PCBA ita ce takaitaccen majalissar da'irar da'irar da aka buga a Turanci, wato, hukumar PCB mara komai ta ratsa ta babban bangaren SMT, ko kuma dukkan tsarin toshewar DIP, wanda ake kira PCBA.Wannan hanya ce da aka fi amfani da ita a kasar Sin, yayin da daidaitattun hanyar a Turai da Amurka ita ce PCB'A, ƙara “'”, wanda ake kira da kalmar magana.
Fitar da keɓaɓɓen allo, wanda kuma aka sani da bugu, allon kewayawa, galibi yana amfani da gajarta ta Ingilishi PCB (Printed Circuit Board), wani muhimmin kayan lantarki ne, tallafi ga kayan lantarki, da kuma mai ba da haɗin haɗin keɓaɓɓiyar kayan lantarki.Domin ana yin ta ne ta amfani da dabarun bugu na lantarki, ana kiranta da allon kewayawa “bugu”.Kafin bayyanar allunan da'ira da aka buga, haɗin kai tsakanin kayan aikin lantarki ya dogara da haɗin kai tsaye na wayoyi don samar da cikakkiyar kewayawa.Yanzu, da'irar da'irar kawai tana kasancewa a matsayin kayan aikin gwaji mai inganci, kuma allon da'irar da aka buga ya zama babban matsayi a cikin masana'antar lantarki.A farkon karni na 20, don sauƙaƙa samar da injunan lantarki, da rage wayoyi tsakanin sassan lantarki, da rage tsadar kayan aiki, mutane sun fara nazarin hanyar maye gurbin wayar da bugu.A cikin shekaru 30 da suka gabata, injiniyoyi sun ci gaba da ba da shawarar ƙara ƙwararrun ƙwararrun ƙarfe a kan insulating substrates don wayoyi.Mafi nasara shine a cikin 1925, Charles Ducas na Amurka ya buga alamun da'ira akan insulating substrates, sa'an nan kuma ya samu nasarar kafa na'urorin da za su yi amfani da wayar ta hanyar lantarki.
Har zuwa 1936, ɗan Australiya Paul Eisler (Paul Eisler) ya buga fasahar fim ɗin foil a Burtaniya.Ya yi amfani da allon da'ira da aka buga a cikin na'urar rediyo;An yi nasarar yin amfani da takardar haƙƙin mallaka don hanyar busa da wayoyi (Patent No. 119384).Daga cikin biyun, hanyar Paul Eisler ta fi kama da allon da'ira na yau.Ana kiran wannan hanyar hanyar ragi, wato don cire ƙarfe mara amfani;yayin da hanyar Charles Ducas da Miyamoto Kinosuke shine ƙara kawai ƙarfe da ake buƙata.Ana kiran waya hanyar ƙari.Duk da haka, saboda kayan aikin lantarki a lokacin suna haifar da zafi mai yawa, abubuwan da ke cikin biyun suna da wahala a yi amfani da su tare, don haka ba a yi amfani da su a zahiri ba, amma kuma ya sanya fasahar da'ira da aka buga ta gaba.
Tarihi
A cikin 1941, Amurka ta yi fentin jan karfe akan talc don yin wayoyi don yin fis na kusanci.
A cikin 1943, Amurkawa sun yi amfani da wannan fasaha sosai a gidajen rediyon soja.
A cikin 1947, an fara amfani da resin epoxy a matsayin masana'anta.A lokaci guda kuma, NBS ta fara nazarin fasahohin kera kamar su coils, capacitors, da resistors da aka kirkira ta hanyar fasahar kewayawa.
A cikin 1948, Amurka a hukumance ta amince da ƙirƙira don amfanin kasuwanci.
Tun daga shekarun 1950, transistor tare da ƙananan samar da zafi sun maye gurbin bututun injin, kuma fasahar hukumar da'ira ta fara amfani da ita sosai.A wancan lokacin, fasahar etching foil ita ce abin da ya fi dacewa.
A cikin 1950, Japan ta yi amfani da fenti na azurfa don yin waya a kan gilashin gilashi;da foil na jan karfe don yin wayoyi akan takarda phenolic substrates (CCL) da aka yi da guduro phenolic.
A cikin 1951, bayyanar polyimide ya sa juriya na zafi na guduro ya ci gaba da tafiya, kuma an yi amfani da kayan aikin polyimide.
A cikin 1953, Motorola ya ɓullo da hanyar rami mai gefe biyu.Hakanan ana amfani da wannan hanyar a kan allunan da'ira mai yawa daga baya.
A cikin shekarun 1960, bayan da aka yi amfani da allon da'ira da aka buga sosai tsawon shekaru 10, fasaharta ta kara girma.Tun da allon fuska biyu na Motorola ya fito, allunan da'irar da'irar da aka buga ta multilayer sun fara bayyana, wanda ya ƙaru da rabon wayoyi zuwa yanki.
A cikin 1960, V. Dahlgreen ya yi katako mai sassauƙa da aka buga ta manna fim ɗin ƙarfe na ƙarfe da aka buga tare da kewayawa a cikin filastik thermoplastic.
A cikin 1961, Kamfanin Hazeltine na Amurka ya yi magana game da hanyar yin amfani da wutar lantarki ta hanyar rami don samar da alluna masu yawa.
A cikin 1967, an buga "fasahar da aka yi amfani da shi", ɗaya daga cikin hanyoyin gini na Layer.
A cikin 1969, FD-R ya ƙera kwalayen da'ira mai sassauƙa tare da polyimide.
A cikin 1979, Pactel ta buga "Hanyar Pactel", ɗayan hanyoyin ƙara Layer.
A cikin 1984, NTT ta ɓullo da "Hanyoyin Copper Polyimide" don da'irori na bakin ciki.
A cikin 1988, Siemens ya haɓaka allon da'ira da aka buga ta Microwiring Substrate.
A cikin 1990, IBM ya haɓaka allon da'ira mai bugawa mai suna "Surface Laminar Circuit" (Surface Laminar Circuit, SLC).
A cikin 1995, Matsushita Electric ya haɓaka allon da'irar bugu na ALIVH.
A cikin 1996, Toshiba ya haɓaka allon da'ira na B2it.
Lokacin aikawa: Fabrairu-24-2023