Immersion Gold Multilayer PCB Paiʻia Papa Kaapuni me SMT a me DIP

Nā kikoʻī huahana

ʻIke pili hou aku

1.ʻO SMT kekahi o nā ʻāpana kumu o nā ʻāpana uila. Kapa ʻia ʻo ia ka ʻenehana mauna luna (a i ʻole ʻenehana mauna ʻili). Ua māhele ʻia i ʻaʻohe alakaʻi a i ʻole nā ​​alakaʻi pōkole. He hui kaapuni ia i hui ʻia e ka reflow soldering a i ʻole dip soldering. ʻO ka ʻenehana ka ʻenehana kaulana loa a me ke kaʻina hana i ka ʻoihana hui uila.
Nā hiʻohiʻona: Hiki ke hoʻohana ʻia kā mākou substrate no ka hāʻawi ʻana i ka mana, ka hoʻouna ʻana i ka hōʻailona, ​​​​ka wela wela, a me ka hoʻolako ʻana i ka hale.
Nā hiʻohiʻona: Hiki ke pale i ka mahana a me ka manawa o ka ho'ōla a me ka soldering.
Hoʻokō ka palahalaha i nā koi o ka hana hana.
He kūpono no ka hana hou.
He kūpono no ka hana ʻana o ka substrate.
Ka helu dielectric haʻahaʻa a me ke kūpaʻa kiʻekiʻe.
ʻO nā mea maʻamau i hoʻohana ʻia no kā mākou huahana substrates he olakino a me ke kaiapuni epoxy resins a me phenolic resins, nona nā waiwai pale ahi maikaʻi, nā waiwai wela, nā waiwai mechanical a me dielectric, a me nā kumu kūʻai haʻahaʻa.
ʻO ka mea i ʻōlelo ʻia ma luna nei ʻo ka substrate paʻa paʻa.
Loaʻa i kā mākou huahana nā substrates maʻalahi, hiki ke hoʻohana ʻia no ka mālama ʻana i ka lewa, pelu a huli paha, neʻe, a hana ʻia i nā ʻāpana insulating lahilahi me ka hana kiʻekiʻe kiʻekiʻe.
ʻO ka hemahema, he paʻakikī ke kaʻina hana, a ʻaʻole kūpono ia no nā noi micro-pitch.
Manaʻo wau ʻo nā hiʻohiʻona o ka substrate he mau alakaʻi liʻiliʻi a me ka spacing, ka mānoanoa nui a me ka ʻāpana, ʻoi aku ka maikaʻi o ka thermal conductivity, ʻoi aku ka ikaika o nā waiwai mechanical, a ʻoi aku ka paʻa. Manaʻo wau ʻo ka ʻenehana hoʻokomo ma luna o ka substrate ka hana uila, aia ka hilinaʻi, nā ʻāpana maʻamau.
ʻAʻole wale mākou i ka hana holoʻokoʻa a hoʻohui pū ʻia, akā loaʻa pū kekahi i ka hōʻoia ʻelua o ka loiloi manual a me ka loiloi mīkini, a ʻo ka nui o nā huahana e like me 99.98%.
2.ʻO ka PCB nā mea uila nui loa, a ʻaʻohe mea. ʻO ka maʻamau, kahi ʻano conductive i hana ʻia i nā kaʻa paʻi paʻi, nā ʻāpana paʻi ʻia a i ʻole ka hui pū ʻana o nā mea ʻelua ma ka mea insulating e like me kahi hoʻolālā i koho ʻia i kapa ʻia he kaapuni paʻi. ʻO ke kumu conductive e hāʻawi ana i ka pilina uila ma waena o nā ʻāpana ma ka substrate insulating i kapa ʻia he papa kaapuni paʻi (a i ʻole ka papa kaapuni i paʻi ʻia), he kākoʻo koʻikoʻi ia no nā mea uila a me kahi mea lawe hiki ke lawe i nā ʻāpana.
Manaʻo wau e wehe maʻamau mākou i ka papa keyboard no ka ʻike ʻana i kahi kiʻiʻoniʻoni palupalu (substrat insulating maʻalahi) i paʻi ʻia me ke kala-keʻokeʻo (paʻi kala) conductive kiʻi a me nā kiʻi hoʻonohonoho. Ma muli o ka loaʻa ʻana o kēia ʻano kumu ma ke ʻano paʻi pale maʻamau, kapa mākou i kēia papa kaapuni paʻi paʻi paʻi kālā paʻi paʻi. ʻOkoʻa nā papa kaapuni i paʻi ʻia ma nā ʻano motherboard like ʻole, nā kāleka kiʻi, nā kāleka pūnaewele, nā modem, nā kāleka kani a me nā mea pono hale a mākou e ʻike ai ma ke kūlanakauhale kamepiula.
ʻO ka mea kumu i hoʻohana ʻia me ka waihona pepa (hoʻohana mau ʻia no ka ʻaoʻao hoʻokahi) a i ʻole ke kumu lole aniani (hoʻohana mau ʻia no nā ʻaoʻao ʻelua a me ka multi-layer), pre-impregnated phenolic a i ʻole epoxy resin, hoʻokahi ʻaoʻao a i ʻole ʻelua ʻaoʻao o ka ʻili. Hoʻopili ʻia me ka pale keleawe a laila laminated a hoʻōla ʻia. ʻO kēia ʻano papa kaapuni ʻaʻahu keleawe, kapa mākou he papa ʻaʻa. Ma hope o ka hana ʻana i ka papa kaapuni paʻi, kapa mākou iā ia he papa kaapuni paʻi paʻi.
ʻO ka papa kaapuni i pai ʻia me ke ʻano kaapuni paʻi ʻia ma kekahi ʻaoʻao, ua kapa ʻia he papa kaapuni paʻi ʻaoʻao hoʻokahi, he papa kaapuni i pai ʻia me ke ʻano kaapuni paʻi ʻia ma nā ʻaoʻao ʻelua, a me kahi papa kaapuni paʻi i hoʻokumu ʻia e ka pilina ʻaoʻao ʻelua ma o ka metallization o nā puka, kapa mākou he papa ʻaoʻao ʻelua. Inā hoʻohana ʻia kahi papa kaapuni i pai ʻia me ka ʻaoʻao ʻelua ʻaoʻao o loko, ʻelua ʻaoʻao hoʻokahi ʻaoʻao waho, a i ʻole ʻelua ʻaoʻao ʻelua ʻaoʻao i loko a ʻelua ʻaoʻao ʻaoʻao waho e hoʻohana ʻia, ua hoʻololi pū ʻia ka ʻōnaehana hoʻonohonoho a me nā mea hoʻopaʻa insulating a ʻO ke kaapuni paʻi. ʻO ka papa me ke kumu conductive i hoʻopili ʻia e like me nā koi hoʻolālā e lilo i ʻehā-papa a me ʻeono-papa i ka papa kaapuni paʻi, ʻike ʻia hoʻi he papa kaapuni paʻi nui.
