Ana iya raba tsarin masana'antar hukumar PCB zuwa matakai goma sha biyu masu zuwa.Kowane tsari yana buƙatar nau'ikan masana'anta na tsari.Ya kamata a lura cewa tsarin tafiyar matakai na allon tare da sassa daban-daban ya bambanta.Tsarin da ke gaba shine cikakken samar da PCB mai yawan Layer.kwararar tsari;
Na farko.Layer na ciki;yafi don yin da'ira na ciki Layer na PCB kewaye allon;tsarin samarwa shine:
1. Yankan jirgin: yankan da PCB substrate cikin samar size;
2. Pre-jiyya: tsaftace saman na PCB substrate da kuma cire surface pollutants
3. Laminating fim: manna da bushe fim a kan surface na PCB substrate shirya domin m image canja wuri;
4. Bayyanawa: Yi amfani da kayan aiki mai ban sha'awa don nuna fim ɗin da aka haɗa da fim tare da hasken ultraviolet, don canja wurin hoton hoton zuwa fim ɗin busassun;
5. DE: An ƙaddamar da substrate bayan fallasa, an cire shi, kuma an cire fim ɗin, sa'an nan kuma an gama samar da katako na ciki.
Na biyu.Binciken ciki;musamman don gwaji da kuma gyara da'irori na hukumar;
1. AOI: Binciken gani na AOI, wanda zai iya kwatanta hoton allon PCB tare da bayanan samfurin samfurin da aka shigar, don gano rarrabuwa, damuwa da sauran mummunan al'amura a kan hoton allo;
2. VRS: Mummunan bayanan hoton da AOI ya gano za a aika zuwa VRS don gyarawa ta ma'aikatan da suka dace.
3. Ƙarin waya: Sayar da wayar zinare akan ratar ko damuwa don hana gazawar lantarki;
Na uku.Latsawa;kamar yadda sunan ke nunawa, ana danna allunan ciki da yawa a cikin allo ɗaya;
1. Browning: Browning na iya ƙara mannewa tsakanin allo da guduro, da kuma ƙara wettability na jan karfe;
2. Riveting: Yanke PP a cikin ƙananan zanen gado da girman al'ada don sanya allon ciki da PP daidai.
3. Haɗewa da dannawa, harbi, gong edging, edging;
Na hudu.Hakowa: bisa ga bukatun abokin ciniki, yi amfani da injin hakowa don haƙa ramuka tare da diamita daban-daban da girma dabam a kan allo, ta yadda za a iya amfani da ramukan da ke tsakanin allunan don sarrafa abubuwan toshewa na gaba, kuma yana iya taimakawa hukumar ta tarwatse. zafi;
Na biyar, tagulla na farko;plating tagulla don ramukan da aka haƙa na katako na waje, ta yadda za a gudanar da layin kowane Layer na allon;
1. Deburring line: cire burrs a kan gefen ramin allo don hana matalauta tagulla plating;
2. layin cire manne: cire ragowar manne a cikin rami;don ƙara mannewa a lokacin micro-etching;
3. Tagulla ɗaya (pth): Rukunin jan ƙarfe a cikin rami yana yin kewaya kowane Layer na jigilar allo, kuma a lokaci guda yana ƙara kauri na tagulla;
Na shida, Layer na waje;Layer na waje ya yi kusan daidai da tsarin Layer na ciki na mataki na farko, kuma manufarsa ita ce sauƙaƙe tsarin bibiya don yin da'ira;
1. Pre-jiyya: Tsaftace saman allon ta hanyar pickling, gogewa da bushewa don ƙara mannewar busassun fim ɗin;
2. Laminating fim: manna da bushe fim a kan surface na PCB substrate shirya domin m image canja wuri;
3. Bayyanawa: haskakawa tare da hasken UV don yin fim ɗin busassun a kan jirgi ya zama yanayin polymerized da unpolymerized;
4. Ci gaba: narkar da fim din busassun da ba a yi amfani da shi ba a lokacin da ake nunawa, barin rata;
Na bakwai, tagulla na biyu da etching;na biyu tagulla plating, etching;
1. Na biyu jan karfe: Electroplating juna, giciye sinadaran jan karfe ga wurin da ba a rufe da bushe fim a cikin rami;a lokaci guda kuma, ƙara haɓaka ƙarfin aiki da kauri na tagulla, sannan a bi ta hanyar plating ɗin tin don kare amincin kewayawa da ramuka yayin etching;
2. SES: Etch da kasa jan karfe a cikin abin da aka makala yankin na waje Layer bushe fim (rigar film) ta matakai kamar fim cire, etching, da kwano tsiri, da kuma waje Layer kewaye da aka kammala yanzu;
Na takwas, juriya na solder: yana iya kare allo kuma ya hana iskar shaka da sauran abubuwan mamaki;
1. Pretreatment: pickling, ultrasonic wanka da sauran matakai don cire oxides a kan jirgin da kuma ƙara da roughness na jan karfe surface;
2. Buga: Rufe sassan allon PCB waɗanda ba sa buƙatar siyar da tawada mai juriya don taka rawar kariya da rufi;
3. Pre-baking: bushewa da sauran ƙarfi a cikin solder tsayayya tawada, kuma a lokaci guda hardening tawada don daukan hotuna;
4. Exposure: Curing da solder tsayayya tawada ta UV haske sakawa a iska mai guba, da kuma kafa wani babban kwayoyin polymer ta hanyar photopolymerization;
5. Ci gaba: cire maganin sodium carbonate a cikin tawada marar amfani;
6. Bayan yin burodi: don cika taurin tawada;
Na tara, rubutu;bugu rubutu;
1. Pickling: Tsaftace saman allon, cire iskar shaka don ƙarfafa mannewa na tawada bugu;
2. Rubutu: rubutun da aka buga, dacewa don tsarin walda na gaba;
Na goma, saman jiyya OSP;gefen farantin tagulla mara kyau da za a yi wa walda an lulluɓe shi don samar da fim ɗin halitta don hana tsatsa da oxidation;
Na sha ɗaya, kafa;an samar da siffar allon da abokin ciniki ke buƙata, wanda ya dace da abokin ciniki don aiwatar da wurin SMT da taro;
Na goma sha biyu, gwajin bincike na tashi;gwada da'irar allon don guje wa fita daga cikin guntun kewayawa;
Na goma sha uku, FQC;dubawa na ƙarshe, samfuri da cikakken dubawa bayan kammala duk matakai;
Na sha huɗu, marufi da fita daga cikin sito;vacuum-pack the gama PCB board, pack and ship, and complete delivery;
Lokacin aikawa: Afrilu-24-2023