Immersion Gold Multilayer PCB Paiʻia Papa Kaapuni me SMT a me DIP

Nā kikoʻī huahana

ʻIke pili hou aku

1.ʻO SMT kekahi o nā ʻāpana kumu o nā ʻāpana uila.Kapa ʻia ʻo ia ka ʻenehana mauna luna (a i ʻole ʻenehana mauna ʻili).Ua māhele ʻia i ʻaʻohe alakaʻi a i ʻole nā ​​alakaʻi pōkole.He hui kaapuni ia i hui ʻia e ka reflow soldering a i ʻole dip soldering.ʻO ka ʻenehana ka ʻenehana kaulana loa a me ke kaʻina hana i ka ʻoihana hui uila.
Nā hiʻohiʻona: Hiki ke hoʻohana ʻia kā mākou substrate no ka hāʻawi ʻana i ka mana, ka hoʻouna ʻana i ka hōʻailona, ​​​​ka wela wela, a me ka hoʻolako ʻana i ka hale.
Nā hiʻohiʻona: Hiki ke pale i ka mahana a me ka manawa o ka ho'ōla a me ka soldering.
Hoʻokō ka palahalaha i nā koi o ka hana hana.
He kūpono no ka hana hou.
He kūpono no ka hana ʻana o ka substrate.
Ka helu dielectric haʻahaʻa a me ke kūpaʻa kiʻekiʻe.
ʻO nā mea maʻamau i hoʻohana ʻia no kā mākou huahana substrates he olakino a me ke kaiapuni epoxy resins a me phenolic resins, nona nā waiwai pale ahi maikaʻi, nā waiwai wela, nā waiwai mechanical a me dielectric, a me nā kumu kūʻai haʻahaʻa.
ʻO ka mea i ʻōlelo ʻia ma luna nei ʻo ka substrate paʻa paʻa.
Loaʻa i kā mākou huahana nā substrates maʻalahi, hiki ke hoʻohana ʻia no ka mālama ʻana i ka lewa, pelu a huli paha, neʻe, a hana ʻia i nā ʻāpana insulating lahilahi me ka hana kiʻekiʻe kiʻekiʻe.
ʻO ka hemahema, he paʻakikī ke kaʻina hana, a ʻaʻole kūpono ia no nā noi micro-pitch.
Manaʻo wau ʻo nā hiʻohiʻona o ka substrate he mau alakaʻi liʻiliʻi a me ka spacing, ka mānoanoa nui a me ka ʻāpana, ʻoi aku ka maikaʻi o ka thermal conductivity, ʻoi aku ka ikaika o nā waiwai mechanical, a ʻoi aku ka paʻa.Manaʻo wau ʻo ka ʻenehana hoʻokomo ma luna o ka substrate ka hana uila, aia ka hilinaʻi, nā ʻāpana maʻamau.
ʻAʻole wale mākou i ka hana holoʻokoʻa a hoʻohui pū ʻia, akā loaʻa pū kekahi i ka hōʻoia ʻelua o ka loiloi manual a me ka loiloi mīkini, a ʻo ka nui o nā huahana e like me 99.98%.
2.ʻO ka PCB nā mea uila nui loa, a ʻaʻohe mea.ʻO ka maʻamau, kahi ʻano conductive i hana ʻia i nā kaʻa paʻi paʻi, nā ʻāpana paʻi ʻia a i ʻole ka hui pū ʻana o nā mea ʻelua ma ka mea insulating e like me kahi hoʻolālā i koho ʻia i kapa ʻia he kaapuni paʻi.ʻO ke ʻano conductive e hāʻawi ana i ka pilina uila ma waena o nā ʻāpana ma ka substrate insulating i kapa ʻia he papa kaapuni paʻi (a i ʻole ka papa kaapuni paʻi), he kākoʻo koʻikoʻi ia no nā mea uila a me kahi mea lawe hiki ke lawe i nā ʻāpana.
Manaʻo wau e wehe maʻamau mākou i ka papa keyboard no ka ʻike ʻana i kahi kiʻiʻoniʻoni palupalu (substrat insulating maʻalahi) i paʻi ʻia me ke kala-keʻokeʻo (paʻi kala) conductive kiʻi a me nā kiʻi hoʻonohonoho.Ma muli o ka loaʻa ʻana o kēia ʻano kumu ma ke ʻano paʻi pale maʻamau, kapa mākou i kēia papa kaapuni paʻi paʻi paʻi kālā paʻi paʻi.ʻOkoʻa nā papa kaapuni i paʻi ʻia ma nā ʻano motherboard like ʻole, nā kāleka kiʻi, nā kāleka pūnaewele, nā modem, nā kāleka kani a me nā mea pono hale a mākou e ʻike ai ma ke kūlanakauhale kamepiula.
ʻO ka mea kumu i hoʻohana ʻia me ka waihona pepa (hoʻohana mau ʻia no ka ʻaoʻao hoʻokahi) a i ʻole ke kumu lole aniani (hoʻohana mau ʻia no ka ʻaoʻao ʻelua a me ka multi-layer), pre-impregnated phenolic a i ʻole epoxy resin, hoʻokahi ʻaoʻao a ʻelua ʻaoʻao o ka ʻili. Hoʻopili ʻia me ka pale keleawe a laila laminated a hoʻōla ʻia.ʻO kēia ʻano papa kaapuni ʻaʻahu keleawe, kapa mākou he papa ʻaʻa.Ma hope o ka hana ʻana i ka papa kaapuni paʻi, kapa mākou iā ia he papa kaapuni paʻi paʻi.
ʻO ka papa kaapuni i pai ʻia me ke ʻano kaapuni paʻi ʻia ma kekahi ʻaoʻao, ua kapa ʻia he papa kaapuni paʻi ʻaoʻao hoʻokahi, he papa kaapuni paʻi me ke ʻano kaapuni paʻi ʻia ma nā ʻaoʻao ʻelua, a me kahi papa kaapuni paʻi i hana ʻia e ka pilina ʻaoʻao ʻelua ma o ka metallization o nā puka, kapa mākou he papa ʻaoʻao ʻelua.Inā hoʻohana ʻia kahi papa kaapuni i pai ʻia me ka ʻaoʻao ʻelua ʻaoʻao o loko, ʻelua ʻaoʻao hoʻokahi ʻaoʻao waho, a i ʻole ʻelua ʻaoʻao ʻelua ʻaoʻao i loko a ʻelua ʻaoʻao ʻaoʻao waho e hoʻohana ʻia, ua hoʻololi pū ʻia ka ʻōnaehana hoʻonohonoho a me nā mea hoʻopaʻa insulating a ʻO ke kaapuni paʻi. ʻO ka papa me ke kumu conductive i hoʻopili ʻia e like me nā koi hoʻolālā e lilo i ʻehā-papa a ʻeono-papa i ka papa kaapuni paʻi, ʻike ʻia hoʻi he papa kaapuni paʻi nui.