3.ʻO PCBA kekahi o nā ʻāpana kumu o nā ʻāpana uila. Hele ka PCB i ke kaʻina holoʻokoʻa o ka ʻenehana mauna luna (SMT) a me ka hoʻokomo ʻana i nā plug-ins DIP, i kapa ʻia ʻo ke kaʻina PCBA. ʻOiaʻiʻo, he PCB me kahi ʻāpana i hoʻopili ʻia. ʻO kekahi ka papa i hoʻopau ʻia a ʻo kekahi ka papa ʻole.
Hiki ke hoʻomaopopo ʻia ʻo PCBA ma ke ʻano he papa kaapuni paʻa, ʻo ia hoʻi, ma hope o ka pau ʻana o nā kaʻina hana a pau o ka papa kaapuni, hiki ke helu ʻia ka PCBA. Ma muli o ka hoʻomau ʻana o ka miniaturization a me ka hoʻomaʻemaʻe ʻana o nā huahana uila, ua hoʻopili ʻia ka hapa nui o nā papa kaapuni o kēia manawa me nā etching resists (lamination a coating). Ma hope o ka hoʻolaha ʻana a me ka hoʻomohala ʻana, hana ʻia nā papa kaapuni e ka etching.
I ka wā ma mua, ʻaʻole lawa ka hoʻomaopopo ʻana i ka hoʻomaʻemaʻe ʻana no ka mea ʻaʻole kiʻekiʻe ka nui o ka hui ʻana o ka PCBA, a ua manaʻo ʻia ʻo ke koena flux he non-conductive a benign, a ʻaʻole e pili i ka hana uila.
ʻO nā hui uila o kēia mau lā he mea liʻiliʻi, ʻoi aku ka liʻiliʻi, a i ʻole nā ​​pitch liʻiliʻi. Ke hoʻokokoke nei nā pine a me nā pad. Ke liʻiliʻi a liʻiliʻi nei nā āpau o kēia lā, a paʻa paha nā mea haumia i loko o nā āpau, ʻo ia hoʻi, ʻo nā ʻāpana liʻiliʻi liʻiliʻi, inā e noho lākou ma waena o nā āpau ʻelua, he mea maikaʻi ʻole ke kumu o ke kaapuni pōkole.
I nā makahiki i hala iho nei, ua ʻike nui ʻia ka ʻoihana hui uila e pili ana i ka hoʻomaʻemaʻe ʻana, ʻaʻole wale no nā koi huahana, akā no nā koi kūlohelohe a me ka pale ʻana i ke olakino kanaka. No laila, nui nā mea hoʻolako i nā mea hoʻomaʻemaʻe a me nā hoʻonā, a ua lilo ka hoʻomaʻemaʻe i mea nui o nā hoʻololi ʻenehana a me nā kūkākūkā i ka ʻoihana hui uila.
4. ʻO DIP kekahi o nā mea kumu o nā mea uila. Kapa ʻia ʻo ia ka ʻenehana hoʻopaʻa laina ʻelua, e pili ana i nā ʻāpana kaʻapuni i hoʻopili ʻia i hoʻopaʻa ʻia i loko o ka pahu ʻelua in-line. Hoʻohana pū ʻia kēia ʻano hoʻopihapiha i ka hapa nui o nā kaʻapuni i hoʻohui ʻia me ka liʻiliʻi. , ʻaʻole ʻoi aku ka nui o nā pine ma mua o 100.
ʻO ka chip CPU o ka ʻenehana hoʻopihapiha DIP he ʻelua lālani o nā pine, pono e hoʻokomo ʻia i loko o ke kumu chip me ka hoʻolālā DIP.
ʻOiaʻiʻo, hiki ke hoʻokomo pololei ʻia i loko o kahi papa kaapuni me ka helu like o nā lua solder a me ka hoʻonohonoho geometric no ka soldering.
Pono e mālama pono ʻia ka ʻenehana hoʻopihapiha DIP i ka wā e hoʻokomo ai a wehe ʻia mai ke kumu kīpē e pale aku i ka pōʻino o nā pine.
ʻO nā hiʻohiʻona: multi-layer ceramic DIP DIP, single-layer ceramic DIP DIP, lead frame DIP (me ke aniani ceramic sealing type, plastic packaging structure type, ceramic haʻahaʻa heheʻe aniani hoʻoheheʻe ʻano) a pēlā aku.
ʻO DIP plug-in kahi loulou i ke kaʻina hana uila, aia nā plug-in manual, akā pū kekahi mīkini AI. E hoʻokomo i ka mea i kuhikuhi ʻia i ke kūlana i kuhikuhi ʻia. Pono nō hoʻi nā plug-in manual e hele i ke kūʻai ʻana i ka nalu e kūʻai i nā mea uila ma ka papa. No nā ʻāpana i hoʻokomo ʻia, pono e nānā inā ua hoʻokomo hewa ʻia a hala ʻole paha.
ʻO DIP plug-in post-soldering he hana koʻikoʻi loa ia i ka hana ʻana i ka pcba patch, a ʻo kona ʻano hana e pili pono ana i ka hana o ka papa pcba, he mea nui loa kona koʻikoʻi. A laila ma hope o ke kūʻai ʻana, no ka mea, ʻaʻole hiki ke kūʻai ʻia kekahi mau ʻāpana, e like me nā palena o ke kaʻina hana a me nā mea hana, e ka mīkini hoʻoheheʻe nalu, a hiki ke hana wale ʻia e ka lima.
Hōʻike pū kēia i ke koʻikoʻi o nā plug-ins DIP i nā mea uila. Ma ka nānā wale ʻana i nā kikoʻī hiki ke ʻike ʻole ʻia.
I loko o kēia mau ʻāpana uila nui ʻehā, loaʻa i kēlā me kēia mea kona pono ponoʻī, akā hoʻokō lākou i kekahi i kekahi e hana i kēia ʻano hana hana. Ma ka nānā wale ʻana i ka maikaʻi o nā huahana hana hiki i kahi ākea o nā mea hoʻohana a me nā mea kūʻai aku ke ʻike i ko mākou manaʻo.

