ʻaoʻao ʻelua ʻaoʻao ʻo SMT PCB Assembly Circuit Board
Nā kikoʻī huahana
| Manaʻo ʻōlelo a me ka hana ʻana | ʻO Gerber File a i ʻole PCB File no ka hana ʻana i ka Papa PCB Bare |
| ʻO Bom (Bill of Material) no ka ʻAhahui, PNP (E koho a waiho i ka faila) a me ke kūlana o nā mea e pono ai i ka hui. | |
| No ka hōʻemi ʻana i ka manawa ʻōlelo, e ʻoluʻolu e hāʻawi mai iā mākou i ka helu ʻāpana piha no kēlā me kēia ʻāpana, ʻO ka nui o kēlā me kēia papa a me ka nui no nā kauoha. | |
| Ke alakaʻi hoʻāʻo a me ka hana hoʻāʻo ʻana e hōʻoia i ka maikaʻi a hiki i kahi kokoke i 0% scrap rate | |
| Nā lawelawe OEM/ODM/EMS | PCBA, hui PCB: SMT & PTH & BGA |
| PCBA a me ka hoʻolālā pā | |
| ʻO ke kūʻai ʻana a me ke kūʻai ʻana | |
| Ka hoʻopololei wikiwiki | |
| ʻO ka hoʻoheheʻe ʻia ʻana o ka plastik | |
| Pepa metala hehi | |
| Hui hope | |
| Ho'āʻo: AOI, Hoʻāʻo In-Circuit (ICT), Hoʻo Hana Hana (FCT) | |
| ʻO ka ʻae maʻamau no ka lawe ʻana mai i nā mea a me ka lawe ʻana aku i nā huahana |
ʻO kā mākou hana
1. Immersion gula kaʻina hana: ʻO ke kumu o ke kaʻina hana gula kaiapuni ʻo ia ka waiho ʻana i kahi uhi nickel-gula me ka waihoʻoluʻu paʻa, ʻālohilohi maikaʻi, ka uhi ʻana a me ka solderability maikaʻi ma ka ʻili o ka PCB, hiki ke hoʻokaʻawale ʻia i ʻehā mau pae: pretreatment ( Degreasing, micro-etching, activation, post-dipping), immersion nickel, immersion gula, post-treatment, (washing gula holoi, DI holoi, maloʻo).
2. Lead-sprayed tin: He haʻahaʻa ka mahana eutectic i loaʻa i ke kēpau ma mua o ka mea hao kepau ʻole.ʻO ka nui kiko'ī e pili ana i ka hoʻohuiʻana o ke kaula kepauʻole.No ka laʻana, ʻo ka eutectic o SNAGCU he 217 degere.ʻO ka mahana hoʻoheheʻe ʻia ka mahana eutectic me 30-50 degere, e pili ana i ka haku mele.ʻO ka hoʻoponopono maoli, ʻo ka eutectic alakaʻi he 183 degere.ʻOi aku ka ikaika o ka mīkini, ka ʻōlinolino, a pēlā aku.
3. Lead-free tin spraying: Lead e hoʻomaikaʻi i ka hana o ka uea tin i ke kaʻina hana kuʻi.ʻOi aku ka maʻalahi o ka hoʻohana ʻana i ka uea kepau ma mua o ka uea kepau-ʻole, akā he mea ʻawaʻawa ke kepau, a ʻaʻole maikaʻi i ke kino o ke kanaka ke hoʻohana ʻia no ka manawa lōʻihi.A ʻoi aku ka kiʻekiʻe o ka hoʻoheheʻe ʻana o ke kēpau ma mua o ke kēpau, no laila ʻoi aku ka ikaika o nā hui solder.
ʻO ke kaʻina hana o ka PCB ʻaoʻao ʻelua ʻaoʻao kaʻina hana hana
1. CNC wili
I mea e hoʻonui ai i ka nui o ka hui, e liʻiliʻi a liʻiliʻi nā puka ma ka papa kaapuni ʻaoʻao ʻelua o ka PCB.ʻO ka maʻamau, ua wili ʻia nā papa pcb ʻaoʻao ʻelua me nā mīkini wili CNC e hōʻoia i ka pololei.
2. Electroplating puka kaʻina
ʻO ke kaʻina hana i hoʻopaʻa ʻia, ʻike ʻia hoʻi ʻo ka puka metallized, he hana ia e uhi ʻia ai ka paia o ka puka holoʻokoʻa me ka metala i hiki ke hoʻopili ʻia nā ʻano conductive ma waena o nā papa o loko a me waho o ka papa kaapuni paʻi ʻelua ʻaoʻao.
3. Paʻi pale
Hoʻohana ʻia nā mea paʻi kūikawā no nā hiʻohiʻona kaapuni paʻi kiʻi, nā kumu hoʻohālike solder mask, nā hiʻohiʻona hōʻailona ʻano, etc.
