ka mahana i kēia manawa. ka mahana hoʻololi aniani papa (Tg).ʻO ia hoʻi, ʻo Tg ka wela kiʻekiʻe loa (° C.) kahi e paʻa ai ka substrate.ʻO ia hoʻi, e hoʻomau ka palupalu, hoʻoheheʻe, hoʻoheheʻe a me nā mea ʻē aʻe ma lalo o ke kiʻekiʻe kiʻekiʻe, a i ka manawa like, e hōʻike pū ʻia ka emi ʻana o nā waiwai mechanical a me nā uila. ka huahana.ʻO ka maʻamau, ʻo ka papa Tg he 130 ma luna o ℃, ʻoi aku ka nui o ka Tg kiʻekiʻe ma mua o 170 ° C, a ʻoi aku ka nui o ka Tg ma mua o 150 ° C;ʻO ka maʻamau ka papa paʻi PCB me Tg ≥ 170 ° C i kapa ʻia he papa paʻi Tg kiʻekiʻe;ua hoʻonui ʻia ka Tg o ka substrate, a ʻo ka pale wela o ka papa i paʻi ʻia, ʻo nā hiʻohiʻona e like me ke kūpaʻa ʻana o ka moisture, ke kūpaʻa kemika, a me ke kūpaʻa e hoʻonui ʻia a hoʻomaikaʻi ʻia. i ke kaʻina alakaʻi ʻole, ʻoi aku ka nui o nā noi o Tg kiʻekiʻe;kiʻekiʻe Tg pili i ka wela kiʻekiʻe.Me ka hoʻomohala wikiwiki ʻana o ka ʻoihana uila, ʻoi aku ka nui o nā huahana uila i hōʻike ʻia e nā kamepiula, ke hoʻomohala nei i ka hana kiʻekiʻe a me nā pae kiʻekiʻe kiʻekiʻe, e koi ana i ka pale wela kiʻekiʻe o nā mea PCB substrate ma ke ʻano he koi.ʻO ka puka ʻana a me ka hoʻomohala ʻana o nā ʻenehana hoʻokiʻekiʻe kiʻekiʻe i hōʻike ʻia e SMT a me CMT ua hana ʻoi aku ka PCB a ʻoi aku ka hiki ʻole ke hoʻokaʻawale ʻia mai ke kākoʻo ʻana o ke kūpaʻa wela kiʻekiʻe o ka substrate ma ke ʻano o ka aperture liʻiliʻi, laina maikaʻi, a me ka thinning.No laila, ka ʻokoʻa ma waena o ka laulā FR-4 a me ka Tg kiʻekiʻe: i ka wela kiʻekiʻe, ʻoi aku ma lalo o ka wela ma hope o ka hoʻoheheʻe ʻana o ka wai, ka ikaika mechanical, dimensional stability, adhesiveness, wai absorption, thermal decomposition, thermal expansion, etc. o ka mea Aia nā ʻokoʻa. ma waena o nā kūlana ʻelua, a ʻoi aku ka maikaʻi o nā huahana Tg kiʻekiʻe ma mua o nā mea substrate papa PCB maʻamau.
Ka manawa hoʻouna: Apr-26-2023