Hoʻoholo hoʻokahi

Hale Hōʻikeʻike

Ma ke ʻano he hui hana PCB alakaʻi a me ka hui PCB (PCBA), hoʻoikaika ʻo Evertop e kākoʻo i ka ʻoihana liʻiliʻi liʻiliʻi honua me ka ʻike ʻenehana i nā lawelawe ʻoihana Electronic Manufacturing Services (EMS) no nā makahiki.

FAQ

Q1: Pehea ʻoe e hōʻoia ai i ka maikaʻi o nā PCB?
A1: ʻO kā mākou PCB he 100% hōʻike me ka Flying Probe Test, E-test a i ʻole AOI.

Q2: Hiki iaʻu ke loaʻa ke kumukūʻai maikaʻi loa?
A2: ʻAe. No ke kōkua ʻana i nā mea kūʻai aku e hoʻokele i ke kumukūʻai ʻo ia ka mea a mākou e hoʻāʻo mau nei e hana. E hāʻawi kā mākou mau ʻenekini i ka hoʻolālā maikaʻi loa e mālama i nā mea PCB.

Q3: Hiki iaʻu ke loaʻa kahi hōʻailona manuahi?
A3: ʻAe, Welina mai e ʻike i kā mākou lawelawe a me ka maikaʻi. Pono ʻoe e hana i ka uku i ka wā mua, a e hoʻihoʻi mākou i ke kumukūʻai hōʻike i kāu kauoha nui aʻe.