3.ʻO PCBA kekahi o nā ʻāpana kumu o nā ʻāpana uila.Hele ka PCB i ke kaʻina holoʻokoʻa o ka ʻenehana mauna luna (SMT) a me ka hoʻokomo ʻana i nā plug-ins DIP, i kapa ʻia ʻo ke kaʻina PCBA.ʻOiaʻiʻo, he PCB me kahi ʻāpana i hoʻopili ʻia.ʻO kekahi ka papa i hoʻopau ʻia a ʻo kekahi ka papa ʻole.
Hiki ke hoʻomaopopo ʻia ka PCBA ma ke ʻano he papa kaapuni i pau, ʻo ia hoʻi, ma hope o ka pau ʻana o nā kaʻina hana a pau o ka papa kaapuni, hiki ke helu ʻia ka PCBA.Ma muli o ka hoʻomau ʻana o ka miniaturization a me ka hoʻomaʻemaʻe ʻana o nā huahana uila, ua hoʻopili ʻia ka hapa nui o nā papa kaapuni o kēia manawa me nā etching resists (lamination a coating).Ma hope o ka hoʻolaha ʻana a me ka hoʻomohala ʻana, hana ʻia nā papa kaapuni e ka etching.
I ka wā ma mua, ʻaʻole lawa ka hoʻomaopopo ʻana i ka hoʻomaʻemaʻe ʻana no ka mea ʻaʻole kiʻekiʻe ka nui o ka hui ʻana o ka PCBA, a ua manaʻo ʻia ʻo ke koena flux he non-conductive a benign, a ʻaʻole e pili i ka hana uila.
ʻO nā hui uila o kēia mau lā he mea liʻiliʻi, ʻoi aku ka liʻiliʻi, a i ʻole nā ​​pitch liʻiliʻi.Ke hoʻokokoke nei nā pine a me nā pad.Ke liʻiliʻi a liʻiliʻi nei nā āpau o kēia lā, a paʻa paha nā mea haumia i loko o nā āpau, ʻo ia hoʻi, ʻo nā ʻāpana liʻiliʻi liʻiliʻi, inā e noho lākou ma waena o nā āpau ʻelua, he mea maikaʻi ʻole ke kumu o ke kaapuni pōkole.
I nā makahiki i hala iho nei, ua ʻike nui ʻia ka ʻoihana hui uila e pili ana i ka hoʻomaʻemaʻe ʻana, ʻaʻole wale no nā koi huahana, akā no nā koi kūlohelohe a me ka pale ʻana i ke olakino kanaka.No laila, nui nā mea hoʻolako i nā mea hoʻomaʻemaʻe a me nā hoʻonā, a ua lilo ka hoʻomaʻemaʻe i mea nui o nā hoʻololi ʻenehana a me nā kūkākūkā i ka ʻoihana hui uila.
4. ʻO DIP kekahi o nā mea kumu o nā mea uila.Kapa ʻia ʻo ia ka ʻenehana hoʻopaʻa laina ʻelua, e pili ana i nā ʻāpana kaʻapuni i hoʻopili ʻia i hoʻopaʻa ʻia i loko o ka pahu ʻelua in-line.Hoʻohana pū ʻia kēia ʻano hoʻopihapiha i ka hapa nui o nā ʻāpana liʻiliʻi a me waena., ʻaʻole ʻoi aku ka nui o nā pine ma mua o 100.
ʻO ka chip CPU o ka ʻenehana hoʻopihapiha DIP he ʻelua lālani o nā pine, pono e hoʻokomo ʻia i loko o ke kumu chip me ka hoʻolālā DIP.
ʻOiaʻiʻo, hiki ke hoʻokomo pololei ʻia i loko o kahi papa kaapuni me ka helu like o nā lua solder a me ka hoʻonohonoho geometric no ka soldering.
Pono e mālama pono ʻia ka ʻenehana hoʻopihapiha DIP i ka wā e hoʻokomo ai a wehe ʻia mai ke kumu kīpē e pale aku i ka pōʻino o nā pine.
ʻO nā hiʻohiʻona: multi-layer ceramic DIP DIP, single-layer ceramic DIP DIP, lead frame DIP (me ke aniani ceramic sealing type, plastic packaging type structure type, ceramic haʻahaʻa heheʻe aniani hoʻoheheʻe ʻano) a pēlā aku.
ʻO DIP plug-in kahi loulou i ke kaʻina hana uila, aia nā plug-in manual, akā pū kekahi mīkini AI.E hoʻokomo i ka mea i kuhikuhi ʻia i ke kūlana i kuhikuhi ʻia.Pono nō hoʻi nā plug-in manual e hele i ke kūʻai ʻana i ka nalu e kūʻai i nā mea uila ma ka papa.No nā ʻāpana i hoʻokomo ʻia, pono e nānā inā ua hoʻokomo hewa ʻia a hala ʻole paha.
ʻO DIP plug-in post-soldering he hana koʻikoʻi loa ia i ka hana ʻana i ka pcba patch, a ʻo kona ʻano hana e pili pono ana i ka hana o ka papa pcba, he mea nui loa kona koʻikoʻi.A laila ma hope o ke kūʻai ʻana, no ka mea, ʻaʻole hiki ke kūʻai ʻia kekahi mau ʻāpana, e like me nā palena o ke kaʻina hana a me nā mea hana, e ka mīkini hoʻoheheʻe nalu, a hiki ke hana wale ʻia e ka lima.
Hōʻike pū kēia i ke koʻikoʻi o nā plug-ins DIP i nā mea uila.Ma ka nānā wale ʻana i nā kikoʻī hiki ke ʻike ʻole ʻia.
I loko o kēia mau ʻāpana uila nui ʻehā, loaʻa i kēlā me kēia me kāna pono ponoʻī, akā hoʻokō lākou i kekahi i kekahi e hana i kēia ʻano o nā kaʻina hana.Ma ka nānā wale ʻana i ka maikaʻi o nā huahana hana hiki i kahi ākea o nā mea hoʻohana a me nā mea kūʻai aku ke ʻike i ko mākou manaʻo.