4. Electroplating tin-lead alloy
Electroplating tin-lead alloys he ʻelua hana: ʻo ka mua, ma ke ʻano he pale pale anti-corrosion i ka wā electroplating a etching;ʻO ka lua, ma ke ʻano he mea hoʻopili solderable no ka papa i hoʻopau ʻia.Pono e ho'omalu pono i nā 'au'au 'au'au a me ke ka'ina hana 'ana i nā kinikini-lead alloys.ʻOi aku ka mānoanoa o ka papa hoʻoheheʻe ʻia ma mua o 8 microns, a ʻaʻole e emi ka paia o ka puka ma mua o 2.5 microns.
papa kaapuni pai
5. Kaʻi ʻana
I ka wā e hoʻohana ai i ka mea hoʻoheheʻe tin-lead ma ke ʻano he papa kūʻē e hana i kahi papa ʻaoʻao ʻelua me ke ʻano hana etching electroplating, ʻaʻole hiki ke hoʻohana ʻia kahi solution copper chloride etching acid a me ka solution ferric chloride etching no ka mea ua ʻino pū lākou i ka hui tin-lead.Ma ke kaʻina hana etching, ʻo ka "ʻaoʻao etching" a me ka uhi ʻana i nā mea e pili ana i ka etching: maikaʻi
(1) ʻAhaʻi ʻaoʻao.ʻO ka ʻeha ʻaoʻao ke ʻano o ka hāʻule ʻana a i ʻole ke pohō ʻana o nā kihi conductor i hoʻokumu ʻia e ka etching.ʻO ka nui o ka corrosion ʻaoʻao e pili ana i ka hoʻonā etching, nā mea hana a me nā kūlana kaʻina.ʻOi aku ka maikaʻi o ka ʻinoʻino o ka ʻaoʻao.
(2) Hoʻonui ʻia ka uhi.ʻO ka hoʻonuiʻiaʻana o ka uhiʻana ma muli o ka mānoanoa o ka uhiʻana, kahi e hoʻonui ai i ka laulā o kekahiʻaoʻao o ke kaula i ka laulā o ka papa lalo i hoʻopauʻia.
6. Ka uhi gula
ʻO ka hoʻoheheʻe gula maikaʻi loa ka conductivity uila, ka liʻiliʻi a paʻa i ke kūpaʻa pili a me ke kūpaʻa ʻaʻahu maikaʻi loa, a ʻo ia ka mea hoʻopalapala maikaʻi loa no nā puʻu papa kaapuni paʻi.I ka manawa like, loaʻa iā ia ke kūpaʻa kemika maikaʻi a me ka solderability, a hiki ke hoʻohana ʻia e like me ka corrosion-resistant, solderable a me ka pale pale ma luna o nā PCB mauna.
7. Hoʻoheheʻe wela a me ka ea wela
(1) hehee wela.ʻO ka pcb i uhi ʻia me ka Sn-Pb alloy ua wela a ma luna o ka helu heheʻe o ka hui Sn-Pb, i hana ʻia ʻo Sn-Pb a me Cu i mea metala, no laila ʻo ka Sn-Pb ka uhi ʻana he ʻeleʻele, ʻālohilohi a me ka pinhole ʻole, a ʻoi aku ka maikaʻi o ka pale ʻana i ka corrosion a me ka solderability o ka uhi.ka wahine.Hoʻohana maʻamau ka glycerol wela hoʻoheheʻe a me ka wela wela infrared.
(2) Hoʻopalike ea wela.ʻIke pū ʻia ʻo ia ʻo ka pipi ʻana, ʻo ka solder mask-coated paʻi kaapuni kaʻapuni ua pae ʻia me ka flux e ka ea wela, a laila komo i ka loko i hoʻoheheʻe ʻia, a laila hele ma waena o ʻelua mau pahi ea e puhi i ka solder keu aku e kiʻi i kahi kukui, ʻaʻahu, ʻoluʻolu. uhi kuʻina.ʻO ka maʻamau, mālama ʻia ka mahana o ka ʻauʻau solder ma 230 ~ 235, mālama ʻia ka mahana o ka pahi ea ma luna o 176, ʻo ka manawa kuʻi ʻana he 5 ~ 8s, a mālama ʻia ka mānoanoa o ka uhi ma 6 ~ 10 microns.
Papa Kaapuni Pai aoao elua
Inā ʻoki ʻia ka papa kaapuni ʻaoʻao ʻelua o ka PCB, ʻaʻole hiki ke hana hou ʻia, a e hoʻopili pololei kona ʻano hana i ka maikaʻi a me ke kumukūʻai o ka huahana hope.
Hōʻike Hale Hana
