ʻO ka papa inoa o nā mea PCB maʻamau e pili ana i kēia mau ʻano: FR-4 (pahu lole lole aniani), CEM-1/3 (ka substrate composite o ke aniani a me ka pepa), FR-1 (ka laminate copper-clad laminate), metala. ʻO nā pā keleawe i hoʻopaʻa ʻia (ʻoi aku ka nui o ka aluminika, ka mea hao hao) nā ʻano mea maʻamau i kēia manawa, a ua kapa ʻia ʻo ia he PCB paʻa.
ʻO nā mea mua ʻekolu he kūpono ia no nā huahana e koi ana i ka hoʻokalakupua uila kiʻekiʻe, e like me nā papa hoʻoikaika FPC, nā papa hoʻoheheʻe PCB, nā aniani fiber mesons, nā kiʻi kalapona paʻi kiʻi aniani papa no nā potentiometers, nā mīkini planetary pololei (wafer grinding), ka hoʻāʻo pololei. ʻO nā pā, nā ʻāpana uila (electrical) lako hoʻokaʻawale noho ʻana, nā papa hoʻihoʻi insulation, nā papa insulation transformer, nā ʻāpana insulation motor, nā mīkini wili, nā papa hoʻololi uila, etc.
ʻO ka laminate i hoʻopaʻa ʻia me ke keleawe ka mea kumu o ka ʻoihana uila.Hoʻohana nui ʻia ia no ka hana ʻana a me ka hana ʻana i nā papa kaapuni paʻi (PCBs), a hoʻohana nui ʻia i nā huahana uila e like me ke televise, radios, computers, computers, and mobile communications.
Ka manawa hoʻouna: Mar-29-2023