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Ma ke ʻano he hoahana hana PCB alakaʻi a me ka hui PCB (PCBA), hoʻoikaika ʻo Evertop e kākoʻo i ka ʻoihana liʻiliʻi liʻiliʻi honua me ka ʻike ʻenehana i nā lawelawe ʻenehana Electronic Manufacturing Services (EMS) no nā makahiki.

FAQ

Q1: Pehea ʻoe e hōʻoia ai i ka maikaʻi o nā PCB?
A1: ʻO kā mākou PCB he 100% hōʻike me ka Flying Probe Test, E-test a i ʻole AOI.

Q2: Hiki iaʻu ke loaʻa ke kumukūʻai maikaʻi loa?
A2: ʻAe.No ke kōkua ʻana i nā mea kūʻai aku e hoʻokele i ke kumukūʻai ʻo ia ka mea a mākou e hoʻāʻo mau nei e hana.E hāʻawi kā mākou mau ʻenekini i ka hoʻolālā maikaʻi loa e mālama i nā mea PCB.

Q3: Hiki iaʻu ke loaʻa kahi hōʻailona manuahi?
A3: ʻAe, Welina mai e ʻike i kā mākou lawelawe a me ka maikaʻi. Pono ʻoe e hana i ka uku i ka wā mua, a e hoʻihoʻi mākou i ke kumukūʻai hōʻike i kāu kauoha nui aʻe.